High speed gold plating of integrated circuits (English)
Free access
In:
Gold Bulletin
;
7
, 4
;
107
;
1974
- Article (Journal) / Electronic Resource
-
Title:High speed gold plating of integrated circuits
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Published in:Gold Bulletin ; 7, 4 ; 107
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Publisher:
- New search for: Springer-Verlag
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Place of publication:Berlin/Heidelberg
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Publication date:1974-12-01
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Size:1 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 7, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 90
-
Gold in semiconductor technologyDavis, G. L. et al. | 1974
- 97
-
Gold bursting discs for the protection of chemical plantPhilpott, J. E. et al. | 1974
- 100
-
A new type of gold catalystFigar, Jan / Haidinger, Walter et al. | 1974
- 102
-
A rhenium-gold petroleum reforming catalyst| 1974
- 104
-
Problems in the industrial use of electrodeposited alloy goldsMason, D. R. et al. | 1974
- 106
-
Productivity in gold mining technologyRapson, W. S. et al. | 1974
- 107
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High speed gold plating of integrated circuits| 1974
- 108
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Wear resistance of gold alloys for coinageChaston, J. C. et al. | 1974
- 112
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What things may be gilded and laid on with silver or gold, and what not| 1974