Dynamic modeling of interactions between fields and matter in MEMS devices (English)
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In:
Microsystem Technologies
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10
, 5
;
387-392
;
2004
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ISSN:
- Article (Journal) / Print
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Title:Dynamic modeling of interactions between fields and matter in MEMS devices
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Contributors:
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Published in:Microsystem Technologies ; 10, 5 ; 387-392
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Publisher:
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Publication date:2004
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Size:6 Seiten, 26 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 10, Issue 5
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 345
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Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003Courtois, Bernard / Michel, Bernd et al. | 2004
- 346
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“Plug-up”–a new concept for fabricating SOI MEMS devicesKiihamäki, J. / Dekker, J. / Pekko, P. / Kattelus, H. / Sillanpää, T. / Mattila, T. et al. | 2004
- 351
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New electroforming technology pressure aid for LIGA processTsai, T. -H. / Yang, H. / Chein, R. et al. | 2004
- 357
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SU8 resist plasma etching and its optimisationHong, G. / Holmes, A. S. / Heaton, M. E. et al. | 2004
- 360
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Thin film formation on non-planar surface with use of spray coating fabricationIchiki, M. / Zhang, L. / Yang, Z. / Ikehara, T. / Maeda, R. et al. | 2004
- 364
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Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow processRusu, C. / Jansen, H. / Gunn, R. / Witvrouw, A. et al. | 2004
- 372
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Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperaturesTruckenmüller, R. / Henzi, P. / Herrmann, D. / Saile, V. / Schomburg, W.K. et al. | 2004
- 375
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Modular parametric finite element modelling for reliability-studies in electronic and mems packagingWunderle, B. / Auersperg, J. / Großer, V. / Kaulfersch, E. / Wittler, O. / Michel, B. et al. | 2004
- 382
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Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cellFonseca, L. / Cabruja, E. / Calaza, C. / Rubio, R. / Santander, J. / Figueras, E. / Gràcia, I. / Cané, C. / Moreno, M. / Marco, S. et al. | 2004
- 387
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Dynamic modeling of interactions between fields and matter in MEMS devicesZeng, K. / Liu, Z. / Korvink, J. G. et al. | 2004
- 393
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Parallel-beams/lever electrothermal out-of-plane actuatorDeladi, S. / Krijnen, G. / Elwenspoek, M. C. et al. | 2004
- 400
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Design and simulation of MEMS optical switch using photonic bandgap crystalTeo, H. G. / Liu, A. Q. / Singh, J. / Yu, M. B. / Bourouina, T. et al. | 2004
- 407
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Yield strength of thin-film parylene-CShih, C.Y. / Harder, T.A. / Tai, Y.C. et al. | 2004
- 412
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Fracture behaviour of single crystal silicon microstructuresMeroni, F. Favalli / Mazza, E. et al. | 2004
- 419
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Ensuring repeatability in LIGA mold insert fabricationSchulz, J. / Bade, K. / Guttmann, M. / Hahn, L. / Janssen, A. / Köhler, U. / Meyer, P. / Winkler, F. et al. | 2004
- 423
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Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfacesKobayashi, T. / Murakoshi, Y. / Maeda, R. et al. | 2004
- 426
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Design, fabrication, and test of a peristaltic micropumpKnight, M. / House, J. et al. | 2004
- 432
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New aspects of simulation in hot embossingWorgull, M. / Heckele, M. et al. | 2004