Wafer mapping for stepper effects characterization (English)
- New search for: Zhang, Y.
- New search for: Carpio, R. A.
- New search for: Wagner, L.
- New search for: Golubtsov, P. V.
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- New search for: Zhang, Y.
- New search for: Carpio, R. A.
- New search for: Wagner, L.
- New search for: Golubtsov, P. V.
- New search for: Singh, B.
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In:
Metrology, inspection, and process control for microlithography
3677
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250-254
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1999
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ISBN:
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ISSN:
- Conference paper / Print
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Title:Wafer mapping for stepper effects characterization
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Contributors:Zhang, Y. ( author ) / Carpio, R. A. ( author ) / Wagner, L. ( author ) / Golubtsov, P. V. ( author ) / Singh, B. / SPIE
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Conference:Conference; 13th, Metrology, inspection, and process control for microlithography ; 1999 ; Santa Clara; CA
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Published in:Metrology, inspection, and process control for microlithography , 3677 ; 250-254PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING , 3677 ; 250-254
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Publisher:
- New search for: SPIE
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Publication date:1999-01-01
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Size:5 pages
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 2
-
Application of atomic force microscopy to lithography characterization and controlLagus, Mark E. / Marsh, James T. et al. | 1999
- 10
-
High-aspect-ratio depth determination using nondestructive AFMJai Prakash, V.C. / Lagus, Mark E. / Meyyappan, A. / Muckenhirn, Sylvain et al. | 1999
- 20
-
Dimensional metrology with the NIST calibrated atomic force microscopeDixson, Ronald G. / Koening, Rainer G. / Tsai, Vincent W. / Fu, Joseph / Vorburger, Theodore V. et al. | 1999
- 35
-
Quantitative line edge roughness characterization for sub-0.25-μm DUV lithographyKant, Avinash / Talor, George / Samarakone, Nandasiri et al. | 1999
- 43
-
Evaluation of atomic force microscopy: comparison with electrical CD metrology and low-voltage scanning electron microscopyYedur, Sanjay K. / Singh, Bhanwar et al. | 1999
- 53
-
Metrology methods for quantifying edge roughness: IINelson-Thomas, Carla M. / Palmateer, Susan C. / Forte, Anthony R. / Cann, Susan G. / Deneault, S. / Lyszczarz, Theodore M. et al. | 1999
- 64
-
Measuring fab overlay programsMartin, Richard J. / Chen, Xuemei / Goldberger, Itzik et al. | 1999
- 72
-
Supersparse overlay sampling plans: an evaluation of methods and algorithms for optimizing overlay quality control and metrology tool throughputPellegrini, Joseph C. / Hatab, Ziad R. / Bush, Jeffrey M. / Glass, Thomas R. et al. | 1999
- 83
-
Characterizing lens distortion to overlay accuracy by using fine measurement patternChu, Ronfu / Hsu, Chungwei / Hwang, Tsu-wen et al. | 1999
- 95
-
Focus and edge detection algorithms and their relevance to the development of an optical overlay calibration standardFox, Stephen H. / Silver, Richard M. / Kornegay, Edward / Dagenais, Mario et al. | 1999
- 107
-
Alignment and overlay metrology issues for copper/low-K dual-damascene interconnectLai, Kafai / Nelson, Chris / Breen, Mark R. / Doros, Theodore G. / Holladay, Dan W. et al. | 1999
- 116
-
Algorithm implementation and techniques for providing more-reliable overlay measurements and better tracking of the shallow-trench isolation (STI) processSchramm, Doug / Bowles, Dale / Mastovich, Martin E. / Knutrud, Paul C. / Tyurina, Anastasia et al. | 1999
- 123
-
Two-dimensional calibration artifact and measurement methodologySilver, Richard M. / Doiron, Theodore D. / Penzes, William B. / Kornegay, Edward / Fox, Stephen H. / Takac, Michael T. / Rathjen, Stephen C. / Owens, David T. et al. | 1999
- 140
-
Distinguishing dose from defocus for in-line lithography controlAusschnitt, Christopher P. et al. | 1999
- 148
-
Scatterometry for post-etch polysilicon gate metrologyBaum, Christopher C. / Soper, Robert A. / Farrer, Stephen W. / Shohet, J. L. et al. | 1999
- 159
-
Specular spectroscopic scatterometry in DUV lithographyNiu, Xinhui / Jakatdar, Nickhil H. / Bao, Junwei / Spanos, Costas J. / Yedur, Sanjay K. et al. | 1999
- 169
-
Instrumentation of a deep-UV microscope resolving less than 0.15 μmOgino, Katsumi / Mizuno, Jiro / Takeuchi, Atushi / Amemiya, Noboru / Yonezawa, Yasuo / Nihoshi, Toshiaki / Osawa, Hisao / Ooki, Hiroshi et al. | 1999
- 177
-
Sensitivity analysis of fitting for scatterometryLogofatu, Petre-Catalin / McNeil, John R. et al. | 1999
- 184
-
Automatic in-situ focus monitor using line-shortening effectKim, Young-Chang / Yeo, Gisung / Lee, Jae-Han / Kim, Hak / Chung, U-In et al. | 1999
- 194
-
Understanding optical end of line metrologyZiger, David H. / Leroux, Pierre et al. | 1999
- 208
-
New approach to correlating overlay and yieldPreil, Moshe E. / McCormack, John S. et al. | 1999
- 217
-
Characterization and optimization of overlay target design for shallow-trench isolation (STI) processHsu, Stephen / Saw, Jason K. / Busath, Daniel R. et al. | 1999
- 229
-
Comparison of optical, SEM, and AFM overlay measurementJai Prakash, V.C. / Gould, Christopher J. et al. | 1999
- 239
-
Characterization of overlay tolerance requirements for via to metal alignmentAllgair, John A. / Schippers, Mike / Smith, Brad / Elliott, Richard C. / Miller, John D. / Robinson, John C. et al. | 1999
- 250
-
Wafer mapping for stepper effects characterizationZhang, Yuan / Carpio, Ronald A. / Wagner, Lucian / Golubtsov, Peter V. et al. | 1999
- 255
-
Quantification of wafer printability improvements with scanning steppers using new flatness metricsKostoulas, Yiorgos / Tanikawa, Sahra B. / Kallus, David / Goodall, Randal K. et al. | 1999
- 263
-
Effect of the control of global planarity of intermetal dielectric layers on the lithographic process windowKeysar, Shani / Markowitz, Leah / Ben-Gigi, Corin / Tweg, Rama / Margalit-Ilovich, Ayelet / Kepten, Avishai / Wachs, Amir / Shaviv, Roey et al. | 1999
- 272
-
CD-SEM precision: improved procedure and analysisMenaker, Mina et al. | 1999
- 280
-
Multiple CD-SEM matching for 0.18-μm lines/spaces at different exposure conditionsEngelen, Andre / Minnaert-Janssen, Ingrid et al. | 1999
- 291
-
Characteristics of accuracy for CD metrologyBanke, G. W. / Archie, Charles N. et al. | 1999
- 309
-
Contact hole characterization by SEM waveform analysisSutherland, Douglas G. / Veldman, Andrei / Osborne, Zoe A. et al. | 1999
- 315
-
CD-SEM edge width applications and analysisSolecky, Eric P. / Cornell, Roger S. et al. | 1999
- 326
-
Production metrology and control of color filter array photolithography for CMOS imagersYanof, Arnold W. / Daou, A. / Annand, James P. / Pantel, M. / Drowley, Cliff I. / Helbert, John N. / Ygartua, Carlos L. / Hayzelden, Clive et al. | 1999
- 340
-
Ultrasonic monitoring of photoresist processingMorton, Susan L. / Degertekin, F. Levent / Khuri-Yakub, Butrus T. et al. | 1999
- 348
-
Real-time methodologies for monitoring airborne molecular contamination in modern DUV photolithography facilitiesKishkovich, Oleg P. / Kinkead, Devon A. / Higley, John K. / Kirwin, Robert / Piatt, John et al. | 1999
- 377
-
Algorithm for controlling objective lens temperatureChen, Weiming / He, Chao / Liu, Yeyi et al. | 1999
- 382
-
Improved wafer stepper alignment performance using an enhanced phase grating alignment systemNeijzen, Jaap H. M. / Morton, Robert D. / Dirksen, Peter / Megens, Henry J. L. / Bornebroek, Frank et al. | 1999
- 395
-
CD error budget analysis for 0.18-μm inlaid trench lithographyPostnikov, Sergei V. / Sturtevant, John L. / Lucas, Kevin D. / Fu, Chong-Cheng et al. | 1999
- 408
-
Lithography performance indicator (LPI) and a new lumped parameter to derive resist images from aerial imagesLin, Burn J. et al. | 1999
- 415
-
Data analysis for photolithographyMack, Chris A. / Jug, Sven / Legband, Dale A. et al. | 1999
- 435
-
Application of model-based lithographic process control for cost-effective IC manufacturing at 0.13 μm and beyondMonahan, Kevin M. / Lord, Patrick J. / Hayzelden, Clive / Ng, Waiman et al. | 1999
- 447
-
Parameter extraction framework for DUV lithography simulationJakatdar, Nickhil H. / Bao, Junwei / Spanos, Costas J. / Niu, Xinhui / Bendik, Joseph J. / Hill, Stephen L. et al. | 1999
- 457
-
Antireflective coating optimization techniques for sub-0.2-μm geometriesLucas, Kevin D. / Cook, C. / Lee, K. / Vasquez, Jamie A. / Montgomery, B. / Wehmer, K. / Filipiak, Stanley M. / O'Meara, D. / King, Charles F. / Phillips, Anna et al. | 1999
- 468
-
Factors that determine the optimum reduction factor for wafer steppersLevinson, Harry J. / Ackmann, Paul W. / Preil, Moshe E. / Rericha, William T. et al. | 1999
- 480
-
Productive application of voltage contrast for detection of optically undetectable defectsTalbot, Christopher G. / Barnard, Richard / Jamieson, John / Lo, Chiwoei W. / Perez, Pierre / Pindar, Andy et al. | 1999
- 491
-
Method for enhancing topography and material contrast in automatic SEM reviewDotan, Noam et al. | 1999
- 499
-
Methodology for yield enhancement based on the analysis of defects at the lithographic stepKulkarni, Manda / Skumanich, Andrew et al. | 1999
- 511
-
New patterned wafer inspection system with the function to classify fatal defectsIkota, Masami / Sugimoto, Aritoshi / Inoue, Yuko / Nakamura, Hisato et al. | 1999
- 520
-
Defect reduction methodology in the lithography modulePeterson, Ingrid B. et al. | 1999
- 530
-
Application of spatial signature analysis to electrical test data: validation studyKarnowski, Thomas P. / Tobin, Kenneth W. / Gleason, Shaun S. / Lakhani, Fred et al. | 1999
- 542
-
Using laser surface scanning and bare wafer review to diagnose photolithography track developer process-induced defect issuesBond, Linda M. / Fischer, Christine / Satterfield, Michael J. / Sutton, Dan / Turnquest, Karen L. et al. | 1999
- 551
-
Reduction of postdevelop defects and process times for DUV lithographyKrishna, Murthy S. / Gurer, Emir / Lee, Ed C. / Flores, Gary E. / Ooka, Sandra S. / Salois, John W. / Cherry, Royal / Reynolds, Reese M. et al. | 1999
- 560
-
Post-pattern-inspection strategyVaidyanathan, Mouli et al. | 1999
- 565
-
Analysis of adhesion behavior of microresist pattern by direct collapse method with atomic force microscope tipKawai, Akira et al. | 1999
- 576
-
2001 and beyond: a challenge for metrologyRizvi, Syed A. et al. | 1999
- 587
-
Intercomparison of SEM, AFM, and electrical linewidthsVillarrubia, John S. / Dixson, Ronald G. / Jones, Samuel N. / Lowney, Jeremiah R. / Postek, Michael T. / Allen, Richard A. / Cresswell, Michael W. et al. | 1999
- 599
-
Telepresence: a new paradigm for industrial and scientific collaborationPostek, Michael T. / Bennett, Marylyn H. / Zaluzec, Nestor J. et al. | 1999
- 611
-
Novel metrology for measuring spectral purity of KrF lasers for deep-UV lithographyErshov, Alexander I. / Padmabandu, Gunasiri G. / Tyler, Jeremy D. / Das, Palash P. et al. | 1999
- 621
-
Secondary electron spectroscopy for microanalysis and defect reviewJoy, David C. / Khanna, Neeraj / Braski, David et al. | 1999
- 629
-
Matching of different pattern placement metrology systems: an example for practical use of different LMS systems in the inspection process for photomasksStruck, Thomas / Roeth, Klaus-Dieter et al. | 1999
- 635
-
Regional contrast enhancement of SEM imagesGold, Yaron I. et al. | 1999
- 640
-
Inverse scattering approach to SEM linewidth measurementsDavidson, Mark P. / Vladar, Andras E. et al. | 1999
- 650
-
Monte Carlo simulation of charging effects in linewidth metrology: II. On insulator substrateKo, Yeong-Uk / Chung, Myung-Sai et al. | 1999
- 661
-
Determining measurement variation of lens parameters using Monte Carlo simulationsLigthart, Wilco C. et al. | 1999
- 669
-
Modeling and experimental aspects of apparent beam width as an edge resolution measureArchie, Charles N. / Lowney, Jeremiah R. / Postek, Michael T. et al. | 1999
- 688
-
Optical linewidth models: then and nowLarrabee, Robert D. / Silver, Richard M. / Davidson, Mark P. et al. | 1999
- 700
-
Numerical modeling of the excimer beamLin, Ying / Buck, Jesse D. et al. | 1999
- 711
-
Wafer printability simulation accuracy based on UV optical inspection images of reticle defectsPettibone, Donald W. / Ananth, Mohan / Rudzinski, Maciej W. / Watson, Sterling G. / Zurbrick, Larry S. / Liu, Hua-Yu / Karklin, Linard et al. | 1999
- 722
-
CD error sensitivity to "sub-killer" defects at k1 near 0.4Chen, J. Fung / Diachun, Nathan A. / Nakagawa, Kent H. / Socha, Robert J. / Dusa, Mircea V. / Laidig, Thomas L. / Wampler, Kurt E. / Caldwell, Roger F. / Van Den Broeke, Douglas J. et al. | 1999
- 734
-
Direct interferometric phase measurement using an aerial image measurement systemPeng, Song / Hibbs, Michael S. et al. | 1999
- 740
-
Atomic force microscopy: a diagnostic tool (in) for mask making in the coming yearsRizvi, Syed A. / Meyyappan, A. et al. | 1999
- 754
-
Thermal analysis of hot plate resist baking using a lumped capacitance modelZhou, Bo et al. | 1999
- 764
-
Automatic macroinspection systemKomatsu, Koichiro / Omori, Takeo / Kitamura, Toshiaki / Nakajima, Yasuharu / Aiyer, Arun A. / Suwa, Kyoichi et al. | 1999
- 772
-
Defect detection difficulties post TEOS (oxide) depositionVaidyanathan, Mouli et al. | 1999
- 780
-
Defect inspection on CMP process and its applicationNoguchi, Minori N. / Oshima, Yoshimasa / Nishiyama, Hidetoshi / Watanabe, Kenji / Sugimoto, Aritoshi et al. | 1999
- 786
-
Automated high-precision measurement of critical dimensions using the scanning probe microscopeChernoff, Donald A. / Burkhead, David L. et al. | 1999
- 796
-
Image processing for SEMs: is this the way to go for CD metrology?Solecky, Eric P. / Archie, Charles N. et al. | 1999
- 807
-
Optimization of advanced design rule processes utilizing postdevelop patterned-wafer inspectionSkumanich, Andrew / Boyle, John / Snyder, Gary / Yin, Xiaoming et al. | 1999
- 818
-
Application of resolution enhancement techniques in thin film head processingTong, Lijun / Hsiang, Joyce / Gossett, Johnny / Newman, Gary / Abreau, Kelly J. / Chuang, Tzu-chin et al. | 1999
- 830
-
Role of LV-SEM reticle CD measurements on DUV lithographyMarschner, Thomas / Pollentier, Ivan K. / Potoms, Goedele / Jonckheere, Rik M. / Ronse, Kurt G. / Polli, Marco et al. | 1999
- 838
-
High-resolution UV wavelength reticle contamination inspectionKalk, Franklin D. / Volk, William W. / Wiley, James N. / Hou, Ed / Watson, Sterling G. et al. | 1999
- 845
-
High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm wafer technologyBoher, Pierre / Defranoux, Christophe / Bourtault, Sophie / Stehle, Jean-Louis P. et al. | 1999
- 857
-
Accelerated testing technique for evaluating performance of chemical air filters for DUV photolithographic equipmentKishkovich, Oleg P. / Bolgov, Dennis / Goodwin, William et al. | 1999
- 866
-
Developments in optical modeling methods for metrologyDavidson, Mark P. et al. | 1999
- 876
-
Efficiency improvements of offline metrology job creationZuniga, Victor J. / Carlson, Alan / Podlesny, John C. / Knutrud, Paul C. et al. | 1999
- 884
-
Broadband planarizing antireflective coating for i-line, DUV, and 193-nm microlithographic applicationsShao, Xie / Lamb, James E. / Claypool, James B. / Simmons, William J. / Murphy, Earnest C. et al. | 1999
- 895
-
New optimization concepts for photolithography production processesUlieru, Dumitru G. et al. | 1999
- 907
-
Evaluation of impurity migration and microwave digestion methods for lithographic materialsKo, Fu-Hsiang / Hsiao, Li-Tung / Chou, Cheng-Tung / Wang, Mei-Ya / Wang, Tien-Ko / Sun, Yuh-Chang / Cheng, Bor-Jen / Yeng, Steven / Dai, Bau-Tong et al. | 1999
- 918
-
Mask error factor and critical dimension budgets for sub-half-micron CMOS processesArthur, Graham G. / Martin, Brian et al. | 1999
- 930
-
Improved CD-SEM optics with retarding and boosting electric fieldsOse, Yoichi / Ezumi, Makoto / Todokoro, Hideo et al. | 1999
- 940
-
Model considerations, calibration issues, and metrology methods for resist-bias modelsConrad, Edward W. / Cole, Daniel C. / Paul, David P. / Barouch, Eytan et al. | 1999
- 956
-
Improving the accuracy of overlay measurement through wafer sampling map rearrangementHsu, Chungwei / Chu, Ronfu / Chen, Jen H. et al. | 1999
- 965
-
Application of top-down CD-SEM metrology in measuring wafers with resist film thickness of 24 μm with various sidewall profilesDixit, Sunit S. / Liu, Ying / Azordegan, Amir R. et al. | 1999
- 976
-
Resist-profile-dependent photobias and in-line DICD control strategyLee, Chung Y. / Ong, Thian T. / Wen, Ma Wei / Cheng, Alex T. / Shung, Lin Yih et al. | 1999
- 980
-
Improve the accuracy and sensitivity of CD-SEM linewidth measurement for deep-submicron polygate pattern transferMei, Xin / Fan, Ming H. / Cheng, Alex T. et al. | 1999
- 991
-
Pattern measurements of reticles with optical proximity correction assist features using the atomic force microscopeChao, Kuo-Jen / Plano, Robert J. / Kingsley, Jeffrey R. / Chen, J. Fung / Caldwell, Roger F. et al. | 1999
- 1001
-
Precision improvement in diffraction measurement for the one-dimensional grating periodO, Beomhoan / Song, Won Young / Park, Byong Chon / Ko, Yeong-Uk et al. | 1999
- 1009
-
Interferometrical profilometry at surfaces with varying materialsJennewein, Holger / Gottschling, Harald / Ganz, Thomas / Tschudi, Theo T. et al. | 1999
- 1017
-
Toward nanometer accuracy measurementsKramar, John / Amatucci, Edward / Gilsinn, David E. / Jun, Jau-Shi J. / Penzes, William B. / Scire, Fredric / Teague, E. Clayton / Villarrubia, John S. et al. | 1999
- 1029
-
Alignment strategy for metal layers after W-CMPMarokkey, Sajan R. / Tan, Juan Boon / Tak, Yan T. / Cheng, Alex T. et al. | 1999
- 1034
-
Photoresist removal using gaseous sulfur trioxide cleaning technologyDel Puppo, Helene / Bocian, Paul B. / Waleh, Ahmad et al. | 1999