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Overview and outlook of through-silicon via (TSV) and 3D integrations
Emerald Group Publishing | 2011| -
Comparison of LTCC inductors on different substrate configurations with PCB inductor
British Library Online Contents | 2014| -
RF characteristics of 0.13-μm NMOS transistors for millimeter-wave application
British Library Online Contents | 2014| -
The effect of microwave radiation on polyvinyl chloride-graphite thick film resistors
British Library Online Contents | 2014| -
The tunnelling and electron injection reliabilities for FG transistors
British Library Online Contents | 2014| -
Control of tube parameters on SWCNT bundle interconnect delay and power dissipation
British Library Online Contents | 2014| -
Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks
British Library Online Contents | 2014| -
Silicon nanowire fabrication: Silicon trimming via shallow anisotropic etching
British Library Online Contents | 2014| -
Dynamic reliability approach of chip scale package assembly under vibration environment
British Library Online Contents | 2014| -
Thermal resistance studies of surface modified heat sink for 3W LED using transient curve
British Library Online Contents | 2013| -
Embedded passive device technology for wireless mobile devices
British Library Online Contents | 2013| -
Fabrication and characterization of a single-bridge nanorod between microgap electrodes
British Library Online Contents | 2014| -
A high gain and high linearity class-AB power amplifier for WCDMA applications
British Library Online Contents | 2014| -
Future and technical considerations of gold wirebonding in semiconductor packaging - a technical review
British Library Online Contents | 2014| -
Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings
British Library Online Contents | 2013| -
Tin contamination in PQFN package and its effects on wire bondability
British Library Online Contents | 2013|
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