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Low-density lipoproteins investigated under high hydrostatic pressure by elastic incoherent neutron scattering
Free accessSpringer Verlag | 2017| -
On perturbative aspects of a nonminimal Lorentz-violating QED with CPT-odd dimension-5 terms
Free accessSpringer Verlag | 2021| -
On perturbative aspects of a nonminimal Lorentz-violating QED with CPT-odd dimension-5 terms
Free accessSCOAP³ Repository | 2021| -
Low-density lipoproteins investigated under high hydrostatic pressure by elastic incoherent neutron scattering
Free accessOnline Contents | 2017| -
Thermomechanical behavior of Al-Cu-Si commercial alloy modified with rare earths
Free accessBASE | 2020| -
On perturbative aspects of a nonminimal Lorentz-violating QED with CPT-odd dimension-5 terms
Free accessDOAJ | 2021| -
On perturbative aspects of a nonminimal Lorentz-violating QED with CPT-odd dimension-5 terms
Free accessOnline Contents | 2021| -
Different kind of textures of Yukawa coupling matrices in the two Higgs doublet model type III
Free accessSpringer Verlag | 2007| -
Compliant energy and momentum conservation in NEGF simulation of electron-phonon scattering in semiconductor nano-wire transistors
Free accessIOP Institute of Physics | 2012| -
A novel ultrasonic method to quantify pressure in bolted joints
Free accessIOP Institute of Physics | 2012| -
Pin on disk against ball on disk for the evaluation of wear improvement on cryo-treated metal cutting shears
Free accessAmerican Institute of Physics | 2015| -
Full three-dimensional isotropic transformation media
Free accessPaperIOP Institute of Physics | 2014| -
LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
Free accessEuropean Patent Office | 2023| -
Investigating the Degradability of HDPE, LDPE, PE-BIO, and PE-OXO Films under UV-B Radiation
Free accessDOAJ | 2015| -
LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
Free accessEuropean Patent Office | 2023| -
LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
Free accessEuropean Patent Office | 2020|
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