Nano and micro materials in a Pb-free world (English)
- New search for: Das, R.N.
- New search for: Lauffer, J.M.
- New search for: Knadle, K.
- New search for: Vincent, M.
- New search for: Poliks, M.D.
- New search for: Markovich, V.R.
- New search for: Das, R.N.
- New search for: Lauffer, J.M.
- New search for: Knadle, K.
- New search for: Vincent, M.
- New search for: Poliks, M.D.
- New search for: Markovich, V.R.
In:
ECTC, IEEE Electronic Components and Technology Conference, 61
;
1228-1233
;
2011
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ISBN:
- Conference paper / Print
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Title:Nano and micro materials in a Pb-free world
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Contributors:Das, R.N. ( author ) / Lauffer, J.M. ( author ) / Knadle, K. ( author ) / Vincent, M. ( author ) / Poliks, M.D. ( author ) / Markovich, V.R. ( author )
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Published in:
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Publisher:
- New search for: IEEE Operations Center
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Place of publication:Piscataway
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Publication date:2011
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Size:6 Seiten, 11 Quellen
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:Montage , elektrischer Kondensator , Kupferlegierung , Verbindung integrierter Schaltungen , Halbleitergehäuse , integrierte Schaltung , Zuverlässigkeit , Schmelzpunkt , Nanoverbundwerkstoff , nanokristalliner Werkstoff , Teilchengröße , Silberlegierung , Lot (Lötmittel) , Zugfestigkeit , elektrische Eigenschaft , mechanische Festigkeit , Temperaturwechselbeanspruchung , Bariumtitanat , Silber
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Table of contents| 2011
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Committee members| 2011
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[Copyright notice]| 2011
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Affiliation index| 2011
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Professional development courses for the 61st ECTC| 2011
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Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC StackingXie, Ling / Choi, Won-Kyoung / Premachandran, C.S. / Selvanayagam, C.S. / Bai, Ke-Wu / Zeng, Ying-Zhi / Ong, Siong-Chiew / Liao, Ebin / Khairyanto, A. / Sekhar, V.N. et al. | 2011
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High-speed flex-on-board assembly method using anisotropic conductive films (ACFs) combined with room temperature ultrasonic (US) bonding for high-density module interconnection in mobile phonesLee, Kiwon / Oh, Sangmin / Saarinen, I.J. / Pykari, L. / Paik, Kyung-Wook et al. | 2011
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Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applicationsGoth, C. / Putzo, S. / Franke, J. et al. | 2011
- 1228
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Nano and micro materials in a Pb-free worldDas, R.N. / Lauffer, J.M. / Knadle, K. / Vincent, M. / Poliks, M.D. / Markovich, V.R. et al. | 2011
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Synthesis of high quality, closely packed vertically aligned carbon nanotube array and a quantitative study of the influence of packing density on the collective thermal conductivityGu, Wentian / Lin, Wei / Yao, Yagang / Wong, ChingPing et al. | 2011
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Technology and design of innovative flexible electrode for biomedical applicationsBalucani, M. / Nenzi, P. / Crescenzi, R. / Marracino, P. / Apollonio, F. / Liberti, M. / Densi, A. / Colizzi, C. et al. | 2011
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Embedded discrete passives technology for bandage-type medical sensors of E-healthcare systemLee, Baik-Woo / Booh, Seong-Woon / Shin, Kunsoo et al. | 2011
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Embedded 3D BioMEMS for multiplexed label free detectionVasan, A.S.S. / Doraiswami, R. / Pecht, M. et al. | 2011
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Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible ElectronicsShuto, T. / Watanabe, N. / Ikeda, A. / Asano, T. et al. | 2011
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Silicon microfilter device fabrication and characterization for diverse microfluidics applicationsMajeed, B. / Zhang, Lei / Tezcan, D.S. / Soussan, P. / Fiorini, P. et al. | 2011
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Microwave artificially structured periodic media microfluidic sensorWiwatcharagoses, N. / Park, Kyoung-Youl / Hejase, J.A. / Williamson, L. / Chahal, P. et al. | 2011
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Enhancement of dielectric strength and processibility of high dielectric constant Al nanocomposite by organic molecule treatmentLi, Zhuo / Moon, Kyoung-Sik / Kim, Saewon / Wong, C.P. et al. | 2011
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Low Temperature Cu-Cu Direct Bonding using Formic Acid Vapor PretreatmentYang, Wenhua / Shintani, H. / Akaike, M. / Suga, T. et al. | 2011
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Modeling, optimization and benchmarking of chip-to-chip electrical interconnects with low loss air-clad dielectricsKumar, V. / Bashirullah, R. / Naeemi, A. et al. | 2011
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Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnectionsMurata, N. / Saito, N. / Endo, F. / Tamakawa, K. / Suzuki, K. / Miura, H. et al. | 2011