Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints (English)
- New search for: Gao, Xing
- New search for: Zhang, Z.J.
- New search for: Wei, Hong
- New search for: Zhou, Xu
- New search for: Shi, Quan
- New search for: Wu, Yang
- New search for: Chen, Lei Da
- New search for: Gao, Xing
- New search for: Zhang, Z.J.
- New search for: Wei, Hong
- New search for: Zhou, Xu
- New search for: Shi, Quan
- New search for: Wu, Yang
- New search for: Chen, Lei Da
In:
Microelectronics International
;
41
, 1
;
9-15
;
2024
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints
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Contributors:Gao, Xing ( author ) / Zhang, Z.J. ( author ) / Wei, Hong ( author ) / Zhou, Xu ( author ) / Shi, Quan ( author ) / Wu, Yang ( author ) / Chen, Lei Da ( author )
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Published in:Microelectronics International ; 41, 1 ; 9-15
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Publisher:
- New search for: Emerald Publishing Limited
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Publication date:2024-01-02
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Size:7 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 41, Issue 1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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A high performance RC-INV triggering SCR under 0.25 µm processSu, Xuebing / Wang, Yang / Jin, Xiangliang / Yang, Hongjiao / Zhang, Yuye / Yang, Shuaikang / Yu, Bo et al. | 2024
- 9
-
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder jointsGao, Xing / Zhang, Z.J. / Wei, Hong / Zhou, Xu / Shi, Quan / Wu, Yang / Chen, Lei Da et al. | 2024
- 16
-
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signalsV., Yokesh / Alsath, Gulam Nabi / Kanagasabai, Malathi et al. | 2024
- 26
-
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max applicationRawal, Pallav / Rawat, Sanyog et al. | 2024
- 32
-
Magnetic alignment technology for wafer bondingYe, Lezhi / Song, Xuanjie / Yue, Chang et al. | 2024
- 41
-
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow solderingWu, Y. / Zhang, Z.J. / Chen, L.D. / Zhou, X. et al. | 2024
- 48
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Structural analysis of paper substrate for flexible microfluidics device applicationYadav, Supriya / Singh, Kulwant / Gupta, Anmol / Kumar, Mahesh / Sharma, Niti Nipun / Akhtar, Jamil et al. | 2024