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0.13 mum Generation Integration and Manufacturing of Dual Damascene Copper in FSG
British Library Conference Proceedings | 2003| -
3D Coupled Simulation of Electromigration in Copper-Low-k Multilevel Interconnect
British Library Conference Proceedings | 2003| -
3D-Integration: Trends and Opportunities-An Overview
British Library Conference Proceedings | 2003| -
3D Interconnects Using Cu Wafer Bonding: Technology and Applications
British Library Conference Proceedings | 2003| -
A Comparison of CVD TiN(Si) and PVD Ta Metal Barriers Using a Novel Metal Barrier Reliability Test Structure
British Library Conference Proceedings | 2003| -
Adhesion Evaluation by Nanoscratch Method in Stacked Thin Film Structures
British Library Conference Proceedings | 2003| -
Advanced Electroless Ag-W Thin Films for ULSI Metallization
British Library Conference Proceedings | 2003| -
Al-CVD Technology Using MPA [methylpyrrolidine alane]
British Library Conference Proceedings | 2003| -
ALD-TaN Thin Films as Diffusion Barrier for Copper Metallization
British Library Conference Proceedings | 2003| -
A New Method for In-Line Measurement of the Dielectric Constant of Low-k Films
British Library Conference Proceedings | 2003| -
A New Method of Cleaning Cu/Organic Low-K Interconnect
British Library Conference Proceedings | 2003| -
An Imprint-Damascene Process for Cu/Low-k Interconnects
British Library Conference Proceedings | 2003| -
An Integrated Multiscale Mechanical Model for Chemical Mechanical Planarization
British Library Conference Proceedings | 2003| -
A Novel Porous Silica Film for Cu/Low-k Multilevel Interconnects
British Library Conference Proceedings | 2003| -
A Novel Ultra Tough Organic Low-k Film With a Highly Cross-Linked Low Density Structure
British Library Conference Proceedings | 2003| -
Application of a Global-Local Random-Walk Algorithm for Thermal Analysis of 3D Integrated Circuits
British Library Conference Proceedings | 2003| -
A Robust CMP Process for Sub-0.13 mum Copper/Low-k Interconnects
British Library Conference Proceedings | 2003| -
A Sacrificial Al-Seed Cu-Plating Technology for Cu Line-Pillar/STP Scheme
British Library Conference Proceedings | 2003|
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