Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire (English)
- New search for: Dohle, Rainer
- New search for: Petzold, Matthias
- New search for: Klengel, Robert
- New search for: Schulze, Holger
- New search for: Rudolf, Frank
- New search for: Dohle, Rainer
- New search for: Petzold, Matthias
- New search for: Klengel, Robert
- New search for: Schulze, Holger
- New search for: Rudolf, Frank
In:
IMAPS, International Symposium on Microelectronics, 42
;
380-387
;
2009
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ISBN:
- Conference paper / Print
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Title:Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire
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Contributors:Dohle, Rainer ( author ) / Petzold, Matthias ( author ) / Klengel, Robert ( author ) / Schulze, Holger ( author ) / Rudolf, Frank ( author )
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Published in:
-
Publisher:
- New search for: IMAPS
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Place of publication:Washington
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Publication date:2009
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Size:8 Seiten, 22 Bilder, 4 Tabellen, 10 Quellen
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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