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3D Microelectronic Packaging [2020]

1
Introduction to 3D Microelectronic Packaging
2
3D Packaging Architectures and Assembly Process Design
3
Materials and Processing of TSV
4
Microstructure and Mechanical Reliability Issues of TSV
5
Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV
6
Atomic Scale Kinetics of TSV Protrusion
7
Fundamentals and Failures in Die Preparation for 3D Packaging
8
Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
9
Copper Micro and Nano Particles Mixture for 3D Interconnection Application
10
Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages
11
Fundamentals of Solder Alloys in 3D Packaging
12
Fundamentals of Electromigration in Interconnects of 3D Packaging
13
Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design
14
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
15
Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
16
Processing and Reliability of Solder Interconnections in Stacked Packaging
17
Interconnect Quality and Reliability of 3D Packaging
18
Fault Isolation and Failure Analysis of 3D Packaging
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