A high-performance Echelle grating de-multiplexer based on two stigmatic points and its flat-top solution (English)
- New search for: Zhang, Y.
- New search for: Schneider, M.
- New search for: Karnick, D.
- New search for: Eisenblätter, L.
- New search for: Kühner, T.
- New search for: Weber, M.
- New search for: Zhang, Y.
- New search for: Schneider, M.
- New search for: Karnick, D.
- New search for: Eisenblätter, L.
- New search for: Kühner, T.
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In:
Optical Interconnects XX
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112860Y-112860Y-7
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2020
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ISBN:
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ISSN:
- Conference paper / Print
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Title:A high-performance Echelle grating de-multiplexer based on two stigmatic points and its flat-top solution
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Contributors:Zhang, Y. ( author ) / Schneider, M. ( author ) / Karnick, D. ( author ) / Eisenblätter, L. ( author ) / Kühner, T. ( author ) / Weber, M. ( author )
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Conference:Optical Interconnects XX
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Published in:Optical Interconnects XX ; 112860Y-112860Y-7Proceedings of SPIE, the International Society for Optical Engineering ; 11286 ; 112860Y-112860Y-7
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Publisher:
- New search for: SPIE
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Publication date:2020-01-01
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Size:112860Y-112860Y-7
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Source:
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Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 112860A
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Detachable 1x8 single mode optical interface for DWDM microring silicon photonic transceiversMathai, Sagi / Rosenberg, Paul / Panotopoulos, George / Kurtz, Dan / Childers, Darrell / Van Vaerenbergh, Thomas / Sun, Peng / Hulme, Jared / Rhim, Jinsoo / Seyedi, Ashkan et al. | 2020
- 112860C
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Low cutoff G.657-compatible fiber for data center interconnects operating in the 1064 and 1310 nm windowsBickham, Scott R. / Tandon, Pushkar / Mishra, Snigdharaj K. / Li, Ming-Jun / Simpanen, Ewa / Lengyel, Tamás / Gustavsson, Johan S. / Larsson, Anders et al. | 2020
- 112860D
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MT-ferrule compatible passive optical coupling for single-mode polymer waveguide in co-packaged opticsNoriki, A. / Amano, T. et al. | 2020
- 112860E
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Fiber-optic interconnect technologiesNagase, Ryo et al. | 2020
- 112860F
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Automated PM-fiber array assembly with high-precision four DOF alignmentBerger, M. / Alippi, A. / Haag, S. / Hoeren, M. / Müller, Tobias / Zontar, D. / Brecher, C. et al. | 2020
- 112860G
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Modular lensed-ferrule solution for single-mode fiber connectorsTonini, Andrea / Coggi, Victor et al. | 2020
- 112860H
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Bridging the gap: manufacturing optical transceivers in the multibillion-dollar silicon electronics supply chainSchmidt, Theodore J. / Marcoccia, Roberto R. et al. | 2020
- 112860I
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Polymer interposer for efficient light coupling into 3 μm silicon-on-insulator waveguidesHiltunen, Marianne / Harjanne, Mikko T. / Vehmas, Tapani / Wälchli, Ben / Heimala, Päivi / Aalto, Timo et al. | 2020
- 112860K
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Bending loss improvement and twisting loss studies of flexible multimode polymer waveguidesShi, F. / Bamiedakis, N. / Penty, R. V. / White, I. H. / Chu, D. et al. | 2020
- 112860L
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Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applicationsWachholz, P. / Wolf, J. / Marx, S. / Weber, D. / Klein, J. / Schröder, H. et al. | 2020
- 112860M
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Integrated silicon photonics for high-volume data center applicationsBlum, Robert et al. | 2020
- 112860N
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Integrated photonic chip to chip interconnection utilising grating coupler technologyPashkova, Tatiana / O'Brien, Peter et al. | 2020
- 112860O
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High-speed and power-efficient beam-steering using 1x16 silicon optical phased array with electro-optic phase shiftersKang, Geumbong / Lee, Dae-Seong / Yoon, Hyeonho / Park, Hyo-Hoon et al. | 2020
- 112860P
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Building blocks of a scalable and radiation-hardened integrated transmitter unit based on 250 nm SOIZhang, Y. / Schneider, M. / Karnick, D. / Eisenblätter, L. / Kühner, T. / Weber, M. et al. | 2020
- 112860Q
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Design modifications to an existing high-density mid-board optical engine to survive harsh environmentsBurt, Kevin / Lee, Raymond / LaCroix, Louis et al. | 2020
- 112860R
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Short reach, low cost silicon photonic micro-transceivers for embedded and co-packaged system integrationKurata, Kazuhiko / Pitwon, Richard et al. | 2020
- 112860S
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Integrated optical receiver module with demultiplexer for chip-to-chip optical interconnectsNguyen, Nga T. H. / Ukaegbu, Ikechi Augustine / Sangirov, Jamshid / Park, Hyo-Hoon et al. | 2020
- 112860T
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Injection molded low-thermal-expansion multi-fiber ferruleNeukirch, Ulrich W. / Dockchoorung, Woraphat / Smith, Stephen Q. / Bellman, Robert A. / Marin, Esteban / Childers, Darrell / Hastings, DJ et al. | 2020
- 112860U
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Low-voltage modulators using thin-film lithium niobateAhmed, Abu Naim R. / Shi, Shouyuan / Nelan, Sean / Mercante, Andrew J. / Yao, Peng / Prather, Dennis W. et al. | 2020
- 112860W
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Comparison of three monolithically integrated TIA topologies for 50 Gb/s OOK and PAM4Andrade, Hector / Maharry, Aaron / Hirokawa, Takako / Valenzuela, Luis / Simon, Stefan / Schow, Clint L. / Buckwalter, James F. et al. | 2020
- 112860X
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Strain-engineered group IV light sources for photonic-integrated circuitsNam, Donguk et al. | 2020
- 112860Y
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A high-performance Echelle grating de-multiplexer based on two stigmatic points and its flat-top solutionZhang, Y. / Schneider, M. / Karnick, D. / Eisenblätter, L. / Kühner, T. / Weber, M. et al. | 2020
- 112861A
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High-speed data transmission system using silicon-based optical phased arrayRhee, Hyun-Woo / You, Jong-Bum / Han, Kyeongjin / Park, Hyo-Hoon et al. | 2020
- 112861C
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Metallic optical benches with stamped micro-mirrors for photonic assemblies and optical interconnectsChen, Yang / Hii, King-Fu / Vallance, R. Ryan et al. | 2020
- 1128601
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Front Matter: Volume 11286| 2020
- 1128602
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Optical interconnects in enterprise and hyperscale datacentersPiehler, David et al. | 2020
- 1128603
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Market and industrial trends of optical interconnectLee, Bernard et al. | 2020
- 1128604
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Intra-satellite optical interconnect space market and technical challengesBlanchette, Guillaume / Sanadgol Nezami, Mohammadreza / Rolston, David / Reid, Benoit et al. | 2020
- 1128605
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Nanoseconds photonic integrated switches for optical data center interconnect systemsCalabretta, N. / Prifti, Kristif / Xue, Xuwei / Yan, Fulong / Pan, Bitao / Guo, Xiaotao et al. | 2020
- 1128606
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Board- and rack-scale optical interconnection architectures for disaggregated data centersTerzenidis, N. / Moralis-Pegios, M. / Pitris, S. / Mourgias-Alexandris, G. / Mitsolidou, C. / Fotiadis, K. / Vyrsokinos, K. / Alexoudi, T. / Pleros, N. et al. | 2020
- 1128607
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Photonic plug for scalable silicon photonics packagingIsrael, Abraham / Ulfan, Faivush / Pascar, Leonid / Menezo, Sylvie / Wilmart, Quentin / Malhouitre, Stephane / Wang, Ying / Li, Chao / Lo, Patrick Guo Qiang / Taha, Hesham et al. | 2020
- 1128610
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Packaging challenges for next-generation high bandwidth opto-electrical switch modulesJanta-Polczynski, Alexander / Cyr, Elaine / Langlois, Richard / Boyer, Nicolas / Fortier, Paul et al. | 2020
- 1128612
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Ring-assisted Mach-Zehnder interferometer switch with multiple rings per switch elementHirokawa, Takako / Saeidi, Mitra / Theogarajan, Luke / Saleh, Adel A. M. / Schow, Clint L. et al. | 2020
- 1128614
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Chip level fiber couplingMöller, Ch. / Ortlepp, H.-G. / Käpplinger, I. / Neckermann, K. / Ortlepp, T. et al. | 2020
- 1128617
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Optical interconnects for datacenter links: design and modeling challengesRichter, André / Dris, Stefanos / Koltchanov, Igor / Alreesh, Saleem / Yevseyenko, Dmitry / Sokolov, Eugene et al. | 2020