A silicon nitride etch process with high oxide silicon dioxide selectivity (French)
- New search for: Powell, K.
- New search for: Puttock, M. S.
- New search for: Iacopi, A.
- New search for: Smart, A.
- New search for: Powell, G.
- New search for: Huq, T.
- New search for: Shannon, J.
- New search for: Clausen, M.
- New search for: Powell, K.
- New search for: Puttock, M. S.
- New search for: Iacopi, A.
- New search for: Smart, A.
- New search for: Powell, G.
- New search for: Huq, T.
- New search for: Shannon, J.
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In:
VIDE -PARIS-
;
51
, 275//s1
;
504-507
;
1995
-
ISSN:
- Article (Journal) / Print
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Title:A silicon nitride etch process with high oxide silicon dioxide selectivity
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Contributors:Powell, K. ( author ) / Puttock, M. S. ( author ) / Iacopi, A. ( author ) / Smart, A. ( author ) / Powell, G. ( author ) / Huq, T. ( author ) / Shannon, J. ( author ) / Clausen, M. ( author )
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Published in:VIDE -PARIS- ; 51, 275//s1 ; 504-507
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Publisher:
- New search for: DIVISION DE LA SOCIETE FRANCAISE DU VIDE
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Publication date:1995-01-01
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Size:4 pages
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ISSN:
-
Type of media:Article (Journal)
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Type of material:Print
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Language:French
- New search for: 634.8 / 663.2
- Further information on Dewey Decimal Classification
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Classification:
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© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 51, Issue 275//s1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Self-consistent numerical models of low pressure radio frequency dischargesBelenguer, P. / Boeuf, J. P. et al. | 1995
- 7
-
Determination des fonctions de distribution en energie des electrons dans des plasmas RFd'argon et d'argon-propaneHallil, A. / Loretz, J. C. / Despax, B. et al. | 1995
- 11
-
Correlation between the TiCN deposition and the optical emission spectroscopy in an ARC plasma reactorSultan, G. / Baravian, G. / Damond, E. / Detour, H. / Hayaud, C. / Jacquot, P. et al. | 1995
- 16
-
Study of the SF~6/N~2 Plasma mixtures in the presence of the target polyethyleneCourtot, A. / Arefi-Khonsari, F. / Amouroux, J. et al. | 1995
- 21
-
Plasma diagnostics for efficient process development: Langmuir probe, QMS, EROESNeumann, G. / Hoffmann, P. / Heinrich, F. et al. | 1995
- 27
-
Applicateurs de champs micro-onde de configuration lineaire pour le traitement par plasma de grandes surfacesMoisan, M. / Zakrzewski, Z. et al. | 1995
- 32
-
Production of active species in N~2-H~2 D.C. and H.F. flowing dischargeBockel, S. / Baravian, G. / Ricard, A. et al. | 1995
- 36
-
Kinetic of atomic hydrogen in an expanding magnetized low-pressure plasmaQing, Z. / Otorbaev, D. K. / Eerden, M. J. J. / Brussaard, G. J. H. / Van de Sanden, M. C. M. / Schram, D. C. et al. | 1995
- 40
-
Retarding field energy analyser measurements in low pressure plasmaRanson, P. / Lefaucheux, P. et al. | 1995
- 44
-
P.I.C.-M.C. Simulations of a methane asymmetric RF dischargeBriaud, P. / Rhallabi, A. / Turban, G. et al. | 1995
- 48
-
Characterization of oxygen plasmas in a helicon reactor to be used for SiO~2 depositionNicolazo, F. / Granier, A. / Perry, A. J. / Goullet, A. / Turban, G. / Grolleau, B. et al. | 1995
- 52
-
Silicon nitride deposition by direct UV- enhanced chemical vapour deposition and interface control of InP with in-situ ellipsometryHow Kee Chun, L. S. / Courant, J. L. / Post, G. et al. | 1995
- 56
-
Reactive magnetron sputter deposition of epitaxial AIN (0001) on Si (111)Anov, I. / Hultman, L. / Jarrendahl, K. / Martensson, P. / Sudgren, J. E. / Hjorvarsson, B. / Greene, J. E. et al. | 1995
- 60
-
Passivation of GaInAs using a DECR plasma cleaning processLescaut, B. / Nissim, Y. I. et al. | 1995
- 64
-
Dehydrogenation and sp^3 enhancement in PECVD a-C:H by catalytic selective etching of H~2Neuville, S. / Tagliaferro, A. / Bounouh, Y. / Vallon, S. / Etemadi, R. / Perrin, J. et al. | 1995
- 69
-
Characterization of a radio frequency hollow cathode plasma jet for remote processingKorzec, D. / Ningel, K. P. / Pfannkuchen, B. / Engemann, J. et al. | 1995
- 73
-
Plasma-deposited SiO~2/Si~3N~4 bragg reflectorCallard, S. / Gagnaire, A. / Joseph, J. et al. | 1995
- 77
-
Argon metastables in a dual-mode RF/microwave dischargeEtemadi, R. / Godet, C. / Perrin, J. et al. | 1995
- 81
-
Plasma deposition and treatment of polymersD'Agostino, R. / Favia, P. / Lamendola, R. et al. | 1995
- 87
-
Traitements de surface de polymeres par plasma fluore en vue d'augmenter leur biocompatibiliteLegeay, G. / Poncin-Epaillard, F. et al. | 1995
- 92
-
Unexpected effect of nitrogen plasma towards an isotactic polypropylenePoncin-Epaillard, F. / Falher, T. / Brosse, J. C. / Buzare, J. Y. / Emery, J. / Gibaud, A. / Desert, A. et al. | 1995
- 96
-
Transparent multilayer hard coating for plastic substrate by microwave plasma polymerized CVD of hexamethyldisiloxaneCheaib, M. / Brassier, M. / Bosmans, R. / Leprince, P. et al. | 1995
- 100
-
Effect of plasma treatment on Teflon PFA-Cu AdhesionKiemberg-Sapieha, J. E. / Shi, M. K. / Martinu, L. / Wertheimer, M. R. et al. | 1995
- 104
-
Reacteurs grande surface, grands volumes - applications textilesChevet, B. et al. | 1995
- 108
-
Biocompatibility: an interfacial relation with biological systemsEloy, R. / Therin, M. et al. | 1995
- 113
-
Dielectric responses of a: C-H films deposited from CH~4Mebarki, B. / Segui, Y. et al. | 1995
- 117
-
Polymer oxidation induced by Vacuum-Ultraviolet emissionHollander, A. / Klemberg-Sapieha, J. E. / Wertheimer, M. R. et al. | 1995
- 121
-
Study of the helium plasma-polypropylene interactions. Effect on the stability of the wettability, adhesion and mechanical properties of the polymerTatoulian, M. / Arefi-Khonsari, F. / Rouger-Mabille, I. / Amouroux, J. et al. | 1995
- 126
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Large volume cold remote plasma reactors. Application to the surface treatment of industrially used polymersMutel, B. / Jama, C. / Dessaux, O. / Hoyez, C. / Goudmand, P. / Grimblot, J. / Gengembre, L. / Drevillon, B. / Vallon, S. et al. | 1995
- 130
-
High rate plasma-CVD of inorganic amorphous silicon compounds for multilayer protective coatings on optical polymersRostaing, J.-C. et al. | 1995
- 136
-
Surface plasma treatment of polymers before chemical metallization: New prospectsAlami, M. / Charbonnier, M. / Romand, M. et al. | 1995
- 140
-
Plasma diagnostics using in situ I.R. absorption spectroscopySegui, Y. / Raynaud, P. et al. | 1995
- 145
-
Organosilicon thin film deposition from hexamethydisiloxane-oxygen fed glow dischargesLamendola, R. / D'Agostino, R. / Fracassi, F. et al. | 1995
- 149
-
Improvement of adhesion properties of poly(propylene) films by grafting of poly (acrylic acid) using plasma techniquesDogue, I. L. J. / Mermilliod, N. / Foerch, R. et al. | 1995
- 153
-
Microwave plasma reactors for large surfaces treatmentBoisse-Laporte, C. / Leprince, P. / Marec, J. et al. | 1995
- 157
-
Recent clean ECR plasma etching of III-V compound semiconductor - from micro- to nano-structure photonicsAsakawa, K. et al. | 1995
- 163
-
Comparison between reactive ion etching and inductive coupled plasma etching of InP in CH~4/H~2 gas mixtureEtrillard, J. / Heliot, F. / Ossart, P. / Juhel, M. / Patriarche, G. / Carcenac, F. / Vleu, C. / Puech, M. / Maquin, P. et al. | 1995
- 167
-
Planarization of polycrystalline diamond films by a multilayer reactive ion etching procedureVlvensang, C. / Manin-Ferlazzo, L. / Ravet, M. F. / Rousseaux, F. / Turban, G. / Gicquel, A. et al. | 1995
- 171
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HBr/Cl~2/SF~6 metal etch applications in a high density, low pressure electrotech 2011CP systemKuhl, C. / Graffan, N. / Marty, A. / Puttock, M. / Powell, G. / Powell, K. et al. | 1995
- 175
-
Aluminium alloy etching with high resist selectivity in an inductively coupled plasma (ICP) with electrostatic wafer clampingPowel, G. R. / Puttock, M. / Powell, K. / Iacopi, A. / Tossell, D. / Kuhl, C. et al. | 1995
- 179
-
Reactive ion beam etching of indium phosphide and photonics related materials for pnotonics componentsPeyre, J. L. / Chaumont, G. et al. | 1995
- 183
-
Selective and anisotropic etching of polycrystalline silicon in a high density Plasma helicon sourceBell, F. H. / Joubert, O. / Valliers, L. et al. | 1995
- 187
-
Mechanistic studies of SiO~2 etching in high-density plasmasOehrlein, G. S. / Rueger, N. R. / Schaepkens, M. / Beulens, J. J. / Doemling, M. / Mirza, J. et al. | 1995
- 191
-
High anisotropic etching of submicrometer features on tungsten without the need for external biasingBounasri, F. / Gat, E. / Chaker, M. / Moisan, M. / Margot, J. / Ravet, M. F. et al. | 1995
- 197
-
Investigation of a polysilicon gate etching process in an 8-inch helicon reactor for the 0.25 m ULSI technologyVerove, C. / Vincent, C. / Francou, J. M. et al. | 1995
- 201
-
InP reactive ion etching in CH~4/H~2 plasma - Etching/deposition transitionFeurprier, Y. / Cardinaud, C. / Turban, G. et al. | 1995
- 205
-
Reactive ion etching of Pt/PZT/Pt thin film capacitors in high density DECR plasmaMace, H. / Peccoud, L. / Achard, H. et al. | 1995
- 209
-
Reactive layer deposition using magnetron sputtering and cathodic arc evaporationRichter, F. / Kuhn, M. / Kupfer, H. / Elstner, F. et al. | 1995
- 218
-
Synthese chimique de films minces de (, )-ZrO~2 en phase vapeur 733 et 573 K a partir de ZrCl~4 et d'une post-decharge micron-ondes O~2-H~2-Ar en ecoulementGavillet, J. / Hertz, D. / Belmonte, T. / Michel, H. et al. | 1995
- 222
-
In depth stress profiles of boron nitride layers deposited by ion-beam based techniquesDjouadi, M. A. / Bouchier, D. / Stambouli, V. / Sene, G. / Ilias, S. et al. | 1995
- 226
-
Amorphous hydrogenated carbon films deposited with an expanding thermal plasmaGielen, J. W. A. M. / Kleuskens, P. R. M. / Van de Zande, M. J. / Kiers, A. G. M. / Van de Sanden, M. C. M. / Schram, D. C. et al. | 1995
- 230
-
Residual stress in thin chromium films deposited by DC magnetron sputtering and its influence on the corrosion resistanceEltsner, F. / Nardou, F. / Controux, G. / Cosset, F. / Machet, J. et al. | 1995
- 234
-
Adhesion tayloring of c-BN films synthetized by ion beam assisted depositionIlias, S. / Sene, G. / Djouadi, M. A. / Stambouli, V. / Bouchier, D. et al. | 1995
- 238
-
Study and realization of chromium oxide thin films deposited by D.C. magnetron sputteringContoux, G. / Cosset, F. / Celerier, A. / Machet, J. et al. | 1995
- 242
-
Ti-Al-N Coating Deposited with D.C. and pulsed bias voltage by PVD-ARC EvaporationKnotek, O. / Lugscheider, E. / Loeffler, F. / Guerreiro, S. et al. | 1995
- 246
-
Synthese assistee par laser TEA CO~2 de films de nitrure de carboneDessaux, O. / Duez, N. / Dupret, C. / Goudmand, P. / Jama, C. et al. | 1995
- 250
-
Synthesis, properties and applications of nanophase materialsSiegel, R. W. et al. | 1995
- 256
-
Influence of magnetron sputtering parameters on soft ferromagnetic thin films deposited onto continuously transported thin polymer substratesPerrin, G. / Baclet, P. / Fontaine, J. M. / Capelle, E. / Acher, O. et al. | 1995
- 260
-
Birds head planarization for bipolar devicesJehoul, C. / Roussel, M. / Durand, J. et al. | 1995
- 264
-
DC-plasma cleaning of epitaxial CoSi~2/Si (111)-layersKafader, U. / Sirringhaus, H. / Von Kanel, H. et al. | 1995
- 268
-
On-line uniformity measurements in large area plasma assisted etching and depositionFriedhelm, H. / Kopperschmidt, P. et al. | 1995
- 272
-
XPS measurements and computer simulations of high dose nitrogen plasma implantation in aluminiumSaied, S. O. / Pearse, C. G. / Wronski, Z. / Sielanko, J. / Sullivan, J. L. et al. | 1995
- 276
-
Low temperature Si oxidation kinetics in a microwave ECR plasmaMartinet, C. / Devine, R. A. B. et al. | 1995
- 280
-
Theoretical model of a cylindrical plasma generatorViel, V. / Bernard, J. et al. | 1995
- 284
-
Energy distribution functions analysis in a reactive D.C. magnetron sputtering deposition deviceBlachere, E. / Degout, D. / Hague, C. F. et al. | 1995
- 288
-
Energy distribution functions in (Ar-O~2) gas mixture of the R.F. (ZrO~2-Y~2O~3) target magnetron sputteringChainiau, P. / Blachere, E. / Degout, D. / Hague, C. F. et al. | 1995
- 292
-
Modelling of a direct current glow discharge: combined models for the electrons, argon ions and metastablesBogaerts, A. / Gijbels, R. et al. | 1995
- 296
-
Langmuir probe and emission spectroscopy diagnostics of a pulsed glow discharge used for a nitriding processHugon, R. / Henrion, G. / Fabry, M. et al. | 1995
- 300
-
Low temperature deposition of thin film In~xO~y by Plasma enhanced reactive evaporation (PERE)Thwaites, M. J. et al. | 1995
- 305
-
Characterization of a CH~4/H~2 microwave plasma for diamond synthesis by emission spectroscopy and microwave interferometryBougdira, J. / Chatei, H. / Simon, C. / Remy, M. / Alnot, P. et al. | 1995
- 309
-
Electrostatic probes used as a sensor for the growing rates in depositing plasmasSahli, S. / Segui, Y. / Zaatri, A. / Guezenoc, H. / Rebiai, S. et al. | 1995
- 313
-
N~2 (B) state vibrational distribution measurements in the flowing afterglow of a CH~4-N~2 dischargesDiamy, A. M. / Hochard, L. / Kouassi, N. / Ricard, A. et al. | 1995
- 317
-
Determination by laser light scattering of the size, optical index and density of particles in an argon - silane radio-frequency dischargePlain, A. / Blondeau, J. P. / Bouchoule, A. et al. | 1995
- 321
-
Self-oscillations in the saturated current regime of a hot cathode dischargeArnas Capeau, C. / Bachet, G. / Doveil, F. et al. | 1995
- 325
-
Particle-in-cell Monte-Carlo model for charged particle simulation in a helicon diffusion plasmaKanzari, Z. S. / Rhallabi, A. / Briaud, P. / Goullet, A. / Turban, G. et al. | 1995
- 329
-
A compact E.C.R. ion source for the production of reactive species from SF~6 and CF~4 gasesBoukari, F. / Wartski, L. / Roy, V. / Coste, P. / Schwebel, C. / Aubert, J. et al. | 1995
- 333
-
Large diameter microwave plasma reactorBechu, S. / Boisse-Laporte, C. / Leprince, P. / Marec, J. et al. | 1995
- 337
-
Transient electron beams created by dielectric hollow cathodes as a tool for applicationsMandache, N. B. / Pointu, A. M. / Dimitriu, D. G. / Ganciu, M. / Musa, G. / Popescu, I. I. / Dewald, E. / Nistor, M. et al. | 1995
- 341
-
Self excited electron resonance spectroscopy for rf plasma monitoringKlick, M. et al. | 1995
- 345
-
Interaction de l'oxygene avec le systeme (Er + Si): Formation du pyrosilicate d'erbium Er~2Si~2O~7Hafidi, K. / Ijdiyaou, Y. / Azizan, M. / Amezlane, E. L. et al. | 1995
- 349
-
WTi and WTi-N thin films as diffusion barriers between Cu and SiRamarotafika, H. / Lemperiere, G. / Jouan, P. Y. et al. | 1995
- 353
-
Pulverisation cathodique magnetron reactive: Correlation entre vitesse de depot du nitrure de chrome et les mesures spectroscopiquesSetra, M. / Courbon, M. / Motyl, G. / Ronot-Trioli, C. / Moulard, G. et al. | 1995
- 357
-
Experimental studies of fine oxide particles plasma production and film depositionZake, M. / Liepina, V. / Sukhovich, J. et al. | 1995
- 361
-
Composition and properties of A^VB^V^I films prepared by pulsed vacuum arc plasma methodGazenkova, I. V. / Tochitsky, E. I. et al. | 1995
- 365
-
Hydrogen content of plasma deposited a-Si:HSeverens, R. J. / Brussaard, G. J. H. / Verhoeven, H. J. M. / Van de Sanden, M. C. M. / Schram, D. C. et al. | 1995
- 369
-
Modelling of nodular defects shape and sizeDubost, L. / Rhallabi, A. / Perrin, J. / Schmitt, J. et al. | 1995
- 373
-
Optical emission spectroscopy as a diagnostic of surface modification of polymerWang, W. / Poncin-Epaillard, F. / Brosse, J. C. / Ausserre, D. et al. | 1995
- 377
-
VUV-Visible emission from plasmas of high-purity gases or gas mixturesKruse, A. / Fozza, A. / Wertheimer, M. R. et al. | 1995
- 382
-
"Smart" RIE method for morphologic investigations of polyimide layersSpassova, E. / Popova, K. / Jivkov, I. / Petkov, K. / Danev, G. et al. | 1995
- 386
-
Crosslinking of polypropylene by an argon plasma studied by NMR and in situ spectroscopic ellipsometryPoncin-Epaillard, F. / Vallon, S. / Brenot, R. / Drevillon, B. / Rostaing, J. C. et al. | 1995
- 390
-
Oxidation of AG films using a microwave ECR ion sourceAnton, R. / Offermann, J. / Schmidt, A. A. et al. | 1995
- 394
-
Plasma oxidation of porous siliconAngelescu, A. / Kleps, I. et al. | 1995
- 398
-
Les plasmas froids d'hydrogene au service de la dechloruration d'objets archeologiques en ferArnould-Pernot, P. / Forrieres, C. / Michel, H. / Weber, B. et al. | 1995
- 402
-
Sensitivity of V~2O~5 thin films structure to oxygen gas pressure, annealing temperature and XPS measurementsBenmoussa, M. / Ibnouelghazi, E. / Bennouna, A. / Ameziane, E. L. et al. | 1995
- 406
-
Use of medium and low-frequency pulsed DC plasma for depositing reactively sputtered ceramic compoundsStauder, B. / Perry, F. / Sanchette, F. / Tran Huu Loi / Billard, A. / Pigeat, P. / Frantz, C. et al. | 1995
- 410
-
Plasma immersion doping for silicon solar cell applicationPinter, I. / Adam, M. / Dusco, C. S. / Khanh, N. Q. / Barsony, I. et al. | 1995
- 414
-
Threshold switching tellurium-based films with substituted arsenic for nitrogenRaicis, M. / Raicis, L. et al. | 1995
- 418
-
Evidence of a critical thickness for coalescence of the Ge in Fe/Ge multilayersSuenaga, K. / Thorel, A. / Houdy, P. et al. | 1995
- 422
-
Emission spectroscopy diagnostics for development and process control of plasma activated chemical vapour surface treatment in large reactorsStratil, P. / Baravian, G. / Melchior, K. et al. | 1995
- 427
-
Electrochemical characteristics of RF AS-sputtered aluminium rich Al-Cr and Al-Ti coatings in relation with their structural and morphological propertiesSanchette, F. / Comas, B. / Billard, A. / Normand, B. / Frantz, C. / Pagetti, J. et al. | 1995
- 431
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Yttria partially stabilized zirconia coatings by microwave plasma enhanced CVD (MPECVD)Chevillard, S. / Vidal-Setif, M. H. / Drawin, S. et al. | 1995
- 435
-
Some tribological coatings containing boron nitrideEizner, B. A. / Minevich, A. A. / Markov, G. V. / Ralko, A. P. et al. | 1995
- 436
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Complex coating (PVD). Peculiarities of technology, wear mechanisms and perspective areas of application for cutting toolsFox-Rabinovich, G. S. / Moiseev, V. F. / Dosbaeva, G. K. / Kovalev, A. I. / Mishina, V. P. / Wainstein, D. L. et al. | 1995
- 440
-
Technological experiments to achieve anti-corrosion features for carbon steel thin plate by vacuum thin film coatingsMateescu, G. et al. | 1995
- 443
-
Nitrogen alloying of steels and alloys from nitrogen containing plasma during Arc-Slag remeltingMedovar, B. I. / Pomarin, Y. M. / Saenko, V. Y. / Kumish, V. I. / Grigorenko, G. M. / Chernets, A. V. et al. | 1995
- 447
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Influence of Mo on the corrosion resistance of sputtered Fe-Cr filmsRobyr, C. / Mettraux, P. / Landolt, D. et al. | 1995
- 450
-
RF Plasma enhanced chemical vapour deposition of boron nitride coatings using BCl~3-N~2-H~2-ArSchaffnit, C. / Del Puppo, H. / Hugon, R. / Thomas, L. / Rossi, F. / Pauleau, Y. et al. | 1995
- 454
-
Structures and properties of (Ti,V)N and (Ti,V)C layers obtained by the bias activated reactive evaporation methodKoslowski, J. / Markowski, J. / Prajzner, A. / Zdanowski, J. / Masalski, J. et al. | 1995
- 458
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Spectroscopic study of a jet of plasma jetGrenier, I. / Martin, J. P. / Faubert, F. / Pennaneac'h, M. / Guilly, J. et al. | 1995
- 462
-
Structure and properties protective coatings produced by vacuum arc depositionRybnikov, A. I. / Kuznetsov, V. G. / Leontiev, S. A. / Burov, I. V. et al. | 1995
- 467
-
Creep studies of the EB PVD coatings with ceramic layerTchizhik, A. A. / Malashenko, I. S. / Alekseichuk, G. P. / Rybnikov, A. I. et al. | 1995
- 471
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System of two unbalanced magnetron sputtering sources for deposition of composite thin film coatingsGroudeva-Zotova, S. / Jacob, W. / Orlinov, V. et al. | 1995
- 475
-
Multilayered Fe/Mo, Co-Ti/Mo filmsChebotkevich, L. A. / Kuznetsova, S. V. / Slabzhennikova, I. M. / Vorob'ev, Y. D. et al. | 1995
- 479
-
DC Magnetron sputter deposition of chromium oxide layers on steel substratesBaborowski, J. / Charbonnier, M. / Romand, M. et al. | 1995
- 484
-
Contraintes residuelies dans les depots plasma d'alumine. Analyse par la diffraction neutronique et la methode du trou incrementaleEliliamdi, B. / Perrin, M. / Lodini, A. et al. | 1995
- 488
-
Comparison of ZnO:Al-Films deposited by DC and RF (reactive) magnetron sputtering from metallic and ceramic targetsEllmer, K. / Wendt, R. et al. | 1995
- 492
-
Plasma-chemical effects at reactive ion etching of tantalum silicide and polycrystalline silicon layersTsaneva, V. / Stoeva, R. et al. | 1995
- 496
-
Characterization of CH~4/H~2 reactive ion etching of InP for epitaxial growth of OEIC structuresAchouche, M. / Bresse, J. F. / Juhel, M. / Decobert, J. / Etrillard, J. / Clei, A. et al. | 1995
- 500
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Reactive ion etching of PMMA/Mo/polyimide for soft X-ray optical elementsPopova, K. S. / Charalambous, P. S. / Anastasi, P. A. F. / Burge, R. E. et al. | 1995
- 504
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A silicon nitride etch process with high oxide silicon dioxide selectivityPowell, K. / Puttock, M. S. / Iacopi, A. / Smart, A. / Powell, G. / Huq, T. / Shannon, J. / Clausen, M. et al. | 1995
- 508
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Thin carbide layers as a mask for reactive ion etching and microlithographic applications of sputtered chronium filmsPopova, K. / Petkov, K. / Spassova, E. / Danev, G. et al. | 1995
- 512
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Investigation of plasma chemical etching of thin borophosphosilicate glass films modified by germaiumKovalevsky, A. A. et al. | 1995
- 515
-
Selective etching of SiO~2 over Si In an inductively coupled high-density plasma using fluorocarbon gasesBell, F. H. / Joubert, O. / Oehrlein, G. S. / Zhang, Y. / Vender, D. et al. | 1995
- 519
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Limitations in deep silicon french etching for micromachiningFrancou, M. / Danel, J. S. / Peccoud, L. et al. | 1995
- 523
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Planarization of diamond thin film surfaces by ion beam etchingIllas, S. / Sene, G. / Moller, P. / Stambouli, V. / Pascallon, J. / Anger, E. / David, C. / Bouchier, D. et al. | 1995
- 527
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Interferometry and imaging as diagnostic and in-situ control methods for deposition and etch processes| 1995
- 531
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Bulk mode vacuum coating - the industrial concept| 1995
- 535
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Comparison of the corrosion resistance of different steel grades nitrided, coated and duplex treated| 1995
- 541
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Improvement of sputter process with on-board[R] waterpumps| 1995
- 546
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In-situ real-time instrumentation plateform for the monitoring of "cluster tools" equipments in production line| 1995
- 550
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Time dependent OH content in SIO~x layers grown by remote plasma Enhanced chemical vapour deposition| 1995