Fundamentals of Advanced Materials and Processes in Organic Substrate Technology (English)
- New search for: Shi, Songhua
- New search for: Tortorici, Peter
- New search for: Vadlamani, Sai
- New search for: Chatterjee, Prithwish
- New search for: Li, Yan
- New search for: Goyal, Deepak
- New search for: Shi, Songhua
- New search for: Tortorici, Peter
- New search for: Vadlamani, Sai
- New search for: Chatterjee, Prithwish
In:
3D Microelectronic Packaging
: From Architectures to Applications
;
Chapter: 14
;
397-429
;
2020
- Article/Chapter (Book) / Electronic Resource
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Title:Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
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Additional title:Spr. Ser. Microelectronics
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Contributors:Li, Yan ( editor ) / Goyal, Deepak ( editor ) / Shi, Songhua ( author ) / Tortorici, Peter ( author ) / Vadlamani, Sai ( author ) / Chatterjee, Prithwish ( author )
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Published in:3D Microelectronic Packaging : From Architectures to Applications ; Chapter: 14 ; 397-429Springer Series in Advanced Microelectronics ; 64 ; 397-429
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Publisher:
- New search for: Springer Singapore
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Place of publication:Singapore
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Publication date:2020-11-24
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Size:33 pages
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ISBN:
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ISSN:
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DOI:
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Type of media:Article/Chapter (Book)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents eBook
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Introduction to 3D Microelectronic PackagingLi, Yan / Goyal, Deepak et al. | 2020
- 2
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3D Packaging Architectures and Assembly Process DesignMahajan, Ravi / Sankman, Bob et al. | 2020
- 3
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Materials and Processing of TSVKumar, Praveen / Dutta, Indranath / Huang, Zhiheng / Conway, Paul et al. | 2020
- 4
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Microstructure and Mechanical Reliability Issues of TSVKumar, Praveen / Lee, Tae-Kyu / Dutta, Indranath / Huang, Zhiheng / Conway, Paul et al. | 2020
- 5
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Phase-Field-Crystal Model: A Tool for Probing Atoms in TSVLiu, Jinxin / Huang, Zhiheng / Conway, Paul / Liu, Yang et al. | 2020
- 6
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Atomic Scale Kinetics of TSV ProtrusionLiu, Jinxin / Huang, Zhiheng / Conway, Paul / Liu, Yang et al. | 2020
- 7
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Fundamentals and Failures in Die Preparation for 3D PackagingMa, Huan / Shi, Hualiang / Poonjolai, Erasenthiran et al. | 2020
- 8
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Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D PackagingSuga, Tadatomo / He, Ran / Vakanas, George / La Manna, Antonio et al. | 2020
- 9
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Copper Micro and Nano Particles Mixture for 3D Interconnection ApplicationDai, Yuanyuan / Tan, Chuan Seng et al. | 2020
- 10
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Fundamentals of Bonding Technology and Process Materials for 2.5/3D PackagesLee, Sangil et al. | 2020
- 11
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Fundamentals of Solder Alloys in 3D PackagingLin, Kwang-Lung et al. | 2020
- 12
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Fundamentals of Electromigration in Interconnects of 3D PackagingLiu, Pilin et al. | 2020
- 13
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Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware DesignKandlikar, Satish G. / Ganguly, Amlan et al. | 2020
- 14
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Fundamentals of Advanced Materials and Processes in Organic Substrate TechnologyShi, Songhua / Tortorici, Peter / Vadlamani, Sai / Chatterjee, Prithwish et al. | 2020
- 15
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Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and CharacterizationChen, Liangbiao / Jiang, Tengfei / Fan, Xuejun et al. | 2020
- 16
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Processing and Reliability of Solder Interconnections in Stacked PackagingVianco, Paul / Neilsen, Mike et al. | 2020
- 17
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Interconnect Quality and Reliability of 3D PackagingWang, Yaodong / Liu, Yingxia / Li, Menglu / Tu, K. N. / Xu, Luhua et al. | 2020
- 18
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Fault Isolation and Failure Analysis of 3D PackagingLi, Yan / Goyal, Deepak et al. | 2020