Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study (English)
- New search for: Siow, K. S
- New search for: Siow, K. S
- New search for: Lin, Y. T
In:
Journal of electronic packaging
;
138
, 2
;
2016
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ISSN:
- Article (Journal) / Print
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Title:Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
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Contributors:Siow, K. S ( author ) / Lin, Y. T
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Published in:Journal of electronic packaging ; 138, 2
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Publisher:
- New search for: ASME
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Place of publication:New York, NY
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Publication date:2016
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
- New search for: 770/5670
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Keywords:
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Source:
Table of contents – Volume 138, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 20801
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Stretchable Thin Film Materials: Fabrication, Application, and MechanicsWang, Yu et al. | 2016
- 20802
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Decomposable and Template Polymers: Fundamentals and ApplicationsUzunlar, Erdal et al. | 2016
- 20803
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Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and PerspectivesXie, Bin et al. | 2016
- 20804
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Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape StudySiow, K. S et al. | 2016
- 21003
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Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes PackagingShang, Bofeng et al. | 2016
- 21004
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Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal SimulationsBaris Dogruoz, M et al. | 2016
- 21005
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Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial ChannelsSchultz, Mark et al. | 2016
- 21006
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Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution AnalysisXiao, Yanyi et al. | 2016
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Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear JointTan, Yansong et al. | 2016
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A Study on Electrical Reliability Criterion on Through Silicon Via PackagingLwo, Ben-Je et al. | 2016
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Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal CyclingHamasha, Sa'd et al. | 2016