Impurities in Electroplated Copper Films for LSI Interconnection (Unknown)
- New search for: Ueno, K.
- New search for: Ueno, K.
In:
JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN
;
63
;
227-232
;
2012
-
ISSN:
- Article (Journal) / Print
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Title:Impurities in Electroplated Copper Films for LSI Interconnection
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Contributors:Ueno, K. ( author )
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Published in:JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN ; 63 ; 227-232
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Publisher:
- New search for: SURFACE FINISHING SOC JAPAN
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Publication date:2012-01-01
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Size:6 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:Unknown
- New search for: 684.1043
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Classification:
DDC: 684.1043 -
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© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 63
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
-
Growth based on Tradition of the Surface Finishing Society of JapanTanabe, H. et al. | 2012
- 3
-
Surface Technology on Space Materials and ComponentsKimoto, Y. et al. | 2012
- 9
-
Tribology in Space EnvironmentIwaki, M. / Obara, S. et al. | 2012
- 15
-
Development of Ultra Light Weight Mirror with C/C Composites for Space TelescopeKume, M. / Takeya, H. / Tsuneta, S. et al. | 2012
- 19
-
Thermal Barrier Coating for Jet EngineOtera, I. / Tsuda, Y. / Araki, T. / Mori, N. / Sato, A. et al. | 2012
- 24
-
Environmental Activity for Aircraft Parts - Alternative for Cd Plating -Saito, H. et al. | 2012
- 29
-
Tribological Properties of Si-Doped and Ti-Doped DLC/DLC SlidingsHarada, Y. / Matusoka, T. / Hirayama, T. / Asano, M. et al. | 2012
- 35
-
Structure and Tribological Behavior of Nitrogenated Diamond-Like Carbon Films Prepared by Plasma CVDYamamoto, S. / Hidaka, N. / Kawana, A. / Masuda, C. et al. | 2012
- 41
-
Development of Boric Acid Free High Speed Electro Nickel Plating BathKato, I. / Wakuda, Y. / Tashiro, K. / Umeda, Y. / Honma, H. et al. | 2012
- 47
-
Surface Patterning for Decorative Purposes of Aluminum Plate using Photolithography-Anodization-Chemical Etching ProcessKatsumata, N. / Shibata, M. et al. | 2012
- 53
-
Study on the Correlation between Surface Properties and Tribological Performance of S-DLC FilmsMoolsradoo, N. / Watanabe, S. et al. | 2012
- 73
-
A private reform bill for The National Center TestShimpo, R. et al. | 2012
- 75
-
Synthesizing Process of Metal Oxides Nanostructured Materials from Aqueous SolutionsDeki, S. / Mizuhata, M. et al. | 2012
- 82
-
Fabrication of Ordered Hole Arrays in Anodic Porous Alumina and Its Application to Functional DevicesMasuda, H. / Yanagishita, T. / Kondo, T. / Nishio, K. et al. | 2012
- 86
-
Highly Efficient Organic Thin-Film Solar Cells Using Nano-Structured Metal OxidesSagawa, T. et al. | 2012
- 90
-
Fabrication of 3D Photonic Crystals Using Interference Lithography and ElectrodepositionMiyake, M. et al. | 2012
- 95
-
Fabrication of Metal Patterns on Polymer Resins by Electrochemical Constructive LithographyAkamatsu, K. / Fukumoto, Y. / Tsuruoka, T. / Nawafune, H. / Yanagimoto, H. et al. | 2012
- 100
-
Electrochemical Preparation of Hollow Titanium Dioxide Shell Thin Films for Dye-Sensitized Solar CellsChigane, M. et al. | 2012
- 106
-
Bicycle Frame Materials - Iron and AluminumKatayama, J. et al. | 2012
- 108
-
Evaluation of the Bonding between Copper and Solder by Interfacial Impedance MethodSato, Y. / Ohyama, M. / Okido, M. et al. | 2012
- 113
-
Bright Nitriding of Tool Steels by Nitrogen PlasmaYoshikawa, Y. / Hara, T. / Abraha, P. et al. | 2012
- 118
-
Investigation of Minimization of Warp by Varying Conditions on Nickel ElectroformingAbe, H. / Kubota, H. et al. | 2012
- 124
-
Analysis of Cu(I) in Copper Sulfate Electroplating SolutionNoma, H. / Koga, T. / Hirakawa, C. / Nonaka, K. / Kaibuki, T. / Moriyama, S. et al. | 2012
- 133
-
Let's Take a Small Step ForwardMatsubara, H. et al. | 2012
- 134
-
The Technological Trend and Application of Environment-friendly Hard CoatingTsujioka, M. et al. | 2012
- 140
-
Latest Environmental Technologies in the Automobile Industry (1) - Fuel-Saving Engine Technologies -Mabuchi, Y. et al. | 2012
- 145
-
Latest Environmental Technologies in the Automobile Industry (2) - Development of Silicon Containing Coatings and its Application -Mori, H. et al. | 2012
- 151
-
Diamond Coated Tools for Machining of Lightweight MaterialsHanyu, H. et al. | 2012
- 157
-
Practical Use of the c-BN Films to a Tool and a DieNoma, M. et al. | 2012
- 163
-
High Functional Coatings on Aluminum AlloyKunitsugu, S. / Hino, M. / Nomura, H. et al. | 2012
- 167
-
Hydrogen Absorption into Electroplated Nickel Films and Formation of the Compressive StressTsuru, Y. / Kawahara, S. / Shinozaki, T. / Yano, M. et al. | 2012
- 173
-
Effects of Substrate Temperature on Properties of Tin-Doped Indium Oxide Films Deposited by Activated Electron Beam EvaporationKojima, H. / Saito, N. / Takai, O. et al. | 2012
- 179
-
High-Rate Reactive Deposition of SiO~2 Films Using a New DC Rotary Sputtering CathodeKojima, H. / Saito, N. / Takai, O. et al. | 2012
- 184
-
Measurement of Adhesion Energy of a Coating by Knife-Cutting MethodNishiyama, I. / Saito, F. / Ro, K. / Hyodo, T. et al. | 2012
- 188
-
Preparation of Ni-Sn Alloy Film as Negative Electrode for Lithium Secondary Batteries by Pulse ElectrolysisUi, K. / Kawarai, K. / Sato, Y. / Kikuchi, S. / Kumagai, N. et al. | 2012
- 191
-
Micrometer-sized Bismuth Tubes Prepared by Combining Electrospinning Technique and Electroless Plating MethodNose, H. / Tsutsumi, H. et al. | 2012
- 199
-
Discussion about PricesKawaguchi, J. et al. | 2012
- 200
-
Incorporation of Impurities in Deposited FilmsNakahara, S. et al. | 2012
- 209
-
Depth Profiling Analysis of Plating Films with Glow Discharge Optical Emission SpectrometryKodama, K. et al. | 2012
- 215
-
Thickness and Internal Structural Analysis of Electroless Ni/Pd/Au Plating FilmsOhgaki, M. / Yamamoto, Y. / Man, X. / Baba, Y. / Nakatani, I. / Uemoto, A. et al. | 2012
- 222
-
Behavior of Hydrogen in Electrodeposited Metal FilmsFukumuro, N. / Yae, S. / Matsuda, H. / Fukai, Y. et al. | 2012
- 227
-
Impurities in Electroplated Copper Films for LSI InterconnectionUeno, K. et al. | 2012
- 233
-
The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder JointTsuchida, T. / Okubo, T. / Kano, T. / Shohji, I. et al. | 2012
- 239
-
Japan and Some Asian CompetitionsSato, M. et al. | 2012
- 241
-
Application of Electrodeposited Ni-P Film for the Improvement of Corrosion Resistance in Au-Co/Ni ProcessesKato, I. / Murakami, Y. / Watanabe, H. / Cordonier, C. / Honma, H. et al. | 2012
- 247
-
Dry De-smear of Via Bottom Residue Using 60 Hz Nonequilibrium Atmospheric Pressure Plasma with Trifluoromethyle Trifluorovinyl Ether Mixing GasIwata, Y. / Sakamoto, H. / Takeda, K. / Hori, M. et al. | 2012
- 252
-
Correlativity with Properties of Surface Products and Chemical Mechanical Polishing BehaviorMabuchi, K. / Honbo, K. / Amanokura, J. / Ono, H. et al. | 2012
- 259
-
Fabrication of Copper Microparticles by Copper Deposition and Dissolution in Copper Sulfate Bath for Micropored PVD Hard CoatingMiura, K.-i. / Morikawa, T. / Yokoi, M. et al. | 2012
- 266
-
Removal of a Bubble on the Surface of Solid in Liquid Using Flow of FoamYamada, Y. / Fujisawa, Y. / Sugawara, T. / Furuhashi, T. / Ichihara, S. / Usui, H. et al. | 2012
- 269
-
Effect of Bubble Size in the Electroplating Using Foam of ElectrolyteYamada, Y. / Sugawara, T. / Furuhashi, T. / Ichihara, S. / Usui, H. et al. | 2012
- 272
-
Effects of Crystallization on Internal Stress of ITO FilmsKojima, H. / Saito, N. / Takai, O. et al. | 2012
- 287
-
Metal Release Reduction from TP304L for the Feed Water Heater Tube by Pre-FilmingTakeda, K. / Anada, H. / Nakai, T. et al. | 2012
- 290
-
Combined Effect of Material and Environment Factors on Flow Accelerated Corrosion and Oxide Film Property of Carbon Steel PipesAbe, H. / Watanabe, Y. et al. | 2012
- 296
-
Radiation Exposure Reduction by Forming Oxide Film after Chemical DecontaminationNagase, M. / Hosokawa, H. et al. | 2012
- 301
-
Plasma Sprayed Thermal Barrier CoatingsTakahashi, S. et al. | 2012
- 306
-
Which Ballpark is the Best for Catching the Homerun Ball?Fukuda, N. et al. | 2012
- 310
-
Enhanced Hydrothermal Decomposition of Ammonium Sulfate by Using Sodium PeroxydisulfateNakamura, T. / Kubota, M. / Matsuda, H. / Fukuta, T. / Yagishita, K. et al. | 2012
- 316
-
Study of Inhibition Effect of BTA on Anodic Dissolution of Copper by Channel Flow Double Electrode in Acid SolutionItagaki, M. / Inukai, A. / Shitanda, I. et al. | 2012
- 323
-
Preparation of Electrodeposited Pd-Ni-P Metallic Glass Films and the Effect of Bath Concentration on Film CompositionMochizuki, C. / Senga, T. / Yamanaka, J. / Shibata, M. et al. | 2012
- 329
-
Adhesion Strength of Nickel Films Deposited on Aluminum Surface in a Foam of ElectrolyteYamada, Y. / Sugawara, T. / Furuhashi, T. / Ichihara, S. / Usui, H. et al. | 2012
- 335
-
Diffusion of TechnologyKamitani, M. et al. | 2012
- 336
-
Coating Processes, Fundamentals and their Applications: Preparation of Oxide Superconductor Films by Metal-Organic DepositionKumagai, T. et al. | 2012
- 341
-
Wet Coated Organic Lighting Emitting Diode DevicesSuzuri, Y. et al. | 2012
- 345
-
Low Temperature Growth the Functional Oxide Thin Film by Photo-Induced Chemical Solution ProcessTsuchiya, T. / Nakajima, T. / Shinoda, K. et al. | 2012
- 349
-
Preparation of Transparent Conductive Films by SPD Technique and their Application to Dye-Sensitized Solar CellsOkuya, M. et al. | 2012
- 353
-
Room Temperature Printable Metal NanoinkKanehara, M. et al. | 2012
- 357
-
Roles of Organic Ligands at the Surface of Nanocrystals for Bottom-Up Structure and PropertiesKato, K. et al. | 2012
- 362
-
Growth of Thin Films for Solar Cells Prepared by Electrostatic Spray Pyrolysis Deposition MethodKato, T. / Nakanishi, A. / Horimoto, U. / Fukui, S. / Onojima, N. et al. | 2012
- 365
-
Preparation of Activated-Carbon-Supported Platinum Nanoparticles using Supercritical Fluid Chemical DepositionAkimoto, T. / Watanabe, M. / Kondoh, E. et al. | 2012
- 369
-
Stabilization of Electroless Ni Plating Bath by Isocyanide Additives with π AcidityWatanabe, S. et al. | 2012
- 375
-
Micro-Fabrication of Titanium Surface using Flowing-Type Micro-Droplet-CellFushimi, K. / Watanabe, H. / Nakanishi, T. / Hasegawa, Y. et al. | 2012
- 381
-
Adhesion and Friction Properties of Micropored PVD Hard Coating Deposited by Using Cu Particles Fabricated on Ni Plated SKD11 SubstrateMiura, K.-i. / Morikawa, T. / Demizu, K. / Shirakawa, N. / Yokoi, M. et al. | 2012
- 391
-
Three Stages of Learning MasteryOhtsuka, K. et al. | 2012
- 393
-
Expectations for KOSENSatomi, K. et al. | 2012
- 394
-
KOSEN, My Starting PointMabuchi, K. et al. | 2012
- 396
-
KOSEN Student-Based Sincere and Pure Spirit of Nagaoka University of TechnologyMatsubara, H. et al. | 2012
- 401
-
Education of Practical Engineers at Toyohashi University of Technology by Cooperating with KOSEN - Past and Future -Wakahara, A. et al. | 2012
- 404
-
Transition and Recent Development of KOSEN EducationTakahashi, H. et al. | 2012
- 408
-
Engineering Education System of KOSEN - Regular Courses and Advanced Courses -Okubo, S. et al. | 2012
- 411
-
Practical Training Program for the Overseas Technology Cooperation in KOSENMatsumoto, T. et al. | 2012
- 448
-
Estimate of the Residual Stress after Plasma Nitriding of Low Carbon SteelMakishi, T. et al. | 2012
- 450
-
Formation of Aluminide Coating for Carbon Steels by Non-pressurizing Laminating and CladdingNiinobe, K. / Takiyama, N. / Tagami, R. / Nakamura, Y. et al. | 2012
- 452
-
Removal of Cadmium from a Mid-Gut Gland of ScallopSaito, T. / Ueno, T. / Furusato, M. et al. | 2012
- 454
-
Evaluation of Vitrification Method for Bovine Embryos by Measurement of Oxygen ConsumptionToshima, S. / Takahashi, F. et al. | 2012
- 456
-
Study on Extension of Cutting Tool-Life by Polishing on a Cutting Edge using Controlled Abrasives under AC FieldTanaka, H. / Fujiya, K. / Taniguchi, T. / Kawase, Y. / Akagami, Y. et al. | 2012
- 459
-
Development of Production Process on Labo Scale for Biofilm Formation by Immersion into Closed Circulation Water SystemKanematsu, H. / Kuroda, D. / Koya, S. / Itoh, H. et al. | 2012
- 462
-
Film Growth and Characterization of Layered Compound SemiconductorIto, H. et al. | 2012
- 465
-
Study on Improvement of Durability of Electrode Materials Employed for Flat Tubelar Type Solid Oxide Fuel Cell - Development of Vacuum-flushing Non-electrolysis Nickel Plating -Yanagihara, K. / Tomozoe, Y. / Izumi, M. et al. | 2012
- 468
-
Effect of Cl^- and Cu^2^+ Ions on Corrosion of 4043-Al Alloy in Aqueous Solutions at High-TemperatureChiba, M. / Nakayama, Y. / Hiraga, T. / Takahashi, H. et al. | 2012
- 475
-
Invitation to 126^t^h Annual Meeting of the Surface Finishing Society of JapanHirai, S. et al. | 2012
- 476
-
Basic Formulations, Analysis and Control of Surface Finishing SolutionsKawashima, S. et al. | 2012
- 482
-
Analytical Technique for Plating Bath - Principle of Capillary Electrophoresis and it's Application -Sasa, K. et al. | 2012
- 486
-
CVS Principle and an Analysis ExampleTezuka, T. et al. | 2012
- 489
-
Theory and Evaluation Example of Hull Cell Test Including for High Speed PlatingKoiwa, K. / Yamamoto, W. et al. | 2012
- 495
-
Analytical Techniques of Ions in Plating Baths by Ion ChromatographyYoshimura, K. / Suzuki, T. / Sekiguchi, Y. et al. | 2012
- 500
-
The Trace Analysis Method of Plating, and its ValidityHatanaka, T. et al. | 2012
- 503
-
An Estimation Method of Current Density Distribution for Copper Electroplating Control CellKishimoto, Y. / Ohtsuka, T. / Kobayashi, Y. / Amaya, K. et al. | 2012
- 507
-
Progress of Anodic Oxidation of Aluminum (1) Industrial Technology for Anodic Oxidation Coating of Aluminum in JapanMaejima, M. et al. | 2012
- 512
-
Hill Climb by BicycleHayashi, H. et al. | 2012
- 514
-
Dye-Sensitized Solar Cells with Composite Photoanodes Incorporating Zinc Oxide Micro-Flower StructureMuranaka, T. / Kunihiro, Y. / Morita, M. / Shiratsuchi, R. et al. | 2012
- 520
-
Preparation and Characterization of Nano-Size Inorganic Particles using Surfactants with an Azobenzen GroupMiyauchi, M. / Ogihara, H. / Hoshino, K. / Saji, T. et al. | 2012
- 526
-
Development of Non-cyanide Electropolishing Solution for Low-Grade Gold Alloy and Elucidation of Polish BehaviorMochizuki, Y. / Ariizumi, N. / Miyagawa, K. / Shibata, M. et al. | 2012
- 531
-
Electroplating of Nickel Films Using Stable Foam Electrolyte SolutionYamada, Y. / Fujisawa, Y. / Furuhashi, T. / Ichihara, S. / Usui, H. et al. | 2012
- 539
-
Risk Accompanied with Convenience and the Importance of ObservationOhta, Y. et al. | 2012
- 541
-
The Present State and Problem of in New Thermal Spray Technology ``Cold Spray''Sakaki, K. et al. | 2012
- 548
-
Mechanisms of Solid Particle Deposition in Cold SprayOgawa, K. et al. | 2012
- 553
-
Fabrication of Thick Ceramic Coatings by Means of Cold Spray ProcessFukumoto, M. / Yamada, M. et al. | 2012
- 558
-
Development of WC Cermet Powders for Cold SprayingKitamura, J. / Sato, K. et al. | 2012
- 562
-
Principle and Example for Polarographic AnalysisYoshida, K. / Ichiba, K. et al. | 2012
- 565
-
The Principle and the Practical of ICP-AES for Plating SolutionsOmori, Y. et al. | 2012
- 571
-
New Directions in Plating Bath Control: Fast Automated Diagnosis of Electroplating Bath ``Health'' Using Multi-task Electrochemical ProbeJaworski, A. / Wikiel, H. / Wikiel, K. / Uekawa, K. et al. | 2012
- 576
-
Progress of Anodic Oxidation of Aluminum (2) Hard AnodizingHirayama, Y. et al. | 2012
- 581
-
Influence of Argon-Plasma Etching of Single-Crystalline Silicon on Electroless Displacement Deposition of Metal ParticlesFujiwara, R. / Hagihara, T. / Matsuda, T. / Ego, T. / Fukumuro, N. / Yae, S. / Matsuda, H. et al. | 2012
- 585
-
Improvement of Corrosion Resistance of Electroless Au/Ni-P Layer using Self-assembled Monolayers of 1-octadecanethiolOno, K. / Kurashina, T. / Natori, Y. / Takahashi, K. / Nonagase, Y. / Kodama, N. et al. | 2012
- 591
-
Effect of Pulse Electrolysis on the Hardness and Texture of Nickel Deposit Obtained from Additive Free Watt BathMiyake, T. / Kato, M. / Takamatsu, A. / Ichino, R. et al. | 2012
- 596
-
Hydrogen in Electrodeposited Pt Films from Dinitrosulfatoplatinate (II) SolutionHisanaga, N. / Fukumuro, N. / Yae, S. / Matsuda, H. et al. | 2012
- 598
-
Evaluation of Sulfur Tolerance of Co-P Plating Film by XPSAriyama, Y. / Ikeyama, K. / Yamaguchi, F. et al. | 2012
- 605
-
Future Developments of Surface Technology and its AssociationKinoshita, M. et al. | 2012
- 606
-
Possibility and Challenge of Urban MiningHalada, K. et al. | 2012
- 612
-
Rare Metal, Its Exploitation and Resource PolicyKita, Y. / Okubo, S. et al. | 2012
- 618
-
Current Status and Problems of Rare MetalsNose, K. / Okabe, T.H. et al. | 2012
- 625
-
Characteristics of Structural, Electrical and Optical Properties of ZnO-Based Highly Transparent Conductive FilmsYamamoto, T. / Song, H. / Makino, H. / Yamamoto, N. et al. | 2012
- 630
-
Development of Separation and Recovery System of Gold and Rare Earth Elements using Stimuli-Responsive Polymers - g-MOVE System and La-VEBA System -Igarashi, S. / Saito, S. / Kato, T. / Okano, G. / Yamaguchi, H. et al. | 2012
- 633
-
Progress of Anodic Oxidation of Aluminum (3) Sealing of Anodic Oxide Coating: Volume 1Itahana, T. et al. | 2012
- 639
-
Each Printing Method in the Electronic FieldArimura, H. et al. | 2012
- 641
-
Preparation of Aluminum Foil by an Electrodeposition Method and Its CharacterizationOkamoto, A. / Morita, M. / Yoshimoto, N. et al. | 2012
- 646
-
Hydrogen Absorption into Electroplated Palladium Films and Formation of the Compressive StressTsuru, Y. / Uchiyama, H. / Yano, M. et al. | 2012
- 651
-
Effect of Metal Ions in Electrolyte on Organic Composite ElectrodepositionIshii, K. / Doi, T. / Kimoto, M. / Hayashi, H. / Kishimoto, A. et al. | 2012
- 659
-
To Enhance Communicative CompetenceHayashi, H. et al. | 2012
- 660
-
Evaluation of Solderability by MeniscographToma, S. et al. | 2012
- 666
-
Solder Ball Test MethodTorimitsu, T. et al. | 2012
- 670
-
Accelerated Corrosion Test Methods for Plating MaterialsSuga, S. / Watanabe, S. et al. | 2012
- 677
-
Sn Whiskering Mechanism and its EvaluationSuganuma, K. et al. | 2012
- 681
-
Hardness Evaluation of Ultra Thin FilmsKokawa, R. / Nakajima, H. / Inoue, T. et al. | 2012
- 685
-
Cross-Sectioning of Low Melting Point Metal with FIBSuzuki, T. / Matsushima, H. et al. | 2012
- 689
-
Non Distractive Analysis by Oblique 3D CT about Void in the Through-HoleTamura, A. / Seimiya, N. / Umeda, T. / Watanabe, T. / Koizumi, K. et al. | 2012
- 692
-
Progress of Anodic Oxidation of Aluminum (4) Sealing of Anodic Oxide Coating: Volume 2Sakai, S. et al. | 2012
- 694
-
Electrochemical Impedance Analysis for Growth Process of Electrochemical Migration on Screen-Printed Silver Wiring Electrode - Effect of Temperature and Voltage -Shitanda, I. / Inoue, K. / Yamamoto, K. / Hoshi, Y. / Itagaki, M. et al. | 2012
- 700
-
Evaluation of the Amount of Hydrogen Gas and Induction Period Occurred during Pitting Corrosion of IronTsuru, Y. / Yano, M. et al. | 2012
- 709
-
Diversity| 2012
- 710
-
Science and Technology of Thin Film AdhesionKinbara, A. et al. | 2012
- 718
-
Effect of Surface Formation and Plastic Deformation Energy on Evaluation of Interface Adhesion Strength - Trials for Analytical Evaluation of Interface Separation Energy -Kamiya, S. et al. | 2012
- 725
-
Toughness Evlauation of Dissimilar Material Interface and Reaction Layer Formed at the InterfaceKoseki, T. / Inoue, J. et al. | 2012
- 728
-
Adhesion Strength and Interfacial Adhesion of Pressure-Sensitive AdhesiveNakamura, Y. / Yamamura, K. / Fujii, S. et al. | 2012
- 733
-
Bonding of Living Tissue with MaterialsHanawa, T. et al. | 2012
- 739
-
Evaluating of Adhesive Strength on Resin-Metal InterfaceYamazaki, M. / Iwasaki, T. et al. | 2012
- 746
-
Several Adhesion Problems Related to CFRPHira, H. et al. | 2012
- 751
-
Vacuum Ultra-Violet Processing under Atmospheric Pressure: Surface Modification of Synthetic ResinsSugimura, H. et al. | 2012
- 759
-
An Innovative Adhesion Improvement Technology with Low Environmental Load: Plasma Hybrid Surface Treatment TechnologyOkubo, M. et al. | 2012
- 764
-
Developments of Indentation Tester for the Evaluation of Adhesion Properties of Diamond FilmsTakeuchi, S. / Machida, N. / Suzuki, W. / Sumiya, H. et al. | 2012
- 769
-
The Effect of Cu-Sn-Ni Alloy Boundary Layer on Wear Resistance Property of Electrodeposited Cu/Ni Multilayer FilmsKimura, M. / Izawa, K. / Fukunishi, M. / Kobayashi, G. / Sato, Y. / Matsumoto, F. et al. | 2012
- 772
-
Adhesion Performance of the Resin Material to Copper That Has Been Roughened by Small Amount EtchingFumikura, T. et al. | 2012
- 775
-
Effects of Alloying Elements in Aluminum Alloys on Adhesion of Plated FilmsMurakami, K. / Hino, M. / Kanadani, T. et al. | 2012
- 777
-
Adhesion Property between Aluminum Current Collector and Carbon Conductor at Polarized Condition of Positive Electrode for Lithium-Ion Secondary BatteryTachibana, K. / Ito, T. / Takeda, H. / Oikawa, T. / Honda, C. / Nishina, T. et al. | 2012
- 779
-
Surface Modification of Polyethylene Naphthalate Film Using Ozone Water and Analysis of Functional Groups by Derivatization TechniquesKobayashi, Y. / Ikeda, S. / Fujiwara, Y. et al. | 2012
- 781
-
Effect of Metal Nanorod Size on Adhesion of Electrolessly Plated Film on SiliconEnomoto, M. / Yae, S. / Sakamoto, S. / Fukumuro, N. / Matsuda, H. et al. | 2012