Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model (English)
National licence
- New search for: Yamada, Taisei
- New search for: Lee, Hwa Soo
In:
Key Engineering Materials
;
389-390
;
48-54
;
2008
- Article (Journal) / Electronic Resource
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Title:Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
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Contributors:
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Published in:Key Engineering Materials ; 389-390 ; 48-54
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Publisher:
- New search for: Trans Tech Publications
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Place of publication:Stafa-Zurich, Switzerland
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Publication date:2008-09-26
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Size:7 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 389-390
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone| 2008
- -1
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Preface| 2009
- -2
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Sponsors| 2009
- -5
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Committees| 2009
- 7
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Study on the Subsurface Damage of Single Crystal MgO Substrates| 2008
- 13
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Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer| 2008
- 18
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Comparative Study on the Materials Removal Mechanism of Ceramics and Steels| 2008
- 24
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Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters| 2008
- 30
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Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool| 2008
- 36
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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers| 2008
- 42
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Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding| 2008
- 48
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Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model| 2008
- 55
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Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB| 2008
- 61
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Experimental Trial of Fullerene Wheel Fabrication| 2008
- 67
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Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology| 2008
- 72
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Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools| 2008
- 77
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Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste| 2008
- 83
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Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron| 2008
- 90
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Grinding Burn and Chatter Classification Using Genetic Programming| 2008
- 96
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Control of Nano-Topography on an Axisymmetric Ground Surface| 2008
- 102
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Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method| 2008
- 108
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Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method| 2008
- 114
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Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding| 2008
- 120
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Fuzzy Rules for Surface Roughness of Ground Steels| 2008
- 126
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Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model| 2008
- 132
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Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear-| 2008
- 138
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Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool| 2008
- 144
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Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools| 2008
- 151
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Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning| 2008
- 157
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High Speed Cutting of Titanium Alloy with PCD Tools| 2008
- 163
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Development of DLC Coated Tool for Cutting of Aluminum Alloy -Influence of Deposition Condition on Cutting Characteristic-| 2008
- 169
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Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material -| 2008
- 175
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Development of A New Cutting Fluid Supply System for Near Dry Machining Process| 2008
- 181
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Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing| 2008
- 187
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Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen| 2008
- 193
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Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing| 2008
- 199
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The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface| 2008
- 205
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Computer Aided Design and Grinding for Helical Drill Points| 2008
- 211
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A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds| 2008
- 217
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Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film| 2008
- 223
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Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow| 2008
- 229
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Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding| 2008
- 235
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Study on Abrasive Geometry of Quick-Point Grinding| 2008
- 240
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Model-Based Compensation of Geometry-Errors when Grinding Material Compounds| 2008
- 246
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A New Type of Drill Grinder Based on the Special Universal Joint| 2008
- 252
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Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder| 2008
- 258
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Model Based Characterization of the Grinding Wheel Effective Topography| 2008
- 264
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Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining-| 2008
- 271
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Grinding of Soft Steel with Assistance of Ultrasonic Vibrations| 2008
- 277
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Ultrasonic Vibration-Assisted Cutting of Titanium Alloy| 2008
- 283
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Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding| 2008
- 289
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Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer| 2008
- 295
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Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface| 2008
- 302
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Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds| 2008
- 308
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Engineering a Next Generation Water-Based Grinding Fluid| 2008
- 314
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Evaluation of Bearing Grinding Fluids| 2008
- 320
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The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel| 2008
- 326
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Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel| 2008
- 332
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A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV| 2008
- 338
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Actively Cooled and Activated Coolant for Grinding Brittle Materials| 2008
- 344
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Spatial Distribution of Cooling Mist for Precision Grinding| 2008
- 350
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A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces| 2008
- 356
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The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon| 2008
- 362
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Virtual Truing and Dressing of Grinding Wheel| 2008
- 368
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Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding| 2008
- 375
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A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet| 2008
- 381
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Hole Machining of Glass by Micro Abrasive Suspension Jets| 2008
- 387
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Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding| 2008
- 392
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Profit Optimization of Abrasive Blasting Systems| 2008
- 398
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Design of Double Nozzle Type Powder Jet Device Optimized for PJD| 2008
- 404
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Thermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge| 2008
- 410
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Grinding Combination of Electrochemical Smoothing On SKH 51 Surface| 2008
- 417
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Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction| 2008
- 424
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Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation| 2008
- 430
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An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil| 2008
- 436
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Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing| 2008
- 442
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Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy| 2008
- 448
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Study on Glass Strength at High Speed Edge Rounding for LCD| 2008
- 453
-
The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter| 2008
- 459
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Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)| 2008
- 465
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Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding| 2008
- 469
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Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation| 2008
- 475
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Study on Adhesion Removal Model in CMP SiO2 ILD| 2008
- 481
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Study on the CMP Pad Life with its Mechanical Properties| 2008
- 487
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Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad| 2008
- 493
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A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition| 2008
- 498
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Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization| 2008
- 504
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Achieving a Damage-Free Polishing of Mono-Crystalline Silicon| 2008
- 510
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Effect of Polishing Time and Pressure on Polishing Pad Performance| 2008
- 515
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Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives| 2008
- 521
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Scale Effect of Nano-Indentation of Silicon – A Molecular Dynamics Investigation| 2008