Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: I. Organosolv lignin modified resins (English)
- New search for: Cetin, N.S.
- New search for: Ozmen, N.
- New search for: Cetin, N.S.
- New search for: Ozmen, N.
In:
International Journal of Adhesion and Adhesives
;
22
, 6
;
477-480
;
2002
-
ISSN:
- Article (Journal) / Print
-
Title:Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: I. Organosolv lignin modified resins
-
Contributors:Cetin, N.S. ( author ) / Ozmen, N. ( author )
-
Published in:International Journal of Adhesion and Adhesives ; 22, 6 ; 477-480
-
Publisher:
-
Publication date:2002
-
Size:4 Seiten, 9 Quellen
-
ISSN:
-
DOI:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
-
Keywords:
-
Source:
Table of contents – Volume 22, Issue 6
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 423
-
The effect of flexible substrates on pressure-sensitive adhesive performanceSteven-Fountain, A.J. et al. | 2002
- 431
-
Formation of epoxy-diamine-metal interphasesRoche, A.A. et al. | 2002
- 443
-
Sealants in the automotive industryLavery, M. et al. | 2002
- 447
-
Adhesion properties of lactic acid based hot melt adhesives and their storage stability in different packaging applicationsViljanmaa, M. et al. | 2002
- 459
-
Kinetics of adherence of a rigid truncated cone on an elastic half-space (unfilled natural rubber)Bouissou, S. et al. | 2002
- 465
-
Covalent bonding of wood through chemical activationMallon, Stephen et al. | 2002
- 471
-
Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copperChan-Park, M.B. et al. | 2002
- 477
-
Use of organosolv lignin in phenol-formaldehyde resins for particleboard productionCetin, N. S. / Ozmen, N. et al. | 2002
- 477
-
Use of organosolv lignin in phenol-formaldehyde resins for particleboard production - I. Organosolv lignin modified resinsÇetin, Nihat S. et al. | 2002
- 481
-
Use of organosolv lignin in phenol-formaldehyde resins for particleboard production - II. Particleboard production and propertiesÇetin, Nihat S. et al. | 2002
- 487
-
Molecular adhesion and its applications: the sticky universe - Kevin Kendall; Kluwer Academic-Plenum Publishers, New York, Boston, Dordrecht, London, Moscow, 2001, 429pp.+xix, ISBN 0-306-46520-5. (GBP)59.50, #836497.75.Comyn, John et al. | 2002
- 487
-
Molecular adhesion and its applications: the sticky universeComyn, J. et al. | 2002
- 489
-
Swiss Bonding 2002, 27-29 May 2002Allen, K.W. et al. | 2002
- 495
-
Author index| 2002
- 497
-
Keyword index| 2002