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TechTuning: Stress Management For 3D Through‐Silicon‐Via Stacking Technologies
American Institute of Physics | 2011|Contributors: Smith, Larry -
Determination of crystallographic orientation of large grain metals with surface acoustic waves
American Institute of Physics | 2012| -
Thickness measurement of polymer thin films with high frequency ultrasonic transducers
Free accessAmerican Institute of Physics | 2019| -
Results from the STAR experiment: High physics
American Institute of Physics | 2002|Contributors: Smith, Anna M -
Spatially resolved acoustic spectroscopy (SRAS) microstructural imaging
Free accessAmerican Institute of Physics | 2019| -
Stress management for 3D through-silicon-via stacking technologies - The next frontier -
American Institute of Physics | 2014|Contributors: Smith, Larry -
Surface reactions of tetraneopentyl zirconium on zirconium carbide thin films
American Institute of Physics | 1994|
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