An investigation into the rheological properties of different lead-free solder pastes for surface mount applications (English)
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In:
Soldering and Surface Mount Technology
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20
, 2
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3-10
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2008
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ISSN:
- Article (Journal) / Print
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Title:An investigation into the rheological properties of different lead-free solder pastes for surface mount applications
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Contributors:
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Published in:Soldering and Surface Mount Technology ; 20, 2 ; 3-10
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Publisher:
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Publication date:2008
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Size:8 Seiten, 9 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 20, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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An investigation into the rheological properties of different lead-free solder pastes for surface mount applicationsMallik, S. / Ekere, N.N. / Durairaj, R. / Marks, A.E. et al. | 2008
- 11
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Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)Lau, John / Gleason, Jerry / Schroeder, Valeska / Henshall, Gregory / Dauksher, Walter / Sullivan, Bob et al. | 2008
- 21
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Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)Lau, John / Gleason, Jerry / Schroeder, Valeska / Henshall, Gregory / Dauksher, Walter / Sullivan, Bob et al. | 2008
- 30
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Reliability study of surface mount printed circuit board assemblies with lead-free solder jointsLo, Jeffery C.C. / Jia, B.F. / Liu, Z. / Zhu, J. / Ricky Lee, S.W. et al. | 2008
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Successful campaign for BSI committee members| 2008
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A technology road map for the PCB industry| 2008
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EIPC Conference Rome 24 and 25 January 2008Ling, John et al. | 2008
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Kent Ang to lead DEK's electroform and platinum stencil production in Asia| 2008
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OK International announces European price reductions| 2008
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Marantz UK user group meeting puts new AOI software through its paces| 2008
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International diary| 2008
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Automated Bonded Wafer Inspection Tool from Sonoscan| 2008
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Siplace future proofs TTems UK growth| 2008
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Exerra appoints four North American reps| 2008
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Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK| 2008
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IPC releases Revision B of IPC-7711/7721| 2008
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David Byrd appointed Global Manager for Engineered Products| 2008