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Effect of elastic anisotropy on surface pattern evolution of epitaxial thin films
Online Contents | 2009| -
Effect of elastic anisotropy on surface pattern evolution of epitaxial thin films
Online Contents | 2009| -
Bifurcation of surface pattern in epitaxial thin films under anisotropic stresses
Online Contents | 2007| -
Bifurcation of surface pattern in epitaxial thin films under anisotropic stresses
National licenceAmerican Institute of Physics | 2007| -
Influence of interfacial delamination on channel cracking of elastic thin films
Online Contents | 2008| -
Influence of interfacial delamination on channel cracking of elastic thin films
Springer Verlag | 2007| -
Stiffener for providing uniformity in microelectronic packages
Free accessEuropean Patent Office | 2019| -
STIFFENER FOR PROVIDING UNIFORMITY IN MICROELECTRONIC PACKAGES
Free accessEuropean Patent Office | 2019| -
Metal layer patterning for minimizing mechanical stress in integrated circuit packages
Free accessEuropean Patent Office | 2022| -
Metal layer patterning for minimizing mechanical stresses in integrated circuit packages
Free accessEuropean Patent Office | 2022| -
METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES
Free accessEuropean Patent Office | 2022| -
METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES
Free accessEuropean Patent Office | 2021|
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