Predicting the crack progression in PbSnAg-solder under cyclic loading (English)
- New search for: Ramminger, Siegfried
- New search for: Wachutka, Gerhard
- New search for: Ramminger, Siegfried
- New search for: Wachutka, Gerhard
In:
CIPS, International Conference on Integrated Power Systems, 4
;
1-3
;
2006
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ISBN:
- Conference paper / Storage medium
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Title:Predicting the crack progression in PbSnAg-solder under cyclic loading
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Additional title:Vorhersage der Rissausbreitung in PnSnAg-Lot unter zyklischer Belastung
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Contributors:Ramminger, Siegfried ( author ) / Wachutka, Gerhard ( author )
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Published in:
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Publisher:
- New search for: VDE-Verlag
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Place of publication:Berlin, Offenbach
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Publication date:2006
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Size:3 Seiten, 4 Bilder, 4 Quellen
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ISBN:
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Type of media:Conference paper
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Type of material:Storage medium
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Language:English
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Keywords:Ausdehnungskoeffizient , Bleizinnlot , Dissipation , dünne Schicht , eutektische Legierung , experimentelles Ergebnis , Finite-Elemente-Methode , Konferenzbericht , Kraftfahrzeugelektrik , Kriechverhalten , Lebensdauer , Leistungselektronik , Materialbruch , Mikroriss , nichtlineare Viskoelastizität , plastische Verformung , Probe , Rissausbreitung , Rissausbreitungsversuch , Risseinleitung , Scherspannung , Schichtablösung , Silber , Silberlot , Simulation , Spannungsdehnungsverhalten , thermomechanische Eigenschaft , Verformungsgeschwindigkeit , Verpackung , zyklische Prüfung
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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