Non-Volatile Logic with Ferroelectric Technology (Japanese)
- New search for: Nakamura, T.
- New search for: Fujimori, Y.
- New search for: Takasu, H.
- New search for: Nakamura, T.
- New search for: Fujimori, Y.
- New search for: Takasu, H.
In:
Handōtai, Shuseki-Kairo-Gijutsu-64.-Shinpojiumu-kōen-ronbunshū
; 22-25
;
2003
- Conference paper / Print
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Title:Non-Volatile Logic with Ferroelectric Technology
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Contributors:
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Conference:Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu ; 64 ; 2003 ; Osaka
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Published in:
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Place of publication:Tōkyō
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Publication date:2003
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Type of media:Conference paper
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Type of material:Print
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Language:Japanese
- New search for: 53.56
- Further information on Basic classification
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Keywords:
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Classification:
BKL: 53.56 Halbleitertechnologie -
Source:
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 6
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Mechanism of Mobility Reduction for MISFETs with high-k gate dielectricsSaito, S. et al. | 2003
- 10
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Electrical properties of HfO2 films prepared by remote plasma oxidation of Hf metalYamamoto, K. / Hayashi, S. / Harada, Y. / Kubota, M. / Niwa, M. / Asai, M. / Hori, S. et al. | 2003
- 14
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Integrating Hf-based high-k gate stacks with polysilicon gatesGendt, S. De / Chen, J. / Kaushik, V. / Claes, M. / Witters, T. / Rohr, E. / Carter, R. / Kubicek, S. / Tsai, W. / Ragnarsson, L. et al. | 2003
- 18
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The emerging new memories: their characteristics and applicationsJeong, H. et al. | 2003
- 22
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Non-Volatile Logic with Ferroelectric TechnologyNakamura, T. / Fujimori, Y. / Takasu, H. et al. | 2003
- 26
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Ferroelectric Properties of BiFeOs Thin Films prepared by Chemical Solution Deposition and Pulsed Laser Deposition MethodYun, K. Y. / Noda, M. / Okuyama, M. et al. | 2003
- 30
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Flash CVD TechnologyShoji, M. / Akuto, K. / Fukagawa, M. / Sakai, R. / Nagaoka, K. / Watanuki, H. / Kobayashi, H. / Yamoto, H. et al. | 2003
- 34
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MONOS Nonvolatile Semiconductor Memory TechnologyMinami, S. et al. | 2003
- 38
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ESR study of silicon nitride film used in MONOS nonvolatile semiconductor memoryShishido, Y. / Kamigaki, Y. / Fujiwara, I. et al. | 2003
- 42
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Thick Oxide Layer Fabrication Process for Silicon RF ICsTsuruta, K. / Shibata, T. et al. | 2003
- 46
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Current Status of Low-k Materials and Processes toward 65 nm Node Intetconnect TechnologyKobayashi, N. et al. | 2003
- 50
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Molecular Design and Syntheses of Ultra Tough Organic Low-k DielectricsAoi, N. / Fukuda, T. / Yanazawa, H. et al. | 2003
- 54
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Low Dielectric Porous Diamond Film Composed of Diamond Nano-particlesSakaue, H. / Tomimoto, H. / Ishikawa, S. / Shingubara, S. / Takahagi, T. et al. | 2003
- 58
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Stress Engineering of Multi-Level Interconnection Module with Copper and Low-k DielectricHasunuma, M. / Itoh, S. et al. | 2003
- 62
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Electroles Plating of Cu Without Pd Catalysis For Fine Cu Interconnect FormationShingubara, S. et al. | 2003
- 66
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WIWNU Improvement of Electro chemical Cu plating on thin seed layerSuzuki, H. / Nomura, K. / Ide, K. / Kanda, H. / Mishima, K. et al. | 2003
- 70
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Correlation between microstructure and reliability of Cu interconnectsMoriyama, M. / Tsukimoto, S. / Murakami, M. et al. | 2003
- 74
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Growth of Cu and Ta films by metal chloride reduction CVDSakamoto, H. / Ogura, Y. / Yahata, N. / Ooba, Y. et al. | 2003
- 78
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Reliability Improvement of 90nm-node Cu/Low-k InterconnectHashimoto, K. / Matsumoto, S. / Ishii, A. / Tomita, K. / Nishioka, Y. / Sekiguchi, M. / Iwasaki, A. / Isono, S. / Satake, T. / Okazaki, G. et al. | 2003
- 82
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Reliability in Copper interconnects with SiLK interlevel dielectricsSato, M. / Mori, H. / Ehara, H. / Matsuoka, Y. / Matsuyama, H. / Shono, K. et al. | 2003