Reduction of edge exclusion by EPC ring in CMP process (English)
- New search for: Park, Yeongbong
- New search for: Lee, Youngkyun
- New search for: Yuh, Minjong
- New search for: Jeong, Haedo
- New search for: Park, Yeongbong
- New search for: Lee, Youngkyun
- New search for: Yuh, Minjong
- New search for: Jeong, Haedo
In:
ICPT, International Conference on Planarization/CMP Technology, 2012
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113-118
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2012
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ISBN:
- Conference paper / Print
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Title:Reduction of edge exclusion by EPC ring in CMP process
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Additional title:Reduzierung des Kantenausschlusses durch den EPC-Ring beim chemisch-mechanischen Polieren
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Contributors:Park, Yeongbong ( author ) / Lee, Youngkyun ( author ) / Yuh, Minjong ( author ) / Jeong, Haedo ( author )
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Published in:
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Publisher:
- New search for: VDE-Verlag
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Place of publication:Berlin, Offenbach
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Publication date:2012
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Size:6 Seiten, 4 Bilder, 2 Tabellen, 5 Quellen
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Slurry selectivity influence on STI and POP processes for RMG applicationEuvrard, C. / Perrot, C. / Seignard, A. / Dettoni, F. / Rivoire, M. et al. | 2012
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Performance of a Novel Slurry Injection System on an Ebara F-REX200® Polisher for a Silicon Dioxide CMP ApplicationBorucki, Leonard / Zhuang, Yun / Sampurno, Yasa / Philipossian, Ara / Kreutzer-Schneeweiss, Sascha et al. | 2012
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Topography Understanding of Tungsten Chemical Mechanical Polishing for Advanced TechnologyYu, Hong / Moon, Yongsik / Liu, Huang et al. | 2012
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Innovative Barrier CMP Process: Benefit of High Selective Approach on Morphological and Electrical PerformancesRobin, O. / Nemouchi, F. / Charrion, E. / Hinsinger, O. / Galpin, D. / Rivoire, M. et al. | 2012
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Cu Layer thickness monitoring in CMP process by using eddy current sensorQu, Zilian / Zhao, Qian / Yu, Qiang / Zhao, Dewen / Li, Hongkai / Lu, Xinchun / Meng, Yonggang et al. | 2012
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Reduction of Edge Exclusion by EPC ring in CMP processPark, Yeongbong / Lee, Youngkyun / Yuh, Minjong / Jeong, Haedo et al. | 2012
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Smart pad dressing for double-side polishingKanzow, J. / Werth, S. / Mörsch, G. et al. | 2012
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Development of new copper post-CMP cleaning solutions that allow direct bondingOuerd, Aziz / Dulphy, Hervé / Lelièvre, Vincent / Cioccio, Léa Di / Rivoire, Maurice et al. | 2012
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CMP Defect Monitoring in HKMG Loop on Monitor WafersPeng, Ren / Hsu, Chun Wei / Hsieh, Duckblood / Lin, Welch / Huang, Climbing / Wu, JY / Palamadai, Chandar / Sapre, Prasanna / Chang, Timothy / Wang, Tony et al. | 2012
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CMP Process Optimization for Bonding ApplicationsBalan, Viorel / Seignard, Aurélien / Scevola, Daniel / Lugand, Jean-François / Di Cioccio, Léa / Rivoire, Maurice et al. | 2012
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Influence of different anneal processes on copper surfaces pre - and post - CMPRudolph, C. / Wachsmuth, H. / Bartusseck, I. / Dobritz, S. / Grafe, J. / Boettcher, M. / Wolf, M. J. et al. | 2012
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TSV CMP Process Development and Pitting Defect ReductionLin, Paul-Chang / Xu, Jinhai / Li, Pei / Ding, Yujie / Ma, Zhiyong / Xing, Charles / Jing, Judy / Wang, Yuchun et al. | 2012
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Application of an Abrasive-Free Cu Slurry for MEMS DevicesSteible, Benjamin / Stoldt, Michael / Tack, Michael / Zwicker, Gerfried et al. | 2012
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Experimental Studies on Interfacial Fluid Lubrication and Wafer Status during Chemical Mechanical Polishing of 12-inch WaferZhao, Dewen / Wang, Tongqing / He, Yongyong / Lu, Xinchun et al. | 2012
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Surface adsorption mechanism of water-soluble polymer in polishing slurryTsuchiya, Kohsuke / Takahashi, Shuhei / Kubo, Megumi / Morinaga, Hitoshi et al. | 2012
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Role of Abrasive Type and Media Surface Energy on Nanoparticle AdsorptionKaiser, Jordan / Streit, Michael / Connor, Patrick / Levy, Patrick / Keleher, Jason J. et al. | 2012
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Investigation on Analysis and Design of Pad Conditioning Process in Double Side PolishingLee, Sangjik / Kim, Hyoungjae / Lee, Hyunseop / Jeong, Haedo et al. | 2012
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A Novel Evaluation Method of Polishing Slurry Flow Using Digital Image Processing - Mechanical Polishing for Sapphire Using Diamond SlurryUneda, Michio / Fukuta, Yuya / Hotta, Kazutoshi / Sugiyama, Hiroyasu et al. | 2012
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A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical PolishingPark, Chuljin / Jeon, Minhyon / Lee, Sangjik / Kim, Doyeon / Lee, Taekyung / Kim, Hyoungjae et al. | 2012
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Tribological, Thermal, and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization ProcessesJiao, Yubo / Liao, Xiaoyan / Wu, Changhong / Zhuang, Yun / Sampurno, Yasa / Theng, Siannie / Godlstein, Michael / Philipossian, Ara et al. | 2012
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Development of chemical mechanical polishing process for carbon nanotube interconnects on 300 mm waferIto, Ban / Nishide, Daisuke / Matsumoto, Takashi / Katagiri, Masayuki / Saito, Tatsuro / Wada, Makoto / Watanabe, Masahito / Sakuma, Naoshi / Kajita, Akihiro / Sakai, Tadashi et al. | 2012
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Chemical-Mechanical Planarization of Aluminium Damascene StructuresKünzelmann, U. / Mueller, M. R. / Kallis, K. T. / Schuette, F. / Menzel, S. / Engels, S. / Fong, J. / Lin, C. / Dysard, J. / Bartha, J. W. et al. | 2012
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Interferometry: a direct die level characterization techniqueDettoni, F. / Beitia, C. / Morand, Y. / Euvrard, C. / Balan, V. / Peak, J. / Gaillard, S. / Hinsinger, O. / Bertin, F. / Rivoire, M. et al. | 2012
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Direct Polish STI HSS CMP with Improved Planarity and Defect PerformanceIyer, A. / Yang, T. / Li, T. / Diao, J. / Lee, C. H. / Leung, G. / Osterheld, T. et al. | 2012
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Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafersDettoni, F. / Beitia, C. / Euvrard, C. / Morand, Y. / Gaillard, S. / Hinsinger, O. / Bertin, F. / Rivoire, M. et al. | 2012
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Feature analysis and simulation of optical endpoint traces in tungsten CMPMazzone, Giovanni / Gianni, Davide M. / Bano, Giuseppe / Castelletti, Luca et al. | 2012
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Effect of process parameter on particle removal efficiency in brush scrubber cleaningMei, Hegeng / Wang, Jie / Lu, Xinchun et al. | 2012
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The Synergetic Effect of Polishing Debris Cleaning in Real-timeKim, Hojoong / Kim, Mingu / Qin, Hongyi / Yang, Ji Chul / Lim, Donghyun / Choi, Hoomi / Kim, Taesung et al. | 2012
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CVD Diamond-Coated CMP Polishing Pad Conditioner With Asperity Height VariationChoi, Joo Hoon / Lee, Yong Bin / Kim, Byung Ki et al. | 2012
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Research on the controlling technology of deliquescent action in polishing of KDP crystals based on deliquescent actionGuo, Shaolong / Zhang, Feihu / Zhang, Yong et al. | 2012
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Study on Polishing Properties for Phase Change MemoryBae, Jinwoo / Lee, Wonjun / Park, Seungho / Lee, Jae-Dong / Hwang, Inseak / Nam, Seok-Woo et al. | 2012
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Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide MaterialsSchlueter, James / Stoeva, Savka / Graham, Maitland / Shi, Tom et al. | 2012
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Determination of Adhesion Force of Particles on Substrate Surface using Atomic Force MicroscopyShin, Woonki / An, Joonho / Kim, Jiyoon / Jeong, Haedo et al. | 2012
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Planarization Efficiency of Copper ProtrusionLin, Jie / Poutasse, Charles A. et al. | 2012
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Advances in CMP for TSV RevealRhoades, Robert L. / Malta, Dean et al. | 2012
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CMP process development for high mobility channel materialsOng, Patrick / Gillot, Christophe / Ansar, Sheik / Noller, Bastian et al. | 2012
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The Study to Minimize the Variation of Polishing Time According to the Pad Used TimeYang, Ji Chul / Jang, Won Moon / Won, Jae-Hyung et al. | 2012
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Scratch Reduction by using Nano-colloidal Ceria Slurry with Multiselectivity of SiO2/Si3N4/Poly-Si Films in STI-CMPKang, Hyun-Goo / Koh, Jeong-Deog / Han, Seung-Woo / Lee, Jin Won / Lee, Byoun-Gki / Pyi, Seung- Ho / Lee, Byung-Seok / Kim, Jin-Woong / Reiss, Brian / Jeong, Jae-Deok et al. | 2012
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Additive/Abrasive Interactions in Solution: Investigation of the Surface Chemistry and Adsorption Behaviour of CMP AbrasivesEngland, Ashley N. / Rawat, Ashwani / Moinpour, Mansour / Remsen, Edward E. et al. | 2012
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Identification of Nonlinear Viscoelasticity of Polishing Pad Using an On- Machine Compression TesterSuzuki, Norikazu / Asaba, Masakazu / Hashimoto, Yohei / Shamoto, Eiji et al. | 2012
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Chemical Mechanical Planarization (CMP) In-Situ pad groove monitor through Fault Detection and Classification (FDC) systemDel Monaco, S. / Calderone, F. / Fritah, M. / Tiec, T. Le / Laurent, A. et al. | 2012
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Chemical Mechanical Polishing Slurry for Aluminum SubstrateWang, Liangyong / Liu, Weili / Song, Zhitang et al. | 2012
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Slurry Development for Copper/Barrier CMPZhang, Baoguo / Liu, Yuling et al. | 2012
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The Study of POU Filters Performance and Life-time in the CMP Slurry Supply SystemJang, Sunjae / Lim, Donghyun / Ji Chul Yang / Kim, Hojoong / Nam, Miyeon / Kim, Taesung et al. | 2012
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Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMPKimura, Keiichi / Suzuki, Keisuke / Khajornrungruang, Panart et al. | 2012
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Global Thickness Measurement System for Metal Layer on WaferYu, Qiang / Zhao, Dewen / Li, Hongkai / Qu, Zilian / Qian Zhao / Lu, Xinchun / Meng, Yonggang et al. | 2012
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The Synthesis of PS-Si02 Raspberry Structure Nanopartide for CMP SlurryQin, Hongyi / Kim, Hojoong / Choi, Hoomi / Kim, Mingu / Kim, Taesung et al. | 2012
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Adsorption Mechanism of Benzotriazole on Copper Surface in CMP Based Slurries Containing Peroxide and GlycineLi, Jing / Lu, Xinchun / Ou, Junyu / Cheng, Jie et al. | 2012
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Biomaterials Applications of Chemical Mechanical PolishingBasim, G. Bahar / Ozdemir, Zeynep / Mutlu, Ozal et al. | 2012
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Low Surface Roughness Epic™ D2xx soft pads for CMP ApplicationsNair, Jay / Lu, Shaoning / Page, Joseph / Bigoin, Gilles / Sun, Fred / Gaudet, Greg et al. | 2012
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FullVision™ Endpoint for CMP of SiGe Fin StructuresMenk, G. / Dhandapani, S. / Huang, Y.-C. / Wood, B. / Qian, J. / Cherian, B. / Garretson, C. / Osterheld, T. et al. | 2012
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Microreplicated Pad Conditioner for Copper Barrier CMP ApplicationsZabasajja, John / Le-huu, Duy / Gould, Charles et al. | 2012
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Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization (CMP)Johnson, Joy M. / Boning, Duane S. / Kim, Gwang-Soo / Safier, Paul / Knutson, Karson et al. | 2012
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Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMPKwon, Tae-Young / Cho, Byoung-Jun / Venkatesh, R. Prasanna / Park, Jin-Goo et al. | 2012
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Challenges of CMP Consumables MetrologyTregub, A. / Rawat, A. et al. | 2012
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Improvements in Profile Control using ISPC™ System During the Stop-in- Oxide CMP Step in the RMG Process Flow on IBM 20nm Short-Loop WafersKomarenko, P. / Qian, J. / Salfelder, J. / Levedakis, D. / Economikos, L. et al. | 2012
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Development of linear roll CMP system for large area micropatternsKim, Seongsoo / Kim, Jiyoon / Lee, Changsuk / Jeong, Haedo et al. | 2012
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Oxide Rate and Selectivity as a Function of Pad Chemistry,Renteln, Peter / Hsu, Oscar et al. | 2012
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The effect of H2O2 and Ammonia sulfate on the CMP of MolybdenumChen, Fei / Zeng, Xu / Xu, Jing-Bo / Lu, Hai-Sheng / Qu, Xin-Ping et al. | 2012
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Evaluation of Glass Lapping using Fixed Abrasive PadKim, Hyuk-Min / Manivannan, R. / Moon, Deog-Ju / Kwon, Tae-Young / Noh, Jin-Hyeong / Park, Jin-Goo et al. | 2012
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Process Optimization of Grinding and CMP for Thinning of SiFeeney, Paul / Shumway, Lynn et al. | 2012
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Effect of Slurry Chemistry on W CMP PerformanceKang, Mincheol / Kim, Kyungbo / Jung, Taeyeon / Park, Hyungsoon / Kim, Hyunghwan / Kang, Hyosang et al. | 2012
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CMP Evaluation of Reusable Polishing Pad using Auxiliary PlateDaventure, Nicolas / Del Monaco, Silvio / Suzuki, Tatsutoshi / Balan, Viorel / Rivoire, Maurice et al. | 2012
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STI CMP stop in Silicon Nitride controlled by FullVision™ endpointPerrot, C. / Pitard, F. / Cui, S. / Lam, G. / Del Medico, S. / Bennett, D. / Gaillard, S. / Hinsinger, O. et al. | 2012
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In Situ Profile Control with Titan Edge™ Heads for Dielectric Planarization of Advanced CMOS DevicesDhandapani, S. / Qian, J. / Cherian, B. / Menk, G. / Garretson, C. / Lee, H. / Bennett, D. / Osterheld, T. et al. | 2012
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Particle Reduction in W-CMP Process through Optimizing Post CleanerKim, Nam Yun / Kim, Kuen Byul / Jang, Young Seok / Lee, Jae Chang / Hong, Jin Suk / Baek, Kye Hyun / Kim, Hee Seok / Cho, Han Ku et al. | 2012
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Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMPYin, Tao / Doi, Toshiro / Kurokawa, Syuhei / Ohnishi, Osamu / Yamazaki, Tsutomu / Wang, Zhida / Tan, Zhe et al. | 2012
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Buried Tungsten Metal Gate Formation with Chemical Mechanical Polishing Technique and Involved IssuesHwang, Kyungho / Kwon, Hyuk / Kim, Hyunghwan / Kang, Hyosang et al. | 2012
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Relationship between Spatial Wavelength Pad Surface Profile and Pattern Step-height Reduction with 28 nm Ceria Particle SlurryMoon, Jinok / Bae, Jae-Young / Seo, Jihoon / Paik, Ungyu et al. | 2012