Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps (Unknown)
- New search for: Lee, Chang-Chun
- New search for: Lee, Chang-Chun
- New search for: Lin, Po Ting
In:
Journal of electronic packaging
;
136
, 3
; 31006-31006
;
2014
-
ISSN:
- Article (Journal) / Print
-
Title:Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
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Contributors:Lee, Chang-Chun ( author ) / Lin, Po Ting
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Published in:Journal of electronic packaging ; 136, 3 ; 31006-31006
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Publisher:
- New search for: ASME
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Place of publication:New York, NY
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Publication date:2014
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ISSN:
-
ZDBID:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:Unknown
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
- New search for: 770/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 136, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 30201
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Reviewer Acknowledgment for the Journal of Electronic Packaging| 2014
- 030201
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Letter From the EditorsSammakia, B.G. / Lee, Y.C. et al. | 2014
- 31001
-
High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without FluxWang, Fuliang et al. | 2014
- 31002
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HDPE Matrix Composites Filled With Ca4La6(SiO4)4(PO4)2O2 for Microwave Substrate ApplicationsThomas, Dhanesh et al. | 2014
- 31003
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Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating PlateAlawadhi, Esam M. et al. | 2014
- 31004
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Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker GrowthMahan, Kenny et al. | 2014
- 31005
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Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature MeasurementsSalih Erden, Hamza et al. | 2014
- 31006
-
Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg MicrobumpsLee, Chang-Chun et al. | 2014
- 31007
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Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection MethodsKang, Sungbum et al. | 2014
- 31008
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Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array ComponentsGiron-Palomares, Benjamin et al. | 2014
- 31009
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Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic CoolingHao, Xiaohong et al. | 2014
- 31010
-
A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling SystemsGholami, A. et al. | 2014
- 31011
-
Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped CavitiesLorenzini, Giulio et al. | 2014
- 31012
-
Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip CoolingPramod, K. et al. | 2014
- 31013
-
Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number RegimeXie, Gongnan et al. | 2014
- 31014
-
Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of MicroprocessorSahu, Vivek et al. | 2014
- 031015
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Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic BondingLiu, Q. / Du, L. / Zhao, Z. / Liu, C. / Fang, Z. et al. | 2014
- 34501
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A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5Liu, Dapeng et al. | 2014
- 34502
-
Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat SinkShanmugan, S. et al. | 2014