A novel fabrication of Cu-Mn alloy films by chemical displacement process (English)
- New search for: Lin, Li-Min
- New search for: Yang, Wen-Luh
- New search for: Dai, Ming-Jie
- New search for: Yang, Tsong-Jen
- New search for: Lin, Li-Min
- New search for: Yang, Wen-Luh
- New search for: Dai, Ming-Jie
- New search for: Yang, Tsong-Jen
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ISBN:
- Conference paper / Print
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Title:A novel fabrication of Cu-Mn alloy films by chemical displacement process
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Additional title:Ein neuartiges Fertigungsverfahren von Cu-Mn-Legierungsschichten mittels eines chemischen Verschiebungsprozesses
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Contributors:Lin, Li-Min ( author ) / Yang, Wen-Luh ( author ) / Dai, Ming-Jie ( author ) / Yang, Tsong-Jen ( author )
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Published in:ECS Transactions ; 16, 19 ; 3-8
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Publisher:
- New search for: Electrochemical Society
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Place of publication:Pennington
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Publication date:2009
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Size:6 Seiten, 5 Bilder, 9 Quellen
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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A Novel Fabrication of Cu-Mn Alloy Films by Chemical Displacement ProcessLin, L. / Yang, W. / Dai, M. / Yang, T. / Yang, C. / Huang, F.T. / Wang, C. / Huang, S. / Electrochemical Society et al. | 2008
- 9
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High Rate Etching of Ru and TaN using Electrochemical Reaction for Bevel CleaningAoki, H. / Watanabe, D. / Ooi, N. / Jeong, J. / Kimura, C. / Sugino, T. / Electrochemical Society et al. | 2008
- 15
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Controlling Scratching in Cu Chemical-Mechanical Planarization (CuCMP)Eusner, T. / Saka, N. / Chun, J. / Armini, S. / Moinpour, M. / Fischer, P. / Electrochemical Society et al. | 2008
- 31
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The Effect of a Threshold Failure Time on Electromigration Behavior of Copper InterconnectsFilippi, R.G. / Lloyd, J. / Wang, P. / Brendler, A. / Poulin, J. / Demarest, J. / Redder, B. / Electrochemical Society et al. | 2008
- 41
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Blech Effect in Copper Interconnects, Its Applications and Design ConsiderationsWang, P. / Filippi, R.G. / Christiansen, C. / Li, B. / Ding, H. / Electrochemical Society et al. | 2008
- 51
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Solder Bump Electromigration and CPI Challenges in Low-k DevicesSusko, R. / Daubenspeck, T. / Wassick, T. / Sullivan, T. / Sauter, W. / Cincotta, J. / Electrochemical Society et al. | 2008