Time-Resolved Optical Observation of Plasma Process in Ultrananocrystalline Diamond/Amorphous Carbon Composite Films Deposition with a Coaxial Arc Plasma Gun (English)
- New search for: Hanada, K.
- New search for: Nishiyama, T.
- New search for: Yoshitake, T.
- New search for: Nagayama, K.
- New search for: Hanada, K.
- New search for: Nishiyama, T.
- New search for: Yoshitake, T.
- New search for: Nagayama, K.
In:
Dry process
;
115-116
;
2009
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ISBN:
- Conference paper / Print
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Title:Time-Resolved Optical Observation of Plasma Process in Ultrananocrystalline Diamond/Amorphous Carbon Composite Films Deposition with a Coaxial Arc Plasma Gun
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Contributors:Hanada, K. ( author ) / Nishiyama, T. ( author ) / Yoshitake, T. ( author ) / Nagayama, K. ( author )
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Conference:International symposium; 31st, Dry process ; 2009 ; Busan, Korea
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Published in:Dry process ; 115-116
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Publisher:
- New search for: Japan Society of Applied Physics
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Publication date:2009-01-01
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Size:2 pages
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Remarks:Also known as DPS 2009. Includes bibliographical references and index.
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Development of Large Area Materials Processing Technologies: High Frequency CCPs for Microelectronics to Web Processing of PolymersYang, Y. / Wang, M. / Shoeb, J. / Kushner, M.J. et al. | 2009
- 3
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Effects of Inductively Coupled Plasma and Substrate Control Parameters on 193 nm Photoresist RougheningTitus, M.J. / Graves, D.B. et al. | 2009
- 5
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Analysis of Plasma-Wall Reactions using Virtual OES Signal during Dielectric EtchingKuboi, N. / Fukasawa, M. / Kawashima, A. / Oshima, K. / Nagahata, K. / Tatsumi, T. et al. | 2009
- 7
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EEDf of the DC+RF Hybrid and its Effects on Etching ProcessChen, L. / Xu, L. / Funk, M. et al. | 2009
- 9
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Cylinder Rod Surface Coating using Sputtering Deposition Method with Modulated Magnetic FieldKawasaki, H. / Shibahara, K. / Ohshima, T. / Yagyu, Y. / Suda, Y. et al. | 2009
- 11
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Investigation of the Scalability of TiN Barrier Layer for Advanced Si-ProcessingZhang, G. / Yoo, W.J. et al. | 2009
- 13
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Chemical Sputtering of Chlorinated GaNHarafuji, K. / Kawamura, K. et al. | 2009
- 15
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Effect of Ar/O~2 Ion-beam Treatment on the Interfacial Adhesion and Chemical Reaction between Sputter-deposited Cu film and FR-4 SubstrateMin, K.-J. / Park, S.-C. / Lee, G.-H. / Lee, K.-W. / Kim, J.-D. / Kim, D.-G. / Park, Y.-B. et al. | 2009
- 17
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Effect of Bonding Temperature and Post-Annealing Conditions on Cu-Cu Bonding Quality for 3-D IC IntegrationJang, E.-J. / Kim, J.-W. / Kim, B. / Matthias, T. / Hyun, S. / Lee, H.-J. / Park, Y.-B. et al. | 2009
- 19
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Reduction of Fluorinated Al~2O~3 by Irradiating H~2 and O~2 PlasmasMiwa, K. / Takada, N. / Sasaki, K. et al. | 2009
- 21
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Chamber Surface Control for Process StabilityChiba, Y. / Matsumoto, T. / Terahara, M. / Kokura, H. / Harada, F. / Hasegawa, A. et al. | 2009
- 23
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Effects of Argon Plasma Surface Modification on Peel Strength of Woven Type Ultra High Molecular Weight PolyethyleneHuang, C.Y. / Wu, J.Y. / Lin, S.K. / Tsai, C.S. / Chen, K.N. / Yeh, J.T. et al. | 2009
- 25
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Effect of Surface Roughness on Secondary Electron Emission of Diamond in Ne PlasmaMisu, T. / Ono, S. / Goto, M. / Arai, T. et al. | 2009
- 27
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Investigation of Photoresist Surface Modified Layer by Fluorocarbon Ion BombardmentTakeuchi, T. / Sekine, M. / Toyoda, H. / Takeda, K. / Hori, M. / Kang, S.-Y. / Sawada, I. et al. | 2009
- 29
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Combinatorial Analysis of Plasma-Materials Interactions for Advanced R&D of Future Nano DevicesSetsuhara, Y. / Cho, K. / Takenaka, K. / Shiratani, M. / Sekine, M. / Hori, M. et al. | 2009
- 31
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Preparation and Characteristics of `Nafion-like' Plasma Polymerized MembraneJiang, Z. / Yu, X. / Meng, Y. / Jiang, Z.-J. / Shi, Y. / Corr, C. / Boswell, R. / Charles, C. / Nagatsu, M. et al. | 2009
- 33
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Dust Particles Formed owing to Interactions between H~2 or D~2 Helicon Plasmas and GraphiteMiyata, H. / Iwashita, S. / Yamada, Y. / Koga, K. / Shiratani, M. et al. | 2009
- 35
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Nano-Surface Chemical Bonding States Analysis of Plasma-Exposed Polymers with Hard X-Ray Photoelectron SpectroscopySetsuhara, Y. / Cho, K. / Shiratani, M. / Sekine, M. / Hori, M. / Ikeitaga, E. / Nakatsuka, O. / Zaima, S. et al. | 2009
- 37
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Modification for Adsorption Property of Active Carbon Surface Preliminarily Treated by Polyvinylalcohol using Microwave Cold PlasmaUeshima, M. / Toda, E. / Nakajima, Y. / Sugiyama, K. et al. | 2009
- 39
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Inductively Coupled Plasma Reactive Ion Etching of Gallium Indium Zinc Oxide Thin Films in Cl~2/Ar Gas MixLee, D.Y. / Xiao, Y.B. / Kim, E.H. / Chung, C.W. et al. | 2009
- 41
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Improvement of Surface Roughness in SOI Wafer Fabrication using Cl2-based Neutral Beam EtchingMin, T.H. / Yeon, J.K. / Park, B.J. / Kang, S.K. / Jeon, M.H. / Yeom, G.Y. et al. | 2009
- 43
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FinFET Metal Gate Hi-k Etch for Sub-32nm TechnologyKamarthy, G. / Lo, G. / Orain, I. / Kimura, Y. / Deshpande, R. / Yamaguchi, Y. / Lee, C. / Braly, L. et al. | 2009
- 45
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Atomic-scale Cellular Model and Profile Simulation of Si Etching: Analysis of Profile Anomalies and Microscopic UniformityTsuda, H. / Mori, M. / Eriguchi, K. / Ono, K. et al. | 2009
- 47
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Metal Gate High-k Etch Challenges and SolutionsKamarthy, G. / Orain, I. / Kimura, Y. / Kabansky, A. / Ozzello, A. / Braly, L. et al. | 2009
- 49
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Large Area Negative Ion Source Based on Matrix ECR Cells for Fast Silicon EtchingStamate, E. / Lacoste, A. et al. | 2009
- 51
-
Lateral Relation of Epitaxial Thin Film with Large Lattice Mismatch on Samples Prepared by YAG Laser DepositionKaneko, S. / Akiyama, K. / Ito, T. / Yasui, M. / Soga, M. / Hirabayashi, Y. / Funakubo, H. / Yoshimoto, M. et al. | 2009
- 53
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Estimation of the Branching Ratios of Electron Impact Dissociation of Fluorocarbon CompoundsKang, S.-Y. / Sawada, I. et al. | 2009
- 55
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Modeling of Particle Growth in Pulsed PCVD Process for Preparation of High-Quality Thin FilmsKim, D.-J. / Nguyen, T.D. / Kim, K.-S. et al. | 2009
- 57
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Development of High-Density Radio Frequency Plasma Source with Ring-Shaped Hollow Electrode for Dry ProcessingOhtsu, Y. / Urasaki, H. / Misawa, T. / Fujita, H. et al. | 2009
- 59
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Investigation of the Inductively Coupled Plasma Source with a Ni-Zn Ferrite ModuleGweon, G.H. / Kim, K.N. / Lim, J.H. / Hong, S.P. / Yeom, G.Y. et al. | 2009
- 61
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Polyimide Film Etching by an Atmospheric-Pressure μPlasma using a 100-μm- phi (variant) SUS PipeYoshiki, H. et al. | 2009
- 63
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Monitoring of Growth and Removal of Hydrocarbon Thin Films by Optical Reflectance InterferenceUehara, K. / Shinohara, M. / Matsuda, Y. et al. | 2009
- 65
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Thin Film Transistors with Amorphous IGZO Semiconductor Fabricated by DC Magnetron SputteringKim, W.-S. / Moon, Y.-K. / Lee, S. / Kang, B.-W. / Kim, K.-T. / Park, J.-W. et al. | 2009
- 67
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Corrosion Properties of CrNTiN Multi-Coating on 316L Stainless Steel for Bipolar Plate in Polymer Electrolyte Membrane Fuel Cell ApplicationNam, N.D. / Song, J.S. / Kim, J.G. et al. | 2009
- 69
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Deposition of a Carbon Nanocomposite Film using Magnetron SputteringTsutsumi, T. / Takada, N. / Nafarizal, N. / Sasaki, K. et al. | 2009
- 71
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Selective Epitaxial Growth of Silicon for Vertical Diode Application and Its Practical SelectivityLee, K.-S. / Park, S.-J. / Han, J.-J. / Hyung, Y.-W. / Kim, S.-S. / Kang, C.-J. / Moon, J.-T. / Jeong, H.-S. / Choi, B.-D. et al. | 2009
- 73
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A Improvement Model For a Lower Leakage Current of Oxide-Nitride-Oxide (ONO) Inter-Poly Dielectrics Through Post Plasma Oxidation TreatmentLee, W. / Jee, J. / Bok, J. / Hyung, Y. / Kim, S. / Kang, C.-J. / Moon, J.-T. / Kim, K.-S. / Roh, Y. et al. | 2009
- 75
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Studies on the Characterization of Polystyrene Films Prepared by RF Plasma CVD ProcessChoudhury, A.J. / Chutia, J. et al. | 2009
- 77
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Fabrication of Tungsten Oxide Thin Film on the Flexible Substrate using RF Magnetron Sputtering in Ar/O~2 Mixture GasMatsunaga, T. / Ohshima, T. / Kawasaki, H. / Yagyu, Y. / Suda, Y. et al. | 2009
- 79
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Characterization of Double Interfaces System (Si~3N~4/SiO~2/Si and SiO~2/Si~3N~4/Si) Grown by ALDKang, S.K. / Rha, S.K. / Seo, J.H. / Lee, Y.S. / Lee, W.J. et al. | 2009
- 81
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Epitaxial Growth of beta -FeSi~2 Thin Film on SiC by Co-Sputtering of Iron and SiliconAkiyama, K. / Kaneko, S. / Kadowaki, T. / Hirabayashi, Y. et al. | 2009
- 83
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Growth of SnO~2 Thick Films by Plasma Spray Physical Vapor DepositionIizuka, K. / Sekiguchi, S. / Nakamura, K. / Kambara, M. / Yoshida, T. et al. | 2009
- 85
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Preparation and Characterization of Copper Selenide and Indium Selenide Thin Films by MOCVDYoo, J.H. / Yu, S.M. / Lee, J.H. / Choi, C.H. / Yoo, J.B. et al. | 2009
- 87
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Pulsed Supermagnetron Plasma CVD of Amorphous Carbon Nitride FilmsKinoshita, H. / Yamaguchi, A. et al. | 2009
- 89
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Enhancement of the Sidewall Step Coverage of the Sputter-Deposited Film Through the Ideally-Tapered ViaKim, C.G. / Lee, W.J. et al. | 2009
- 91
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Fabrication of CuInSe~2 Thin Film by Metal-Organic Chemical Vapor DepositionYu, S.M. / Yoo, J.H. / Lee, J.H. / Choi, C.-H. / Yoo, J.-B. et al. | 2009
- 93
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Effects of NH~3 Plasma Pretreatment of Ta Substrate on Copper Seed Layer Formation by PE-ALDMoon, D.-Y. / Kim, T.-S. / Kim, B.M. / Kim, J.H. / Park, J.-W. et al. | 2009
- 95
-
Effect of N~2 Gas Flow Ratio in Plasma Enhanced Chemical Vapor Deposition with SiH~4-NH~3-N~2-He Gas Mixture on Stress Relaxation of Silicon NitrideMurata, T. / Miyagawa, Y. / Matsuura, M. / Asai, K. et al. | 2009
- 97
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Monosilane Dissociation Process in Microwave-Excited High-Density H~2/SiH~4 PlasmaAsano, H. / Endo, H. / Ishijima, T. / Toyoda, H. et al. | 2009
- 99
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Porosity Control of Nano-particle Composite Porous Low Dielectric Films using Pulse RF Discharges with Amplitude ModulationIwashita, S. / Miyata, H. / Koga, K. / Matsuzaki, H. / Shiratani, M. / Akiyama, M. et al. | 2009
- 101
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Pressure and Aspect Ratio Dependence of Deposition Profile of Carbon Films on Trench Substrates Deposited by Plasma CVDNomura, T. / Korenaga, Y. / Umetsu, J. / Matsuzaki, H. / Koga, K. / Shiratani, M. / Setsuhara, Y. / Sekine, M. / Hori, M. et al. | 2009
- 103
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Characterics of Preparation Metallic Nanodot by Organ-Metal Solution with Burning MethodMuramoto, I. / Aoqui, S. / Kawasaki, H. / Oosima, T. / Uematsu, T. et al. | 2009
- 105
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Growth of TiO~2 Thin Films on Polypropylene Particles by PCVD ProcessPham, H.C. / Kim, D.-J. / Kim, K.-S. et al. | 2009
- 107
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Synthesis of Si Nanoparticles for Multiple Exciton Generation Solar Cells using Multi-Hollow Discharge Plasma CVDKawashima, Y. / Sato, H. / Koga, K. / Shiratani, M. / Kondo, M. et al. | 2009
- 109
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Plasma-Enhanced ALD Oxide Film by Microwave RLSAOsawa, Y. / Ueda, H. / Horigome, M. / Tanaka, Y. / Nozawa, T. et al. | 2009
- 111
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Growth of Ultrananocrystalline Diamond/Amorphous Carbon Composite Films using a Coaxial Arc Plasma GunHanada, K. / Yoshitake, T. / Nakagawa, Y. / Yoshida, T. / Ohtani, R. / Setoyama, H. / Kobayashi, E. / Sumitani, K. / Okajima, T. / Nagayama, K. et al. | 2009
- 113
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Measurements of Surface Temperature of a-Si:H Films in Silane Multi-Hollow Discharges with IR ThermometerSato, H. / Kawashima, Y. / Nakahara, K. / Koga, K. / Shiratani, M. et al. | 2009
- 115
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Time-Resolved Optical Observation of Plasma Process in Ultrananocrystalline Diamond/Amorphous Carbon Composite Films Deposition with a Coaxial Arc Plasma GunHanada, K. / Nishiyama, T. / Yoshitake, T. / Nagayama, K. et al. | 2009
- 117
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Oxygen Gas Barrier Properties Related with Structure of Hydrogenated Amorphous Carbon Films by ICP-CVDBaek, S.-M. / Shirafuji, T. / Cho, S.-P. / Saito, N. / Takai, O. et al. | 2009
- 119
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Vacuum Ultraviolet Plasma Emission in a Dielectric Etch ReactorHudson, E.A. / Moravej, M. / Block, M. / Sirard, S. / Wei, D. / Takeshita, K. / Jinnai, B. / Samukawa, S. et al. | 2009
- 121
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Nanoprocessing with Cluster Beams-Challenges and OpportunitiesMatsuo, J. et al. | 2009
- 123
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Determination of Precursors for Nitriding Silicon Surface using Inductively-Coupled Nitrogen PlasmaHorikawa, Y. / Kurihara, K. / Sasaki, K. et al. | 2009
- 125
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Optical and Electrical Characterization of H~2 Plasma-Damaged Si Surface Structures and its Impact on In-line MonitoringNakakubo, Y. / Matsuda, A. / Fukasawa, M. / Takao, Y. / Tatsumi, T. / Eriguchi, K. / Ono, K. et al. | 2009
- 127
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Low Damage Resist Strip for Porous SiOCH using 100 MHz / 13.56 MHz DFS CCPImamura, T. / Yamamoto, K. / Sato, K. / Kurihara, K. / Hayashi, H. / Ohiwa, T. et al. | 2009
- 129
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In-situ Evaluation of H~2 Plasma Damage on Porous SiOCH Low-k FilmsYamamoto, H. / Takeda, K. / Sekine, M. / Hori, M. / Kaminatsui, T. / Yamamoto, K. / Hayashi, H. / Sakai, I. / Ohiwa, T. et al. | 2009
- 131
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Wiggling of Porous Dielectric Lines for Advanced Technological Node: from Simulation to ExperimentDucote, J. / David, T. / Posseme, N. / Chevolleau, T. / Bailly, F. / Ostrovsky, A. / Guillermet, M. / Verove, C. / Barbe, J.C. / Inglebert, R.L. et al. | 2009
- 133
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5-P01 Mechanism of Surface Roughening during Porous SiOCH Etching in Fluorocarbon Based PlasmasBailly, F. / David, T. / Chevolleau, T. / Posseme, N. / Joubert, O. / Cardinaud, C. et al. | 2009
- 135
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5-P02 New Approach of Etching Analysis based on Internal Parameters in Combinatorial Plasma ProcessMoon, C.S. / Takeda, K. / Sekine, M. / Setsuhara, Y. / Shiratani, M. / Hori, M. et al. | 2009
- 137
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5-P03 TiO~2 Etching by Atomic Layer Etching with BCl~3 Gas and Ar Neutral BeamKim, Y.Y. / Lim, W.S. / Park, B.J. / Yeom, G.Y. et al. | 2009
- 139
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5-P04 Modification of Porous SiOCH Trench Sidewalls Induced by Reducing and Oxidizing Post Etching Plasma TreatmentsBouyssou, R. / Chevolleau, T. / Posseme, N. / Licitra, C. / David, T. / Ostrovsky, A. / Verove, C. / Joubert, O. et al. | 2009
- 141
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5-P05 Use of RLSA Plasma and HBr Process to Achieve Zero CD-Bias and Pattern Density Independent Multi-layer Mask EtchingOzu, T. / Sasaki, M. / Nozawa, T. et al. | 2009
- 143
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5-P06 Etch Selectivity and Line Edge Roughness during Etching of Hard-Mask Layer with Patterned Extreme Ultra-Violet Resist in Dual-Frequency Capacitively Coupled PlasmasKwon, B.S. / Jung, C.R. / Heo, W. / Park, J.S. / Lee, N.-E. / Lee, S.K. et al. | 2009
- 145
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5-P07 Damage-free Resist Ashing on Low-k Film Using Dual Frequency Capacitively Coupled Ar/O~2 PlasmaMiyawaki, Y. / Takeda, K. / Sekine, M. / Hori, M. et al. | 2009
- 147
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5-P08 Collective Laser Thomson Scattering Diagnostics of Laser Produced Plasmas for EUV Light SourcesTomita, K. / Hyakuta, Y. / Ohara, K. / Uchino, K. et al. | 2009
- 149
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5-P09 Application of a Grad-T Type Thermal Probe to the Discharge PlasmaMatsuura, H. / Nakano, K. / Kado, S. et al. | 2009
- 151
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5-P11 Absorption Measurement of Metal Atom Density in ICP Assisted Sputter-Deposition of Al-doped ZnO Thin FilmsIwata, T. / Shindo, R. / Shinohara, M. / Matsuda, Y. et al. | 2009
- 153
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5-P12 Emission Spectroscopy of Atmospheric Microplasma for Biomedical ApplicationBlajan, M. / Ishii, T. / Yamada, M. / Shimizu, K. et al. | 2009
- 155
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5-P13 Temporal Variation of Hydrogen Atom Spectrum Emitted from Pulsed Microwave Plasma under Atmospheric PressureYang, H. / Ishijima, T. / Toyoda, H. et al. | 2009
- 157
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5-P14 Etching Characteristics and Mechanism of Ga-Doped ZnO Thin Films in Inductively Coupled HBr/Ar/CHF~3 PlasmaHam, Y.-H. / Efremov, A. / Lee, H.-W. / Yun, S.J. / Min, N.K. / Kwon, K.-H. et al. | 2009
- 159
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5-P15 Model-Based Analysis of the Y~2O~3 Etching Mechanism in Inductively Coupled BCl~3/Ar and Cl~2/Ar PlasmasKim, M.-K. / Efremov, A. / Lee, H.W. / Min, N.K. / Park, H.-H. / Kwon, K.-H. et al. | 2009
- 161
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5-P16 Microwave Resonance Probes for Diagnostics of High Pressure PlasmasNakamura, K. / Xu, J. / Zhang, Q. / Sugai, H. et al. | 2009
- 163
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5-P17 Measurements of Electron Density in SiH~4+H~2 Multi-Hollow Discharges using a Frequency Shift ProbeNakahara, K. / Kawashima, Y. / Sato, H. / Koga, K. / Shiratani, M. et al. | 2009
- 165
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5-P18 Laser Thomson Scattering Studies of Pulse Filament DischargesTomita, K. / Yamagata, Y. / Uchino, K. et al. | 2009
- 167
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5-P19 Hybrid White Organic Light-Emitting Diodes for Reduced Efficiency Roll-offSeo, J.H. / Park, J.S. / Koo, J.R. / Seo, B.M. / Lee, K.H. / Park, J.K. / Yoon, S.S. / Kim, Y.K. et al. | 2009
- 169
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5-P20 Modified Julolidine-Containing Emitters for Red Organic Light-Emitting DiodesPark, M.H. / Lee, K.H. / Kim, S.M. / Kim, Y.K. / Yoon, S.S. et al. | 2009
- 171
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5-P21 Amorphous Indium-Gallium-Zinc-Oxide Thin Film Transistor Fabricated on Plasma Treated Silicon NitrideMoon, Y.-K. / Kim, W.-S. / Kang, B.-W. / Lee, S. / Park, J.-W. et al. | 2009
- 173
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5-P22 Basic Study of Surface Treatment at Low Discharge Voltage by Atmospheric MicroplasmaShimizu, K. / Umeda, A. / Blajan, M. et al. | 2009
- 175
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5-P24 Color Stability and High Efficiency White Phosphorescent Organic Light-Emitting Diodes with Proper Position of Phosphorescent Red EmitterPark, J.S. / Seo, J.H. / Koo, J.R. / Seo, B.M. / Lee, K.H. / Park, J.K. / Yoon, S.S. / Kim, Y.K. et al. | 2009
- 177
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5-P25 Improvement of CVD SiO~2 by SPA Plasma TreatmentShiozawa, T. / Katayama, D. / Tamura, D. / Kabe, Y. / Kobayashi, T. / Sato, Y. / Hirota, Y. / Yamamoto, N. et al. | 2009
- 179
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5-P26 Green Phosphorescent Organic Light-Emitting Diodes with Simplified Device ArchitectureSeo, J.H. / Jin, Y.Y. / Choi, E.Y. / Kim, H.M. / Kim, J.H. / Kim, Y.K. et al. | 2009
- 181
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5-P27 Highly Efficient Phosphorescent OLEDs using Red Emitting Ir(III) Complexes with Acetylated Phenylpyridine LigandsLee, K.H. / Kang, H.J. / Park, J.K. / Lee, S.J. / Seo, J.H. / Kim, Y.K. / Yoon, S.S. et al. | 2009
- 183
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5-P28 Titanium Oxide Thin Films Prepared by Plasma Enhanced Atomic Layer Deposition using Remote ECR Plasma for OLED DevicesKang, B.-W. / Kim, W.-S. / Moon, D.-Y. / Park, J.-G. / Park, J.-W. et al. | 2009
- 185
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5-P29 Efficient Solution-Processed Small Molecular Green Phosphorescent Organic Light-Emitting Diodes by Mixed the Polymer HostJin, Y.Y. / Seo, J.H. / Kim, H.M. / Choi, E.Y. / Kim, J.H. / Je, J.-T. / Kim, Y.K. et al. | 2009
- 187
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5-P30 Synthesis and Electroluminescent Properties of Blue Fluorescent Bis(diarylaminophenyl)bianthryls for OLEDsYou, J.N. / Lee, K.H. / Lee, W.C. / Park, J.S. / Seo, J.H. / Kim, Y.K. / Yoon, S.S. et al. | 2009
- 189
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5-P31 Interaction of Hydrogen Plasma with Nanodispersed Iron-Carbon CompositesSavitsky, A.A. / Drozdovich, V.B. / Pan kov, V.V. / Zhylinski, V.V. / Zhdanok, S.A. et al. | 2009
- 191
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5-P32 Synthesis and Electroluminescence of an Ir-Complex with a Phosphino-benzoimidazoleTrinh, D.H. / Choi, G.-C. / Kwon, Y.-S. / Lee, B.-J. et al. | 2009
- 193
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5-P33 Effect of RF Plasma on Reduction of Allergen SubstanceYagyu, Y. / Hayashi, N. / Kawasaki, H. / Ohshima, T. / Suda, Y. et al. | 2009
- 195
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5-P34 Decomposition of Second Order Structure of Proteins Using RF Oxygen PlasmaHayashi, N. / Kitazaki, S. / Kawaguchi, R. / Hao, L. / Goto, M. et al. | 2009
- 197
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5-P35 Sterilization of Tube Inner Surface using Oxygen and Water Vapor PlasmasKitazaki, S. / Hayashi, N. et al. | 2009
- 199
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5-P36 Composition and Crystalline Properties of TiNi Thin Films Prepared by PLD under Vacuum and in Ambient Ar GasCha, J.O. / Joong, I.H. / Sakai, J. / Nam, T.H. / Ahn, J.S. et al. | 2009
- 201
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5-P37 Improved Light Extraction Efficiency of GaN-Based Light Emitting Diodes using Al Doped ZnO Current Spreading LayersKong, B.H. / Han, W.S. / Woo, C.H. / Bae, Y.S. / Cho, H.K. / Kim, M.Y. / Choi, R.J. et al. | 2009
- 203
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5-P38 Ar / H~2 Plasma Cleaning Effect on Electroless Ni Plating for Micro-Bump FormationIkeda, A. / Kajiwara, K. / Watanabe, N. / Asano, T. et al. | 2009
- 205
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5-P39 Electrochemical Characterization of O~2 Plasma Functionalized MWCNT Electrode for L. Pneumophila DNA SensorPark, E.J. / Lee, J.-Y. / Kim, J.H. / Lee, C.J. / Min, N.K. et al. | 2009
- 207
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5-P40 Synthesis of Carbon Nanoflakes by Radio-Frequency Sputtering and Their Field Emission CharacteristicsShih, W.-C. / Jeng, J.-M. / Tsou, C.-W. / Lo, J.-T. / Chen, H.-C. / Lin, I.-N. et al. | 2009
- 209
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5-P41 Enhancement Mechanisms of the Color Purity in Deep Blue Organic Light-Emitting Devices Fabricated Utilizing an Emitting Layer Containing Mixed Fluorescence and Phosphorescence Host MaterialsBang, H.S. / Choo, D.C. / Kim, T.W. / Seo, J.H. / Kim, Y.K. et al. | 2009
- 211
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5-P42 Electro-Optical Characteristics of a Pulse Driven Micro-Electrical Discharge Machining for Drilling of Hybrid CNT/Al~2O~3 NanocompositesHa, C.-S. / Kim, D.-H. / Lee, H.-J. / Lee, H.J. / Lee, D.-Y. / Tak, H.-S. / Kang, M.C. et al. | 2009
- 213
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5-P43 TOC Evaluation of Organic Solute Treated by Microwave-Excited Bubble PlasmaSaito, R. / Sugiura, H. / Ishijima, T. / Toyoda, H. et al. | 2009
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5-P44 Beveling of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaSano, Y. / Kato, T. / Yamamura, K. / Mimura, H. / Matsuyama, S. / Yamauchi, K. et al. | 2009
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5-P45 Improvement of Thickness Uniformity of SOI Layer by Numerically Controlled Sacrificial Oxidation using Atmospheric-Pressure Plasma with Electrode Array SystemKamisaka, S. / Sano, Y. / Mimura, H. / Matsuyama, S. / Yamauchi, K. et al. | 2009
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5-P46 DBD Plasma Produced in a Closed Container Used for Bacterial InactivationChiper, A.S. / Chen, W. / Mejlholm, O. / Dalgaard, P. / Stamate, E. et al. | 2009
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5-P47 Effect of the Pulse Modulation Frequency on Silicon Etching using an Atmospheric-Pressure ICP MicrojetTajima, S. / Tsuchiya, S. / Ichiki, T. et al. | 2009
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5-P48 Melt-Molding of Uniaxially-Oriented Crystal Domains onto a SubstrateYamao, T. / Juri, K. / Sakaguchi, T. / Kuriki, H. / Kamoi, A. / Hotta, S. et al. | 2009
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5-P49 Atomic Scale Etch Depth Control of III-V Compound Materials using Atomic Layer EtchingLim, W.S. / Kim, Y.Y. / Park, B.J. / Yeom, G.Y. et al. | 2009
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5-P50 Analysis of Non-Thermal Plasma Deposited Zinc Oxide Thin FilmMansur, M.R. / Penkov, O.V. / Plaksin, V.Y. / Beom, J.S. / Kim, J.H. / Lee, H.-J. et al. | 2009
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5-P51 Selective Growth Process and Formation Mechanism of Biexcitonic Zinc DimmersObara, K. / Hamasaki, M. / Obara, M. / Yamaguchi, M. / Kuwayama, M. / Kawabata, J. / Manaka, H. et al. | 2009
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5-P52 Thick Gate Oxide Integrity Degradation in Lithography and Wet Cleaning ProcessSu, H.-F. / Wei, A.-C. / Lian, N.-T. / Yang, T. / Chen, K.-C. / Lu, C.-Y. et al. | 2009
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5-P53 Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Electroless-plated Ni and PolyimidePark, S.-C. / Min, K.-J. / Lee, K.-H. / Jeong, Y. / Park, Y.-B. et al. | 2009
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Three-Dimensional Integration Technology Using Self-Assembly TechniqueKoyanagi, M. et al. | 2009
- 237
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Role of Radical Reaction in Non-Bosch TSV EtchingMaruyama, T. / Narukage, T. / Onuki, R. / Yonekura, K. / Fujiwara, N. et al. | 2009
- 239
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Dry-Etch Fin Patterning on SOI: Transition from 32 to 22 nm Node on a 6T-SRAM CellAltamirano-Sanchez, E. / Ercken, M. / Veloso, A. / Demand, M. / Boullart, W. et al. | 2009
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Advanced Gate Dimension Control for R2R Loop Implementation in an Industrial EnvironmentBabaud, L. / Gouraud, P. / Pargon, E. / Joubert, O. et al. | 2009
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Multi-layer Stacking Technology using Direct Connection between TSV and BumpMiyakawa, N. / Hashimoto, E. / Maebashi, T. / Nakamura, N. / Sacho, Y. / Nakayama, S. / Toyoda, S. et al. | 2009
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Analyses of Surface Reaction on Cellulose and Gycine Treated in Atmospheric Microwave-Excited Plasmas for Elucidating the Mechanism of SterilizationYoshida, S. / Ogawa, T. / Fukuda, T. / Takahashi, K. / Urayama, T. / Aoki, S. et al. | 2009
- 247
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Growth of the SiN Nanoparticles by using Plasma Etching and the Application for the Solar CellsYang, C. / Ryu, S.-H. / Yoo, W.-J. / Park, Y.-J. / Kim, J.M. et al. | 2009
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Etching Magnetic Tunnel Junction with Metal EtchersKinoshita, K. / Utsumi, H. / Suemitsu, K. / Hada, H. / Sugibayashi, T. et al. | 2009
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Formation of Cobalt and Cobalt-Slicide Nanodots on ultrathin SiO~2 Induced by Remote Hydrogen PlasmaKawanami, A. / Makihara, K. / Ikeda, M. / Miyazaki, S. et al. | 2009
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Innovative Technologies for New Semiconductor EraKang, C.-J. / Kim, Y.-J. / Shin, K.-S. et al. | 2009
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Three-dimensional Modeling of Plasma Processing EquipmentRauf, S. / Kenney, J. / Chen, Z. / Collins, K. et al. | 2009
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Tilting Control at Wafer Edge by Biasing to Focus Ring in UHF-ECR Dielectric Etching ApparatusMaeda, K. / Yokogawa, K. / Ichino, T. / Tamura, T. / Hirozane, K. / Kanekiyo, T. / Izawa, M. et al. | 2009
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Fine Ion Energy Control for Sub-32 nm Node Device RIE using Pulsed-DC Superimposed 100 MHz rf CCPHayashi, H. / Ui, A. / Kaminatsui, T. / Yamamoto, K. / Kikutani, K. / Sakai, I. / Ohiwa, T. et al. | 2009
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Formation of High Quality SiO~2 and SiO~2/Si Interface using Thermal Plasma Jet Induced Millisecond Annealing and Post-Metallization AnnealingHiroshige, Y. / Higashi, S. / Matsumoto, K. / Miyazaki, S. et al. | 2009
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Linewidth Roughness Transfer during Gate Stack Patterning with Amorphous Carbon Mask: Impact of Cure and Trim ProcessesPargon, E. / Azarnouche, L. / Martin, M. / Luere, O. / Menguelti, K. / Gouraud, P. / Joubert, O. et al. | 2009
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Investigation of Mask Distortion during TrimmingKofuji, N. / Miura, H. et al. | 2009
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Threshold Voltage Instability Induced by Plasma Process Damage in Advanced MOSFETsEriguchi, K. / Nakakubo, Y. / Matsuda, A. / Kamei, M. / Takao, Y. / Ono, K. et al. | 2009