The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer (English)
- New search for: Malinowski, Pawel
- New search for: Wandowski, Tomasz
- New search for: Ostachowicz, Wieslaw
- New search for: Malinowski, Pawel
- New search for: Wandowski, Tomasz
- New search for: Ostachowicz, Wieslaw
In:
Structural Health Monitoring
;
14
, 4
;
332-344
;
2015
- Article (Journal) / Electronic Resource
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Title:The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer
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Contributors:
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Published in:Structural Health Monitoring ; 14, 4 ; 332-344
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Publisher:
- New search for: SAGE Publications
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Publication date:2015-07-01
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Size:13 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 14, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 317
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Experimental validation of a drive-by stiffness identification method for bridge monitoringMcGetrick, Patrick J / Kim, Chul-Woo / González, Arturo / Brien, Eugene J O et al. | 2015
- 332
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The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymerMalinowski, Pawel / Wandowski, Tomasz / Ostachowicz, Wieslaw et al. | 2015
- 345
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Multipath ultrasonic guided wave imaging in complex structuresHall, James S / Michaels, Jennifer E et al. | 2015
- 359
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A vibration model residual-based sequential probability ratio test framework for structural health monitoringKopsaftopoulos, Fotis P / Fassois, Spilios D et al. | 2015