ATE - 3-D IC Test - Design for Test Tools Address Stacked Dies (English)
- New search for: Nelson, Rick
- New search for: Nelson, Rick
In:
Evaluation engineering
;
51
, 11
; 28-32
;
2012
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ISSN:
- Article (Journal) / Print
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Title:ATE - 3-D IC Test - Design for Test Tools Address Stacked Dies
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Contributors:Nelson, Rick ( author )
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Published in:Evaluation engineering ; 51, 11 ; 28-32
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Place of publication:Chicago, Ill.
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Publication date:2012
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 53.15 / 53.15
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- New search for: 770/4600
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Classification:
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Source:
Table of contents – Volume 51, Issue 11
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 4
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Editorial| 2012
- 6
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EE Industry Update| 2012
- 8
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INSTRUMENTATION - Power Supplies/Loads - Power Grid Energy Storage TestingBlume, Peter et al. | 2012
- 12
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COMMUNICATIONS TEST - SPECIAL REPORT - Spectrum Analyzers - Converging Functionality Boosts Signal AnalysisNelson, Rick et al. | 2012
- 18
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Mobile Engineering Apps - Tablets and Phones Augment Test and SimulationNelson, Rick et al. | 2012
- 22
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DMMs - Handheld DMM Features CountLecklider, Tom et al. | 2012
- 28
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ATE - 3-D IC Test - Design for Test Tools Address Stacked DiesNelson, Rick et al. | 2012
- 32
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EE Product Picks| 2012
- 35
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Index of Advertisers| 2012
- 36
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50 Years of Test Technology - DAQ and the PC EraLecklider, Tom et al. | 2012