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Determination of Temperature Dependent Young’s Modulus of Sintered Silver (SAG) by Vibration Tests
IEEE | 2024|Publisher: IEEE -
Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
IEEE | 2024|Publisher: IEEE -
A 3D Crystal plasticity finite element model for a 3D package under drop impact
IEEE | 2023|Publisher: IEEE -
A Combined Experimental and Analytical Study of Residual Strains Developed in Encapsulated Structures
IEEE | 2023|Publisher: IEEE -
Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging
IEEE | 2023|Publisher: IEEE -
The microstructure of Cu joint soldered with a new Cu coated Ni foam reinforced Sn composite solder
IEEE | 2023|Publisher: IEEE -
Effect of Zr4+ doping on electrical property of BaTiO3-based MLCC with high-voltage
IEEE | 2023|Publisher: IEEE -
Cell-Free Massive MIMO for ISAC: Access Point Operation Mode Selection and Power Control
IEEE | 2023|Publisher: IEEE -
AlloyGAN: Domain-Promptable Generative Adversarial Network for Generating Aluminum Alloy Microstructures
IEEE | 2023|Publisher: IEEE -
Effect of cohesive behaviour and residual stress on the indentation response of elastoplastic film/substrate structure
IEEE | 2023|Publisher: IEEE -
Reinforcement Learning for Predictive Modeling and Management of Rare Genetic Disorders in Pediatric Healthcare
IEEE | 2023|Publisher: IEEE -
User Experience Analysis of the FutureMe Website using the User Experience Questionnaire (UEQ)
IEEE | 2023|Publisher: IEEE -
Research on glass composition analysis based on K-means algorithm and Lasso regression algorithm
IEEE | 2023|Publisher: IEEE -
Effect of process parameter interactions on short shot defect modeling in plastic injection molding
IEEE | 2023|Publisher: IEEE -
Exploring the Impact of Surface Quality on the Bending Fatigue Strength of Wire Arc Additive Manufactured Carbon Steel
IEEE | 2023|Publisher: IEEE -
Children's Toy Design Process Based on the Kano-AHP-FBS Model: Case of Multisensory Educational Toys
IEEE | 2023|Publisher: IEEE -
Isotherms of Lattice Thermal Conductivity and Self-Organization Processes in Semiconductor Pb1-xSnxTe Solid Solutions
IEEE | 2023|Publisher: IEEE -
Microstructure and electrical properties of biocompatible polyether-carbon nanotubes sensor materials
IEEE | 2023|Publisher: IEEE -
Luminescent Composites Based on Nanocellulose and K3Tb(PO4)2Phosphor - Preparation and Properties
IEEE | 2023|Publisher: IEEE -
Electrical Properties of $p-\text{CuNiO}_{2}/n-\text{Si}$ Heterojunction
IEEE | 2023|Publisher: IEEE -
RE3+-Doped Ceria Nanoparticles with Spectroscopically Controlled ROS Scavenging Activity
IEEE | 2023|Publisher: IEEE -
Peculiarities of the Surface Structure of High-Speed Steel After Pulse-Plasma Treatment
IEEE | 2023|Publisher: IEEE -
Transformations in Composition and Structure in Multicomponent Alloy Targets Occurring during Their Exploitation
IEEE | 2023|Publisher: IEEE -
Reduced Porous Graphene Oxide Network as High-performance Supercapacitor Electrodes: Effect of Reduction Temperature
IEEE | 2023|Publisher: IEEE -
Precision Uncertainty Due to Infill in Additive Manufacturing of Small-Scale Devices
IEEE | 2023|Publisher: IEEE -
Nanoscale Failure Analysis of an Aluminium Alloy for Space Applications
IEEE | 2023|Publisher: IEEE -
Taguchi’s design’s Optimization of Commercial Steel Welding made by Semi-Automated GTAW
IEEE | 2023|Publisher: IEEE -
Experimental Study on the Influence of Adding Rubber Powder on Strength Characteristics of Remoulded Loess
IEEE | 2022|Publisher: IEEE -
pMOSFET with CVD-grown 2D semiconductor channel enabled by ultra-thin and fab-compatible spacer doping
IEEE | 2022|Publisher: IEEE -
Optical and Electron Microscopy Studies of Al2O3 Nanomatrices with Embedded ADP and KB5 Nanocrystals
IEEE | 2022|Publisher: IEEE -
The Study of the Nanocrystalline Structure of Psammoma Bodies of Serous Ovarian Carcinoma
IEEE | 2022|Publisher: IEEE -
Electrical Interface between Carbon Nanotubes and Metallic Electrodes for Industrial Applications
IEEE | 2022|Publisher: IEEE
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