Three-dimensional curvy electronics created using conformal additive stamp printing (English)
- New search for: Sim, Kyoseung
- New search for: Chen, Song
- New search for: Li, Zhengwei
- New search for: Rao, Zhoulyu
- New search for: Liu, Jingshen
- New search for: Lu, Yuntao
- New search for: Jang, Seonmin
- New search for: Ershad, Faheem
- New search for: Chen, Ji
- New search for: Xiao, Jianliang
- New search for: Yu, Cunjiang
- New search for: Sim, Kyoseung
- New search for: Chen, Song
- New search for: Li, Zhengwei
- New search for: Rao, Zhoulyu
- New search for: Liu, Jingshen
- New search for: Lu, Yuntao
- New search for: Jang, Seonmin
- New search for: Ershad, Faheem
- New search for: Chen, Ji
- New search for: Xiao, Jianliang
- New search for: Yu, Cunjiang
In:
Nature Electronics
;
2
, 10
;
471-479
;
2019
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Three-dimensional curvy electronics created using conformal additive stamp printing
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Contributors:Sim, Kyoseung ( author ) / Chen, Song ( author ) / Li, Zhengwei ( author ) / Rao, Zhoulyu ( author ) / Liu, Jingshen ( author ) / Lu, Yuntao ( author ) / Jang, Seonmin ( author ) / Ershad, Faheem ( author ) / Chen, Ji ( author ) / Xiao, Jianliang ( author )
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Published in:Nature Electronics ; 2, 10 ; 471-479
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Publisher:
- New search for: Nature Publishing Group UK
-
Place of publication:London
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Publication date:2019-09-23
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Size:9 pages
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ISSN:
-
DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 2, Issue 10
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 429
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Chips under the microscope| 2019
- 430
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Unfolding electrodes for retinal implantsParker, Matthew et al. | 2019
- 431
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Optical lace gives robots a light touchLee, Michael et al. | 2019
- 432
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Vital signs monitoring goes into the cloudVarnava, Christiana et al. | 2019
- 433
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Hybrid superconductor–semiconductor electronicsFrasca, Simone / Charbon, Edoardo et al. | 2019
- 435
-
Multiscale 3D X-ray imagingKline, R. Joseph et al. | 2019
- 437
-
Efficient reservoir computing with memristorsMarinella, Matthew J. / Agarwal, Sapan et al. | 2019
- 439
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Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devicesKum, Hyun / Lee, Doeon / Kong, Wei / Kim, Hyunseok / Park, Yongmo / Kim, Yunjo / Baek, Yongmin / Bae, Sang-Hoon / Lee, Kyusang / Kim, Jeehwan et al. | 2019
- 451
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A superconducting thermal switch with ultrahigh impedance for interfacing superconductors to semiconductorsMcCaughan, A. N. / Verma, V. B. / Buckley, S. M. / Allmaras, J. P. / Kozorezov, A. G. / Tait, A. N. / Nam, S. W. / Shainline, J. M. et al. | 2019
- 457
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Micromagnetometry of two-dimensional ferromagnetsKim, M. / Kumaravadivel, P. / Birkbeck, J. / Kuang, W. / Xu, S. G. / Hopkinson, D. G. / Knolle, J. / McClarty, P. A. / Berdyugin, A. I. / Ben Shalom, M. et al. | 2019
- 464
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Three-dimensional imaging of integrated circuits with macro- to nanoscale zoomHoller, Mirko / Odstrcil, Michal / Guizar-Sicairos, Manuel / Lebugle, Maxime / Müller, Elisabeth / Finizio, Simone / Tinti, Gemma / David, Christian / Zusman, Joshua / Unglaub, Walter et al. | 2019
- 471
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Three-dimensional curvy electronics created using conformal additive stamp printingSim, Kyoseung / Chen, Song / Li, Zhengwei / Rao, Zhoulyu / Liu, Jingshen / Lu, Yuntao / Jang, Seonmin / Ershad, Faheem / Chen, Ji / Xiao, Jianliang et al. | 2019
- 480
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Temporal data classification and forecasting using a memristor-based reservoir computing systemMoon, John / Ma, Wen / Shin, Jong Hoon / Cai, Fuxi / Du, Chao / Lee, Seung Hwan / Lu, Wei D. et al. | 2019