PHOTOSENSITIVE RESIN COMPOSITION (Japanese)
Free access
- New search for: EIZAI HIROSHI
- New search for: OKAMOTO YOSHIO
- New search for: EIZAI HIROSHI
- New search for: OKAMOTO YOSHIO
2021
- Patent / Electronic Resource
-
Title:PHOTOSENSITIVE RESIN COMPOSITION
-
Additional title:感光性樹脂組成物
-
Patent number:JP2021157025
-
Patent applicant:
-
Patent family:
-
Contributors:EIZAI HIROSHI ( author ) / OKAMOTO YOSHIO ( author )
-
Publisher:
- New search for: Europäisches Patentamt
-
Publication date:2021-10-07
-
Type of media:Patent
-
Type of material:Electronic Resource
-
Language:Japanese
- New search for: G03F / C08F / H05K
- Further information on International Patent Classification
-
Classification:
IPC: G03F Fotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen, PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES / C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS, Makromolekulare Verbindungen, erhalten durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind / H05K PRINTED CIRCUITS, Gedruckte Schaltungen -
Source: