High aspect ratio silicon trench fabrication by inductively coupled plasma (English)
National licence
- New search for: Chung, C. K.
- New search for: Lu, H. C.
- New search for: Jaw, T. H.
- New search for: Chung, C. K.
- New search for: Lu, H. C.
- New search for: Jaw, T. H.
In:
Microsystem Technologies
;
6
, 3
;
106-108
;
2000
- Article (Journal) / Electronic Resource
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Title:High aspect ratio silicon trench fabrication by inductively coupled plasma
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Contributors:
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Published in:Microsystem Technologies ; 6, 3 ; 106-108
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Publisher:
- New search for: Springer-Verlag
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Place of publication:Berlin/Heidelberg
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Publication date:2000-02-01
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Size:3 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 6, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 77
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Manufacturing technologies for miniaturized interference filtersFrank, M. / Kaiser, N. et al. | 2000
- 82
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Proton micromachining: a new technique for the production of three-dimensional microstructuresvan Kan, J.A. / Sanchez, J. L. / Osipowicz, T. / Watt, F. et al. | 2000
- 86
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Improvement of sidewall roughness in deep silicon etchingChabloz, M. / Sakai, Y. / Matsuura, T. / Tsutsumi, K. et al. | 2000
- 90
-
Development of new position sensitive electron multiplication device fabricated by LIGA processInoue, M. / Fukuda, D. / Takahashi, H. / Nakazawa, M. / Kawarabayashi, J. / Hirata, Y. / Numazawa, T. / Haga, T. et al. | 2000
- 94
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Fabrication of HARM structures by deep-X-ray lithography using graphite mask technologyCoane, P. / Giasolli, R. / Ledger, S. / Lian, K. / Ling, Z. / Göttert, J. et al. | 2000
- 99
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The influence of mask substrate thickness on exposure and development times for the LIGA processGriffiths, S. K. / Ting, A. / Hruby, J. M. et al. | 2000
- 103
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Direct, high throughput LIGA for commercial applications: a progress reportGuckel, H. / Fischer, K. / Stiers, E. / Chaudhuri, B. / McNamara, S. / Ramotowski, M. / Johnson, E. D. / Kirk, C. et al. | 2000
- 106
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High aspect ratio silicon trench fabrication by inductively coupled plasmaChung, C. K. / Lu, H. C. / Jaw, T. H. et al. | 2000
- 109
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TRANSTEC – A new tool for online educational multimedia training on innovative high aspect ratio microtechnologiesSchmidt, A. / Brück, R. / Hahn, K. / Labeque, A. / Popovic, G. / Ohler, M. / Riedel, H. / Rizvi, N. / Stange, T. et al. | 2000
- 113
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ANKA – a synchrotron light source for X-ray based micromachiningGöttert, J. / Moser, H. O. / Pantenburg, F. J. / Saile, V. / Steininger, R. et al. | 2000
- 117
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Large area, cost effective X-ray masks for high energy photonsFischer, K. / Chaudhuri, B. / Stiers, E. / Guckel, H. et al. | 2000