Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue (English)
- New search for: Yi, Seol-Min
- New search for: Choi, In-Suk
- New search for: Kim, Byoung-Joon
- New search for: Joo, Young-Chang
- New search for: Yi, Seol-Min
- New search for: Choi, In-Suk
- New search for: Kim, Byoung-Joon
- New search for: Joo, Young-Chang
In:
Electronic materials letters
;
14
, 4
; 387-404
;
2018
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ISSN:
- Article (Journal) / Print
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Title:Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue
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Contributors:Yi, Seol-Min ( author ) / Choi, In-Suk ( author ) / Kim, Byoung-Joon ( author ) / Joo, Young-Chang ( author )
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Published in:Electronic materials letters ; 14, 4 ; 387-404
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Publisher:
- New search for: Springer
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Place of publication:[S.l.]
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Publication date:2018
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 53.09 / 53.09
- Further information on Basic classification
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Keywords:
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Classification:
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Source:
Table of contents – Volume 14, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 387
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Reliability Issues and Solutions in Flexible Electronics Under Mechanical FatigueYi, Seol-Min / Choi, In-Suk / Kim, Byoung-Joon / Joo, Young-Chang et al. | 2018
- 405
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n-Type Conductivity of $ Cu_{2} $O Thin Film Prepared in Basic Aqueous Solution Under Hydrothermal ConditionsUrsu, Daniel / Miclau, Nicolae / Miclau, Marinela et al. | 2018
- 413
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The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic ConductorsBournias-Varotsis, Alkaios / Wang, Shanda / Hutt, David / Engstrøm, Daniel S. et al. | 2018
- 426
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Thermomechanical In Situ Monitoring of $ Bi_{2} %$ Te_{3} $ Thin Film and Its Relationship with Microstructure and Thermoelectric PerformancesJeong, Min-Woo / Na, Sekwon / Shin, Haishan / Park, Hong-Bum / Lee, Hoo-Jeong / Joo, Young-Chang et al. | 2018
- 432
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Enhanced Electrochemical Activity and Chromium Tolerance of the Nucleation-Agent-Free $ La_{2} %$ Ni_{0.9} %$ Fe_{0.1} %$ O_{4+δ} $ Cathode by $ Gd_{0.1} %$ Ce_{0.9} %$ O_{1.95} $ IncorporationLing, Yihan / Xie, Huixin / Liu, Zijing / Du, Xiaoni / Chen, Hui / Ou, Xuemei / Zhao, Ling / Budiman, Riyan Achmad et al. | 2018
- 440
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Energy Storage of Polyarylene Ether Nitriles at High TemperatureTang, Xiaohe / You, Yong / Mao, Hua / Li, Kui / Wei, Renbo / Liu, Xiaobo et al. | 2018
- 446
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Nanostructured $ KTaTeO_{6} $ and Ag-doped $ KTaTeO_{6} $ Defect Pyrochlores: Promising Photocatalysts for Dye Degradation and Water SplittingVenkataswamy, Perala / Sudhakar Reddy, CH. / Gundeboina, Ravi / Sadanandam, Gullapelli / Veldurthi, Naveen Kumar / Vithal, M. et al. | 2018
- 461
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Fast Pulling of n-Type Si Ingots for Enhanced Si Solar Cell ProductionKim, Kwanghun / Park, Sanghyun / Park, Jaechang / Pang, Ilsun / Ryu, Sangwoo / Oh, Jihun et al. | 2018
- 467
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Fabrication and Characterization of Vertically Aligned ZnO Nanorod Arrays via Inverted Monolayer Colloidal Crystals MaskChen, Cheng / Ding, Taotao / Qi, Zhiqiang / Zhang, Wei / Zhang, Jun / Xu, Juan / Chen, Jingwen / Dai, Jiangnan / Chen, Changqing et al. | 2018
- 474
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Template-Free Hydrothermal Synthesis, Mechanism, and Photocatalytic Properties of Core–Shell $ CeO_{2} $ NanospheresLi, Huijie / Meng, Fanming / Gong, Jinfeng / Fan, Zhenghua / Qin, Rui et al. | 2018
- 488
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The Effect of Low Energy Nitrogen Ion Implantation on Graphene NanosheetsMishra, Mukesh / Alwarappan, Subbiah / Kanjilal, Dinakar / Mohanty, Tanuja et al. | 2018
- 499
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Facile Synthesis of 1D/2D Core–Shell Structured $ Sb_{2} %$ S_{3} $@$ MoS_{2} $ Nanorods with Enhanced Photocatalytic PerformanceXu, Meilan / Zhao, Jiachang et al. | 2018
- 505
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Controlling the Optical and Magnetic Properties of Nanostructured Cuprous Oxide Synthesized from Waste Electric CablesAbdelbasir, S. M. / El-Sheikh, S. M. / Rashad, M. M. / Rayan, D. A. et al. | 2018
- 517
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Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension TestMsolli, Sabeur / Kim, Heung Soo et al. | 2018
- 526
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Effects of Sn Layer Orientation on the Evolution of Cu/Sn InterfacesSun, Menglong / Zhao, Zhangjian / Hu, Fengtian / Hu, Anmin / Li, Ming / Ling, Huiqin / Hang, Tao et al. | 2018