Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package (English)
- New search for: Jee, Y. K.
- New search for: Yu, J.
- New search for: Park, K. W.
- New search for: Oh, T. S.
- New search for: Jee, Y. K.
- New search for: Yu, J.
- New search for: Park, K. W.
- New search for: Oh, T. S.
In:
Journal of Electronic Materials
;
38
, 5
;
685-690
;
2009
- Article (Journal) / Electronic Resource
-
Title:Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
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Contributors:
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Published in:Journal of Electronic Materials ; 38, 5 ; 685-690
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Publisher:
- New search for: Springer US
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Place of publication:Boston
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Publication date:2009-01-13
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Size:6 pages
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ISSN:
-
DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 38, Issue 5
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 623
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The Potential of the Perturbed Angular Correlation Technique in Characterizing SemiconductorsDogra, Rakesh / Byrne, A.P. / Ridgway, M.C. et al. | 2009
- 635
-
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of $ SiCl_{4} $/$ Cl_{2} $/Ar-Based Inductively Coupled Plasma Dry EtchingDylewicz, R. / Patela, S. / Hogg, R. A. / Fry, P. W. / Parbrook, P. J. / Airey, R. / Tahraoui, A. et al. | 2009
- 640
-
Evolution of Luminescence from Doped Gallium Phosphide over 40 YearsPyshkin, Sergei / Ballato, John / Bass, Michael / Turri, Giorgio et al. | 2009
- 647
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In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a MetalLum, I. / Hang, C. J. / Mayer, M. / Zhou, Y. et al. | 2009
- 655
-
Peltier Effect on Sn/Co Interfacial ReactionsWang, Chao-hong / Chen, Sinn-wen et al. | 2009
- 663
-
Lead-Free Bumping Using an Alternating Electromagnetic FieldXu, Hongbo / Li, Mingyu / Chen, Hongtao / Fu, Yonggao / Wang, Ling et al. | 2009
- 670
-
Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder AlloysHidaka, N. / Watanabe, H. / Yoshiba, M. et al. | 2009
- 678
-
Thermomechanical Stress and Strain in Solder Joints During ElectromigrationZhang, J.S. / Xi, H.J. / Wu, Y.P. / Wu, F.S. et al. | 2009
- 685
-
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-PackageJee, Y. K. / Yu, J. / Park, K. W. / Oh, T. S. et al. | 2009
- 691
-
Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and $ Na_{2} $$ SO_{4} $ SolutionsJung, Ja-Young / Lee, Shin-Bok / Lee, Ho-Young / Joo, Young-Chang / Park, Young-Bae et al. | 2009
- 700
-
Interdiffusion and Growth of the Superconductor $ Nb_{3} $Sn in Nb/Cu(Sn) Diffusion CouplesKumar, A.K. / Paul, A. et al. | 2009
- 706
-
High-Temperature Capacitor Materials Based on Modified $ BaTiO_{3} $Yuan, Y. / Zhang, S.R. / Zhou, X.H. / Tang, B. / Li, B. et al. | 2009
- 711
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Microwave Dielectric Properties of ZnO-$ 2TiO_{2} $-$ Nb_{2} $$ O_{5} $ Ceramics with BaCu ($ B_{2} $$ O_{5} $) AdditionZhou, Huanfu / Wang, Hong / Li, Kecheng / Yang, Haibo / Zhang, Minghui / Yao, Xi et al. | 2009