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27th Annual Advanced Metallization Conference 2010 : [Advanced Metallization Conference took place at the College of Nanoscale and Engineering at the State University of New York, Albany, New York, October 5 - 7, 2010 ... held in parallel with the Advanced Metallization Conference in Tokyo (ADMETA 2010, the 20th Asian session, that took place in Sanjou Hall, University of Tokyo, Tokyo in October 19 - 22, 2010)]
TIBKAT | 2012| -
14nm UTBB FD-SOI MEOL Gapfill New Capability Flowable CVD
British Library Conference Proceedings | 2014| -
Monitoring Water Uptake During Immersion of ULK Materials by Impedance Spectroscopy
British Library Conference Proceedings | 2014| -
Observation of Intra-grain Crystalline Orientation in Ni(Pt) Si Silicide Grain with TEM Precession Electron Diffraction
British Library Conference Proceedings | 2014| -
New Fluorocarbon Free Chemistry Proposed as Solution to Limit Porous SiOCH Modification During Etching
British Library Conference Proceedings | 2014| -
48 nm Pitch Copper Dual-Damascene Interconnects with Triple Pitch Split Metal and Double Pitch Split Via
British Library Conference Proceedings | 2014| -
3D Integration Technologies for MEMS Based on Copper TSVs and Copper-to-Copper Metal Thermo Compression Bonding
British Library Conference Proceedings | 2014| -
Fast Metal Screening for Novel, Highly Conductive and Thermally Stable Metal Gate Materials Using Combinatorial Methods
British Library Conference Proceedings | 2014| -
Surface Chemistry Enhanced Selective ALD of Co Capping Layers on Cu
British Library Conference Proceedings | 2014| -
Profile and Integration Optimization for Reliable BEOL
British Library Conference Proceedings | 2014| -
Electrical Properties and Reliability of ALD TaN Barrier for Sub-90nm Pitch Cu Interconnects
British Library Conference Proceedings | 2014| -
Impact of Grain Boundary and Surface Scattering on Resistivity
British Library Conference Proceedings | 2014| -
Perspectives into CVD-Cobalt Liner Induced Increase in Resistivity of Cu Interconnect
British Library Conference Proceedings | 2014| -
Comparative Study Of Restoration Processes For Plasma- And CMP-Damaged Low-k Used In CMOS 28nm Interconnections
British Library Conference Proceedings | 2014| -
Characterization of Porous SiCOH Ultra Low-k Material with O~2 Adding into UV Cure Process
British Library Conference Proceedings | 2014|
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