Parametric optimization of micro-contact printing based thermal transfer of electrospun nanofibers (English)
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In:
Microelectronic Engineering
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87
, 12
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2513-2517
;
2010
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ISSN:
- Article (Journal) / Print
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Title:Parametric optimization of micro-contact printing based thermal transfer of electrospun nanofibers
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Contributors:Liu, Jun ( author ) / Shi, Jian ( author ) / Secret, Emilie ( author ) / Wang, Li ( author ) / Zhang, Haoli ( author ) / Chen, Yong ( author )
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Published in:Microelectronic Engineering ; 87, 12 ; 2513-2517
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Publisher:
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Publication date:2010
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Size:5 Seiten, 14 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 87, Issue 12
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 2449
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Microfabrication of a nickel mold insert by a modified deep X-ray lithography process and its application to hot embossingLee, Bong-Kee / Kim, Jong Hyun / Kim, Dong Sung / Chang, Suk Sang / Kwon, Tai Hun et al. | 2010
- 2456
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Stacked field effect transistor integration in double channel transistors (DCT) with tri-state transfer slope and ballistic field effect behaviorWirbeleit, Frank et al. | 2010
- 2463
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Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreaderWang, Tong Hong / Lee, Chang-Chi / Lai, Yi-Shao et al. | 2010
- 2468
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Bio/chemical detection in liquid with self-sensing Pr-Oxi-Lever (piezo-resistive SiO2 cantilever) sensorsChen, Ying / Xu, Pengcheng / Liu, Min / Li, Xinxin et al. | 2010
- 2475
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Fabrication of cantilever arrays with nano-aperture hollow tips for parallel microplasma etchingXiang, Wei Wei / Wen, Li / Wang, Hai / Zhang, Qiu Ping / Chu, Jia Ru et al. | 2010
- 2482
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Electrical analysis of organic dye-based MIS Schottky contactsGüllü, Ö. / Türüt, A. et al. | 2010
- 2488
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Interpretation of texture changes during self-annealing of electroplated copperZhang, W.Q. / Li, A.D. / Ma, G.B. / Yin, K.B. / Xia, Y.D. / Liu, Z.G. / Chan, C.Y. / Cheung, K.L. / Bayes, M.W. / Yee, K.W. et al. | 2010
- 2495
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Fabrication of large-area conductive patterns on ferrite substrate by laser micro-claddingCai, Zhixiang / Zeng, Xiaoyan et al. | 2010
- 2499
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Improvement of Ni/Si/4H-SiC ohmic contacts by VLS grown sub-contact layerMacháč, Petr / Barda, Bohumil et al. | 2010
- 2504
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Dispersion improvement of unipolar resistive switching Ni/CuxO/Cu device by bipolar operation methodLiu, Chih-Yi / Hsu, Jing-Ming et al. | 2010
- 2508
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Multilayers of Ge nanocrystals embedded in Al2O3 matrix: Structural and electrical studiesPinto, S.R.C. / Rolo, A.G. / Chahboun, A. / Buljan, Maja / Khodorov, A. / Kashtiban, R.J. / Bangert, U. / Barradas, N.P. / Alves, E. / Bernstorff, S. et al. | 2010
- 2513
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Parametric optimization of micro-contact printing based thermal transfer of electrospun nanofibersLiu, Jun / Shi, Jian / Secret, Emilie / Wang, Li / Zhang, Haoli / Chen, Yong et al. | 2010
- 2518
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Compact modeling of 0.35mm SOI CMOS technology node for 4K DC operation using Verilog-AAkturk, A. / Peckerar, M. / Eng, K. / Hamlet, J. / Potbhare, S. / Longoria, E. / Young, R. / Gurrieri, T. / Carroll, M. S. / Goldsman, N. et al. | 2010
- 2518
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Compact modeling of 0.35μm SOI CMOS technology node for 4K DC operation using Verilog-AAkturk, A. / Peckerar, M. / Eng, K. / Hamlet, J. / Potbhare, S. / Longoria, E. / Young, R. / Gurrieri, T. / Carroll, M.S. / Goldsman, N. et al. | 2010
- 2525
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Extraction of electronic parameters of Schottky diode based on an organic OrceinAydoğan, Şakir / İncekara, Ümit / Deniz, A.R. / Türüt, Abdulmecit et al. | 2010
- 2531
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CMOS on dual SOI thickness for optimal performanceLo, H.C. / Li, C.T. / Chen, Y.T. / Yang, C.T. / Luo, W.C. / Lu, W.Y. / Cheng, C.F. / Chen, T.L. / Lien, C.H. / Tsai, H.T. et al. | 2010
- 2535
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The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin filmsXie, Qi / Jiang, Yu-Long / De Keyser, Keon / Detavernier, Christophe / Deduytsche, Davy / Ru, Guo-Ping / Qu, Xin-Ping / Tu, K.N. et al. | 2010
- 2540
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The effect of pulsed laser annealing on the nickel silicide formationChen, Hou-Yu / Lin, Chia-Yi / Huang, Chien-Chao / Chien, Chao-Hsin et al. | 2010
- 2544
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Fabrication and electrical performance of high-density arrays of nanometric silicon tipsCarvalho, Edson J. / Alves, Marco A.R. / Braga, Edmundo S. / Cescato, Lucila et al. | 2010
- 2549
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Electrochemical polishing of ITO filmsWu, Yung-Fu / Ru, Yi-Lang et al. | 2010
- 2555
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Experimental study on ultrasonic stress relief for cured SU-8 photoresist layerDu, Liqun / Wang, Qijia et al. | 2010
- 2561
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Investigations of thermal annealing effects on electrical and structural properties of SrTaO based MIM capacitorKaynak, C. Baristiran / Lukosius, M. / Costina, I. / Tillack, B. / Wenger, Ch. / Ruhl, G. / Rushworth, S. et al. | 2010
- 2565
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Modeling the behavior of charge carrier mobility with temperature in thin-film polymeric transistorsEstrada, M. / Cerdeira, A. / Mejia, I. / Avila, M. / Picos, R. / Marsal, L.F. / Pallares, J. / Iñiguez, B. et al. | 2010
- 2571
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High density, low leakage Back-End 3D capacitors for mixed signals applicationsDetalle, M. / Barrenetxea, M. / Muller, P. / Potoms, G. / Phommahaxay, A. / Soussan, P. / Vaesen, K. / De Raedt, W. et al. | 2010
- 2577
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Effects of the Ag content on the geometrical and electrical characteristics of the screen-printed etched gate electrodes of OTFTs using Ag inkLee, Mi-Young / Lee, Myung-Won / Park, Jong-Seung / Song, Chung-Kun et al. | 2010
- 2582
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Electrodynamically actuated on-chip flow cytometry with low shear stress for electro-osmosis based sorting using low conductive mediumValagerahally Puttaswamy, Srinivasu / Sivashankar, Shilpa / Yeh, Chia-He / Chen, Rong-Jhe / Liu, Cheng Hsien et al. | 2010
- 2592
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Harmonics suppression investigations of pHEMT single-pole-single-throw switches using multi-gate structuresChiu, Hsien-Chin / Cheng, Chia-Shih / Fu, Jeffrey S. / Hsueh, Kuang-Po et al. | 2010
- 2596
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Continuous roll-to-flat thermal imprinting process for large-area micro-pattern replication on polymer substrateLan, Shuhuai / Song, Jung-Han / Lee, Moon G. / Ni, Jun / Lee, Nak Kyu / Lee, Hye-Jin et al. | 2010
- 2602
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Stabilized filling simulation of microchip encapsulation processWang, Hui / Zhou, Huamin / Zhang, Yun / Li, Dequn et al. | 2010
- 2610
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Formation of aluminum tunnel pits arrayed using SU-8 masks with UV-assisted thermal imprint lithographyJang, Joo-Hee / Choi, Woo-Sung / Kim, Nam-Jeong / Lee, Chang-Hyoung / Kim, Taek-You / Park, Chan / Suh, Su-Jeong et al. | 2010
- 2614
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Detailed analysis of charge pumping and IdVg hysteresis for profiling traps in SiO2/HfSiO(N)Sahhaf, S. / Degraeve, R. / Cho, M. / Brabanter, K. De / Roussel, Ph.J. / Zahid, M.B. / Groeseneken, G. et al. | 2010
- 2620
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Low-temperature embossing technique for fabrication of large-area polymeric microlens array with supercritical carbon dioxideWu, Jing-Tang / Chu, Ying-Ta / Yang, Sen-Yeu / Li, Chen-Chung et al. | 2010
- 2625
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Improvement in RF performance of 40-nm InAs-channel based HEMTs using Pt gate sinking with two-step recess processes technologyKuo, Chien-I / Hsu, Heng-Tung / Wu, Chien-Ying / Chang, Edward Y. / Chen, Yu-Lin / Lim, Wee-Chin et al. | 2010
- 2629
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Improvement of PMMA electron-beam lithography performance in metal liftoff through a poly-imide bi-layer systemYaghmaie, F. / Fleck, J. / Gusman, A. / Prohaska, R. et al. | 2010
- 2633
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Polishing behaviors of single crystalline ceria abrasives on silicon dioxide and silicon nitride CMPOh, Myoung-Hwan / Singh, Rajiv K. / Gupta, Sushant / Cho, Seung-Beom et al. | 2010
- 2638
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Post-process thermal treatment for microwave power improvement of AlGaN/GaN HEMTsPeng, M.Z. / Zheng, Y.K. / Wei, K. / Liu, X.Y. et al. | 2010
- 2642
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Acknowledgement of Reviewers 2010| 2010
- IFC
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Inside Front Cover - Editorial Board| 2010
- II
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Contents Continued...| 2010