A day at the European Microelectronics Packaging Conference Brighton, Sussex 12-15 September 2011 (English)
- New search for: Ling, John
- New search for: Ling, John
In:
Soldering & Surface Mount Technology
;
24
, 1
;
2012
-
ISSN:
- Article (Journal) / Electronic Resource
-
Title:A day at the European Microelectronics Packaging Conference Brighton, Sussex 12-15 September 2011
-
Contributors:Ling, John ( author )
-
Published in:
-
Publisher:
- New search for: Emerald Group Publishing Limited
-
Publication date:2012-02-03
-
ISSN:
-
DOI:
-
Type of media:Article (Journal)
-
Type of material:Electronic Resource
-
Language:English
-
Keywords:
-
Source:
Table of contents – Volume 24, Issue 1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 4
-
Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn soldersBukat, Krystyna / Sitek, Janusz / Koscielski, Marek / Moser, Zbigniew / Gasior, Wladyslaw / Pstrus, Janusz et al. | 2012
- 12
-
A new conformal coating adhesion test for electronic assembliesZou, Ling / Hunt, Chris et al. | 2012
- 22
-
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder jointsLiu, De-Shin / Hsu, Chang-Lin / Kuo, Chia-Yuan / Huang, Ya-Ling / Lin, Kwang-Lung / Shen, Geng-Shin et al. | 2012
- 30
-
Through lifetime monitoring of solder joints using acoustic micro imagingYang, Ryan S.H. / Braden, Derek R. / Zhang, Guang-Ming / Harvey, David M. et al. | 2012
- 38
-
A review of stencil printing for microelectronic packagingKay, Robert / Desmulliez, Marc et al. | 2012
-
Nihon Superior debuts selector guide for SN100C solder pastes| 2012
-
Post-assembly test for PCBs| 2012
-
Nihon Superior introduces SN100C (551CT)| 2012
-
A day at the European Microelectronics Packaging Conference Brighton, Sussex 12-15 September 2011Ling, John et al. | 2012
-
Etek Europe launches latest division for consumables and production equipment| 2012
-
Etek Europe appointed to represent JBC Tools, Inc. in the UK| 2012
-
Super Dry launches oxidation-free process alternative to MSD and PCB baking| 2012
-
Computrol invests in another Tucano Screen Printer from Essemtec| 2012
-
EUROPE-SMT celebrates two-year anniversary| 2012
-
Deltec selects 3-D SPI system from Viscom| 2012
-
Avoid wasting time, material and capacity| 2012
-
Triumph chooses Synergy from MYDATA| 2012
-
BTU International awarded best exhibit technology of the year at NEPCON South China 2011 for its PYRAMAX™ 125N| 2012
-
SIPLACE grants insights into its technology developments| 2012
-
International diary| 2012
-
Intertronics new exclusive UK distributor for preeflow® dispensing equipment| 2012
-
VarioSystems focuses on the future with SIPLACE SX| 2012
-
DEK introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating| 2012
-
OKI launches powerful new desoldering system and introduces unique upgrade option| 2012
-
Smart Group Annual Conference 2011 The Oxfordshire, Thame, England 5 and 6 October 2011Ling, John et al. | 2012
-
AIM opens office in Bangalore, India| 2012
-
Capacity-on-demand thanks to switchable gantries| 2012
-
GE presents its phoenix x||aminer, high magnification X-ray inspection solution for electronics manufacture| 2012
-
IeMRC 6th Annual Conference Loughborough University 21 September 2011| 2012
-
EditorialGoosey, Martin et al. | 2012
-
Global surface mount technology equipment market to reach US$11.2 billion by 2017 – Global Industry Analysts, Inc| 2012
-
Rehm delivers its 3,000th soldering system| 2012
-
Israeli EMS provider invests in scalable SIPLACE SX line| 2012