Thermal stresses in a multilayered thin film thermoelectric structure (English)
- New search for: Jin, Z.-H.
- New search for: Jin, Z.-H.
In:
Microelectronics and Reliability
;
54
, 6-7
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1363-1368
;
2014
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Thermal stresses in a multilayered thin film thermoelectric structure
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Contributors:Jin, Z.-H. ( author )
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Published in:Microelectronics and Reliability ; 54, 6-7 ; 1363-1368
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Publisher:
- New search for: Elsevier Ltd
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Publication date:2014-02-26
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Size:6 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents – Volume 54, Issue 6-7
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1057
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Special section reliability and variability of devices for circuits and systemsAsenov, Asen / Schlichtmann, Ulf / Tan, Cher Ming / Wong, Hei / Zhou, Xing et al. | 2014
- 1058
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Robustness measurement of integrated circuits and its adaptation to aging effectsBarke, Martin / Kaergel, Michael / Olbrich, Markus / Schlichtmann, Ulf et al. | 2014
- 1066
-
Resilience Articulation Point (RAP): Cross-layer dependability modeling for nanometer system-on-chip resilienceHerkersdorf, Andreas / Aliee, Hananeh / Engel, Michael / Glaß, Michael / Gimmler-Dumont, Christina / Henkel, Jörg / Kleeberger, Veit B. / Kochte, Michael A. / Kühn, Johannes M. / Mueller-Gritschneder, Daniel et al. | 2013
- 1075
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Monitoring of aging in integrated circuits by identifying possible critical pathsLorenz, Dominik / Barke, Martin / Schlichtmann, Ulf et al. | 2014
- 1083
-
A compact model for NBTI degradation and recovery under use-profile variations and its application to aging analysis of digital integrated circuitsKleeberger, Veit B. / Barke, Martin / Werner, Christoph / Schmitt-Landsiedel, Doris / Schlichtmann, Ulf et al. | 2013
- 1090
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Improved device variability in scaled MOSFETs with deeply retrograde channel profileWoo, Jason / Chien, P.Y. / Yang, Frank / Song, S.C. / Chidambaram, Chidi / Wang, Joseph / Yeap, Geoffrey et al. | 2013
- 1096
-
Analytical compact modeling and statistical variability study of LDMOSZhou, Hongtao / Zhou, Xing / Benistant, Francis et al. | 2013
- 1103
-
Modeling and analysis of gate-all-around silicon nanowire FETChen, Xiangchen / Tan, Cher Ming et al. | 2013
- 1109
-
Temperature dependences of threshold voltage and drain-induced barrier lowering in 60nm gate length MOS transistorsChen, Zehua / Wong, Hei / Han, Yan / Dong, Shurong / Yang, B.L. et al. | 2013
- 1115
-
Thermal stability of sectorial split-drain magnetic field-effect transistorsTam, Wing-Shan / Kok, Chi-Wah / Siu, Sik-Lam / Tang, Wing-Man / Leung, Chi-Wah / Wong, Hei et al. | 2013
- 1119
-
Oxygen vacancy formation and the induced defect states in HfO2 and Hf-silicates – A first principles hybrid functional studyChen, Tsung-Ju / Kuo, Chin-Lung et al. | 2013
- 1125
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Analysis of Harmonic distortion in asymmetric underlap DG-MOSFET with high-k spacerDutta, Arka / Koley, Kalyan / Sarkar, Chandan K. et al. | 2013
- 1133
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On the current conduction mechanisms of CeO2/La2O3 stacked gate dielectricFeng, Xuan / Wong, H. / Yang, B.L. / Dong, Shurong / Iwai, H. / Kakushima, K. et al. | 2013
- 1137
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Study of body and oxide thickness variation on analog and RF performance of underlap DG-MOSFETsPati, Sudhansu Kumar / Koley, Kalyan / Dutta, Arka / Mohankumar, N. / Sarkar, Chandan K. et al. | 2014
- 1143
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ESD degradation and robustness of RGB LEDs and modules: An investigation based on combined electrical and optical measurementsMeneghini, Matteo / Vaccari, Simone / Lago, Matteo Dal / Marconi, Stefano / Barbato, Marco / Trivellin, Nicola / Griffoni, Alessio / Alfier, Alberto / Verzellesi, Giovanni / Meneghesso, Gaudenzio et al. | 2014
- 1150
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Methodology of reliability enhancement for high power LED driverLan, Song / Tan, Cher Ming / Wu, Kevin et al. | 2014
- 1160
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Stacked zener trigger SCR for HV IC ESD protectionDong, Shurong / Zhong, Lei / Zeng, Jie / Li, Hongwei / Wang, Jun / Zheng, Jianfeng / Han, Yan et al. | 2013
- 1163
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Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technologyTam, Wing-Shan / Kok, Chi-Wah / Siu, Sik-Lam / Wong, Hei et al. | 2014
- 1169
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An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuitsLiang, Hailian / Nie, Weidong / Gu, Xiaofeng / Dong, Shurong / Lau, W.S. et al. | 2013
- 1173
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An area-efficient LDMOS-SCR ESD protection device for the I/O of power IC applicationZeng, Jie / Dong, Shurong / Zhong, Lei / Wei, Guo / Han, Yan / Liu, Weicheng / Li, Hongwei / Wang, Jun et al. | 2013
- 1179
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Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-SystemsWymysłowski, Artur et al. | 2014
- 1182
-
Multi-physics simulations for combined temperature/humidity loading of potted electronic assembliesParsa, Ehsan / Huang, Hao / Dasgupta, Abhijit et al. | 2014
- 1192
-
Geometry optimization of a Lorentz force, resonating MEMS magnetometerBagherinia, M. / Bruggi, M. / Corigliano, A. / Mariani, S. / Lasalandra, E. et al. | 2014
- 1200
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Chip-Package Interaction in 3D stacked IC packages using Finite Element ModellingVandevelde, Bart / Ivankovic, A. / Debecker, B. / Lofrano, M. / Vanstreels, K. / Guo, W. / Cherman, V. / Gonzalez, M. / Van der Plas, G. / De Wolf, I. et al. | 2014
- 1206
-
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic coreWeide-Zaage, K. / Schlobohm, J. / Rongen, R.T.H. / Voogt, F.C. / Roucou, R. et al. | 2014
- 1212
-
Multi-physics reliability simulation for solid state lighting driversTarashioon, S. / van Driel, W.D. / Zhang, G.Q. et al. | 2014
- 1223
-
On the crack and delamination risk optimization of a Si-interposer for LED packagingAuersperg, J. / Dudek, R. / Jordan, R. / Bochow-Neß, O. / Rzepka, S. / Michel, B. et al. | 2014
- 1228
-
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loadingLi, Jue / Broas, Mikael / Raami, Jani / Mattila, Toni T. / Paulasto-Kröckel, Mervi et al. | 2014
- 1235
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Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloysEckermann, J. / Mehmood, S. / Davies, H.M. / Lavery, N.P. / Brown, S.G.R. / Sienz, J. / Jones, A. / Sommerfeld, P. et al. | 2014
- 1243
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Stress impact of moisture diffusion measured with the stress chipSchindler-Saefkow, F. / Rost, F. / Otto, A. / Pantou, R. / Mroßko, R. / Wunderle, B. / Michel, B. / Rzepka, S. / Keller, J. et al. | 2014
- 1253
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A review: On the development of low melting temperature Pb-free soldersKotadia, Hiren R. / Howes, Philip D. / Mannan, Samjid H. et al. | 2014
- 1274
-
Subthreshold behavior models for short-channel junctionless tri-material cylindrical surrounding-gate MOSFETLi, Cong / Zhuang, Yiqi / Han, Ru / Jin, Gang et al. | 2014
- 1282
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Device characteristics of AlGaN/GaN MIS–HEMTs with high-k HfxZr1 − xO2 (x =0.66,0.47,0.15) insulator layerChiu, Hsien-Chin / Wu, Chia-Hsuan / Chi, Ji-Fan / Chien, Feng-Tso et al. | 2014
- 1288
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New degradation mechanism observed for AlGaN/GaN HEMTs with sub 100nm scale unpassivated regions around the gate peripheryIvo, Ponky / Cho, Eunjung Melanie / Kotara, Przemyslaw / Schellhase, Lars / Lossy, Richard / Zeimer, Ute / Mogilatenko, Anna / Würfl, Joachim / Tränkle, Günther / Glowacki, Arkadiusz et al. | 2014
- 1293
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Reliability investigation of AlGaN/GaN high electron mobility transistors under reverse-bias stressChen, Wei-Wei / Ma, Xiao-Hua / Hou, Bin / Zhao, Sheng-Lei / Zhu, Jie-Jie / Zhang, Jin-Cheng / Hao, Yue et al. | 2014
- 1299
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A graph based approach for reliability analysis of nano-scale VLSI logic circuitsVaghef, Vahid Hamiyati / Peiravi, Ali et al. | 2014
- 1307
-
Useful lifetime analysis for high-power white LEDsWang, Fu-Kwun / Lu, Yi-Chen et al. | 2014
- 1316
-
Influence of bias humidity testing and application on time-dependent, Arrhenius-law-based stability predictions for thin film resistorsKuehl, Reiner W. et al. | 2014
- 1328
-
Flexible stop and double-cascaded stop to improve shock reliability of MEMS accelerometerTao, Yong-Kang / Liu, Yun-Feng / Dong, Jing-Xin et al. | 2014
- 1338
-
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting systemYe, Huaiyu / Wei, Jia / van Zeijl, Henk W. / Sarro, Pasqualina M. / Zhang, Guoqi et al. | 2014
- 1344
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U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing methodWang, Jung-Chang et al. | 2014
- 1355
-
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodesYe, Huaiyu / Sokolovskij, Robert / van Zeijl, Henk W. / Gielen, Alexander W.J. / Zhang, Guoqi et al. | 2014
- 1363
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Thermal stresses in a multilayered thin film thermoelectric structureJin, Z.-H. et al. | 2014
- 1369
-
Improving the reliability of electronic paper display using FMEA and Taguchi methods: A case studySu, Chao-Ton / Lin, Hung-Chun / Teng, Po-Wen / Yang, Taho et al. | 2014
- 1378
-
Planar copper-tin inter-metallic film formation on strained substratesHsu, Feng-Chih / Cheng, Ya-Chi / Wang, Yu-Ting / Lin, Ming-Tzer / Chen, Chih-Ming et al. | 2014
- 1384
-
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric linerDing, Yingtao / Yan, Yangyang / Chen, Qianwen / Wang, Shiwei / Su, Rui / Dang, Hua et al. | 2014
- 1392
-
Mechanical and corrosion resistances of a Sn–0.7wt.%Cu lead-free solder alloyFreitas, Emmanuelle S. / Osório, Wislei R. / Spinelli, José E. / Garcia, Amauri et al. | 2014
- 1401
-
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packagingPark, M.S. / Gibbons, S.L. / Arróyave, R. et al. | 2014
- 1412
-
Soft error estimation and mitigation of digital circuits by characterizing input patterns of logic gatesRezaei, Siavash / Miremadi, Seyed Ghassem / Asadi, Hossein / Fazeli, Mahdi et al. | 2014
- 1421
-
Design-in-reliability: From library modeling and optimization to gate-level verificationJain, Palkesh / Pudi, Bapana / Sreenivasan, Meghna et al. | 2014
- 1433
-
Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysisNaoe, Takuya / Mizobe, Taketoshi / Yokoyama, Kohichi et al. | 2014
- 1443
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Self-repairing adder using fault localizationAkbar, Muhammad Ali / Lee, Jeong-A et al. | 2014
- 1452
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Predicting bond failure after 1.5ms of bonding, an initial studyTietäväinen, Aino / Rauhala, Timo / Seppänen, Henri / Kurppa, Risto / Meriläinen, Antti I. / Hæggström, Edward et al. | 2014
- IFC
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Inside front cover - Editorial board| 2014