A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques (English)
- New search for: Klengel, Robert
- New search for: Klengel, Sandy
- New search for: Schusser, Georg
- New search for: Krause, Michael
- New search for: Klengel, Robert
- New search for: Klengel, Sandy
- New search for: Schusser, Georg
- New search for: Krause, Michael
In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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2275-2279
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2018
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ISBN:
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ISSN:
- Conference paper / Electronic Resource
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Title:A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
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Contributors:Klengel, Robert ( author ) / Klengel, Sandy ( author ) / Schusser, Georg ( author ) / Krause, Michael ( author )
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2018-05-01
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Size:2290281 byte
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ISBN:
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ISSN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Title Page i| 2018
- 1
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In-Situ Stress Determination of Electroless Cu on PCB-Relevant SubstratesBernhard, Tobias / Bruning, Ralf / Sharma, Tanu / Brown, Delilah / Gregoriades, Laurence / Steinhaeuser, Edith / Kempa, Stefan / Bruning, Frank / Luy, Edward Alexandre et al. | 2018
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Title Page iii| 2018
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Copyright Page| 2018
- 5
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Table of Contents| 2018
- 9
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Stretchable, Printable and Electrically Conductive Composites for Wearable RF AntennasSong, Bo / Wu, Fan / Moon, Kyoung-sik / Bahr, Ryan / Tentzeris, Manos / Wong, CP et al. | 2018
- 15
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A Study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) Assembly Using an Ultrasonic Bonding MethodYoon, Dal-Jin / Lee, Sang Hoon / Paik, Kyung-Wook et al. | 2018
- 21
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Development of Novel BT Laminate Material for Low-Loss and High Speed TransmissionShigaki, Masahiko / Suzuki, Mika / Kobayashi, Takashi / Takano, Kentarou / Tsuchida, Takaki / Hiramatsu, Sotaro / Ueno, Yoshitaka / Kida, Tsuyoshi / Yoshida, Shu / Oshima, Toyoji et al. | 2018
- 28
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Organic Substrate Material with Low Transmission Loss and Effective in Suppressing Package Warpage for 5G ApplicationTonouchi, Shunsuke / Mizushima, Etsuo / Fukuda, Tomio / Shimada, Tomokazu / Nakamura, Yukio / Iijima, Toshiyuki et al. | 2018
- 33
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Porous Epoxy Film for Low Dielectric Constant Chip Substrates and BoardsJiang, Jisu / Phillips, Oluwadamilola / Keller, Landon / Kohl, Paul A. et al. | 2018
- 40
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Development of Multi-layered Build-Up Insulation Dry-Film Material for Ultra-Low Transmission Loss Wirings for High-Speed Semi-Conductor PackagingGuan, Zhong / Endo, Arata / Hanada, Tadahiko et al. | 2018
- 45
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A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO PackagingPu, Han-Ping / Kuo, H. J. / Liu, C. S. / Yu, Douglas C. H. et al. | 2018
- 52
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Fan-Out Panel Level Package with Fine Pitch PatternKim, Jinyoung / Choi, Ikjun / Park, JunHyeong / Lee, Jae-Ean / Jeong, TaeSung / Byun, Jungsoo / Ko, YoungGwan / Hur, Kangheon / Kim, Dae-Woo / Oh, Kyung Suk et al. | 2018
- 55
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Welcome Message from the General Chair and Program Chair| 2018
- 57
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Executive Committee| 2018
- 58
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Program Committee| 2018
- 58
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Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating ProcessesHollman, Richard / Dimov, Ognian / Malik, Sanjay / Hichri, Habib / Arendt, Markus et al. | 2018
- 64
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Low Cost Si-Less RDL Interposer Package for High Performance Computing ApplicationsSuk, Kyoung-Lim / Lee, Seok Hyun / Kim, Jong Youn / Lee, Seok Won / Kim, Hak Jin / Lee, Su Chang / Kim, Pyung Wan / Byun, Jung Soo / Kim, Dae-Woo / Oh, Dan et al. | 2018
- 70
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Panel Level Packaging - A View Along the Process ChainBraun, Tanja / Becker, K.-F. / Hoelck, O. / Kahle, R. / Wohrmann, M. / Boettcher, L. / Topper, M. / Stobbe, L. / Zedel, H. / Aschenbrenner, R. et al. | 2018
- 79
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Patterning High Resolution Features Through the Integration of an Advanced Lithography System with a Novel Nozzleless Spray Coating TechnologyMach, Jack / Shay, Corey / Erickson, Stuart / Smith, Gary et al. | 2018
- 86
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Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level IntegrationsBertheau, Julien / Inoue, Fumihiro / Phommahaxay, Alain / Peng, lan / Iacovo, Serena / Rassoul, Nouredine / Sleeckx, Erik / Rebibs, Kenneth / Miller, Andy / Beyer, Gerald et al. | 2018
- 92
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Novel Failure Analysis Techniques for 1.8 µm Pitch Wafer-to-Wafer BondingSchmidt, Christian / Lechner, Lorenz / De Wolf, Ingrid / Kim, Soon-Wook / Beyne, Eric et al. | 2018
- 97
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Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip StacksSchultz, Mark / Cabral, Cyril / Tsang, Cornelia / Maria, Joana / Andry, Paul / Chen, Qianwen / Chainer, Timothy et al. | 2018
- 103
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Assembly Process Development of Ultra Large Scale 3D Stacking with Transmission Circuits Via TSVsKikuchi, Shunichi / Kira, Hidehiko / Suwada, Makoto / Nakada, Tatsumi / Nakamura, Naoaki / Kainuma, Norio / Kanai, Kazuhiro / Masuyama, Takumi et al. | 2018
- 111
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The Principles of "Smart" Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar ApplicationsTehrani, Bijan / Bahr, Ryan / Revier, Daniel / Cook, Benjamin / Tentzeris, Manos et al. | 2018
- 118
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A New Microsystem Packaging Approach Using 3D Printing Encapsulation ProcessGoubault, Baptiste / Aspar, Gabrielle / Souriau, Jean-Charles / Castagne, Laetitia / Simon, SimonGilles / Di Cioccio, Lea / Brechet, Yves et al. | 2018
- 125
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A Design Study of 3D Printed Reduced Height Waveguide StructuresGjokaj, Vincens / Chahal, Premjeet et al. | 2018
- 131
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Self-Powered, Inkjet Printed Electrochromic Films on Flexible and Stretchable Substrate for Wearable Electronics ApplicationsAzhar, Ebraheem Ali / Alford, Terry / Yu, Hongbin et al. | 2018
- 139
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Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding ReliabilityAsokan, Muthappan / Caperton, Josh / Thompson, Zach / Chyan, Oliver / Chowdhury, Mahmud / O'Connor, Shawn / Nguyen, Luu et al. | 2018
- 144
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A Monte Carlo Approach to Predicting Failure Across Multiple Temperature and Humidity Field EnvironmentsTucker, Jonathon / Dhakal, Ramji / Thiel, George / Jadhav, Virendra et al. | 2018
- 150
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Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land PadZeng, Kejun / Williamson, Jaimal et al. | 2018
- 157
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Understanding Underfill Degradation in Reliability Testing Conditions for ADAS Package DevelopmentLin, Ziyin / Subramanian, Vijay / Malatkar, Pramod / Ananthakrishnan, Nisha et al. | 2018
- 162
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Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal AgingAhmed, Sudan / Wu, Jing / Fu, Nianjun / Suhling, Jeffrey C. / Lall, Pradeep et al. | 2018
- 172
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Reliability Enhancement of Automotive Electronic Modules Using Various GluesXie, Dongji / Wu, Zhongming / Hai, Joe / Economou, Manthos et al. | 2018
- 179
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High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric VehiclesDwarakanath, Shreya / Raj, P. Markondeya / Smet, Vanessa / Sundaram, Venky / Losego, Mark D / Tummala, Rao et al. | 2018
- 185
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Small Shielded Bluetooth Module Equipped with Slot Antenna on the SurfaceYamada, Keiju / Sano, Makoto / Higaki, Makoto / Happoya, Akihiko et al. | 2018
- 191
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A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar ApplicationsHo, Cheng-Yu / Hsieh, Sheng-Chi / Jhong, Ming-Fong / Wang, Chen-Chao / Ting, and Chun-Yen et al. | 2018
- 197
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An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging ApplicationsGu, Xiaoxiong / Liu, Duixian / Baks, Chris / Plouchart, Jean-Olivier / Lee, Wooram / Valdes-Garcia, Alberto et al. | 2018
- 202
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InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System IntegrationWang, Chuei-Tang / Tang, Tzu-Chun / Lin, Chun-Wen / Hsu, Che-Wei / Hsieh, Jeng-Shien / Tsai, Chung-Hao / Wu, Kai-Chiang / Pu, Han-Ping / Yu, Douglas et al. | 2018
- 208
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Mm-Wave Antenna in Package (AiP) Design Applied to 5th Generation (5G) Cellular User Equipment Using Unbalanced SubstrateLu, Ying-Wei / Fang, Bo-Siang / Mi, Hsuan-Hao / Chen, Kuan-Ta et al. | 2018
- 214
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Novel 3D-/Inkjet-Printed Flexible On-package Antennas, Packaging Structures, and Modules for Broadband 5G ApplicationsLin, Tong-Hong / Bahr, Ryan / Tentzeris, Manos / Pulugurtha, Raj / Sundaram, Venky / Tummala, Rao et al. | 2018
- 221
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A Compact 27 GHz Antenna-in-Package (AiP) with RF Transmitter and Passive Phased Antenna ArrayXue, Mei / Cao, Liqiang / Wang, Qidong / Qiu, Delong / Li, Jun et al. | 2018
- 227
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A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYSDiyaroglu, Cagan / Oterkus, Selda / Oterkus, Erkan et al. | 2018
- 236
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Adaptive Curvature Flexure Test to Assess Flexible Electronic SystemsChen, Rui / Chow, Justin / Taylor, Christine / Meth, Jeffrey / Sitaraman, Suresh et al. | 2018
- 243
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Parametric Optimization and Yield Probability Prediction of Package WarpageHuang, Shenghua / Ji, Zhongli / Liu, Yangming / Ye, Ning / Takiar, Hem et al. | 2018
- 249
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An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded UnderfillYeh, Shu-Shen / Lin, Po-Yao / Lee, Kuang-Chun / Wang, Jin-Hua / Lin, Wen-Yi / Yew, Ming-Chih / Lai, Po-Chen / Hsu, Chia-Kuei / Yang, Che-Chia / Jeng, Shin-Puu et al. | 2018
- 255
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Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETSChen, Chih-Sung / Kao, Nicholas / Jiang, Don Son et al. | 2018
- 267
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Numerical/Experimental Hybrid Approach to Predict Warpage of Thin Advanced SubstratesKim, Byung / Han, Bongtae et al. | 2018
- 273
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Warpage and Thermal Stress under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu PlateKanemoto, Masaki / Aoki, Masaaki / Mochizuki, Akihiro / Murakami, Yoshio / Tsunoda, Mutsuharu / Nakano, Nobuhiko et al. | 2018
- 279
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Laser Sintering of Dip-Based All-Copper InterconnectsDel Carro, Luca / Kossatz, Martin / Schnackenberg, Lucas / Fettke, Matthias / Clark, Ian / Brunschwiler, Thomas et al. | 2018
- 287
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Low Temperature Fine-Pitch Wafer-Level Cu-Cu Bonding Using Nanoparticles Fabricated by PVDWu, Zijian / Wang, Qian / Song, Changming / Cai, Jian et al. | 2018
- 293
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Transient Liquid Phase Bonding Using AgSn-Alloys for Stress Reduced Sensor MountingFeiBt, Markus / Yu, Jun / Wilde, Juergen et al. | 2018
- 301
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Demonstration of Patternable All-Cu Compliant Interconnections with Enhanced Manufacturability in Chip-to-Substrate ApplicationsMohan, Kashyap / Shahane, Ninad / Sosa, Ramon / Khan, Sadia / Raj, P. Markondeya / Antoniou, Antonia / Smet, Vanessa / Tummala, Rao et al. | 2018
- 308
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Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection ProcessYang, Sean / Hung, Han-Tang / Nishikawa, Hiroshi / Kao, C. Robert et al. | 2018
- 314
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Scaling Package Interconnects Below 20µm Pitch with Hybrid BondingGao, Guilian / Mirkarimi, Laura / Fountain, Gill / Wang, Liang / Uzoh, Cyprian / Workman, Thomas / Guevara, Gabe / Mandalapu, Chandrasekhar / Lee, Bongsub / Katkar, Rajesh et al. | 2018
- 323
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Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert AtmosphereChew, Ly May / Schmitt, Wolfgang / Schwarzer, Christian / Nachreiner, Jens et al. | 2018
- 331
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Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN ApplicationChen, Zihao / Guan, Lim Teck / Wee Ho, David Soon / Bhattacharya, Surya et al. | 2018
- 337
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3D Heterogeneous Integration with Multiple Stacking Fan-Out PackageHsu, Feng-Cheng / Lin, Jackson / Chen, Shuo-Mao / Lin, Po-Yao / Fang, Jerry / Wang, Jin-Hua / Jeng, Shin-Puu et al. | 2018
- 343
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Study of Advanced Fan-Out Packages for Mobile ApplicationsHwang, Taejoo / Oh, Dan / Song, Eunseok / Kim, Kilsoo / Kim, Jaechoon / Lee, Seokwon et al. | 2018
- 349
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An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration ApplicationsLin, Yu-Min / Wu, Sheng-Tsai / Shen, Wen-Wei / Huang, Shin-Yi / Kuo, Tzu-Ying / Lin, Ang-Ying / Chang, Tao-Chih / Chang, Hsiang-Hung / Lee, Shu-Man / Lee, Chia-Hsin et al. | 2018
- 355
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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous IntegrationKo, Cheng-Ta / Yang, Henry / Lau, John / Li, Ming / Li, Margie / Lin, Curry / Lin, JW / Chen, Tony / Xu, Iris / Chang, Chieh-Lin et al. | 2018
- 364
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Design and Fabrication of Feasible 3D Optoelectronics Integration Based on Embedded IC Fanout TechnologyLiu, Fengman / Guo, Xueping / She, Qian / Hou, Fengze / Xue, Haiyun / Sun, Yu / He, Huimin / Yu, Zhaoyao / Zhang, Wenqi / Cao, Liqiang et al. | 2018
- 370
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A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm PitchPodpod, Arnita / Slabbekoorn, John / Phommahaxay, Alain / Duval, Fabrice / Salahouelhadj, Abdellah / Gonzalez, Mario / Rebibis, Kenneth / Miller, Andy / Beyer, Gerald / Beyne, Eric et al. | 2018
- 379
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Low-Temperature Assembly of Surface-Mount Device on Flexible Substrate Using Additive Printing ProcessTaylor, Christine / He, Xuanke / Smet, Vanessa / Tentzeris, Manos / Sitaraman, Suresh et al. | 2018
- 386
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Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding TechnologiesCheng, Wei-Yuan / Yang, Chen-Tsai / Lin, Jie-Mo / Chen, Wei-Han / Wang, Tai-Jui / Lee, Yuh-Zheng et al. | 2018
- 392
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Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000Seyama, Kohei / Wada, Shoji / Eguchi, Yuji / Nakamura, Tomonori / Day, Doug / Sugawa, Shigetoshi et al. | 2018
- 401
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Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-Level Hybrid Bonding in 3D IntegrationLu, Cheng-Hsien / Kho, Yi-Tung / Yang, Yu-Tao / Chen, Yu-Pei / Chen, Chiao-Pei / Hung, Tsung-Tai / Chen, Chiu-Feng / Chen, Kuan-Neng et al. | 2018
- 407
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Advances in Memory Die StackingMarte, Andreas / Ernst, Urban / Clauberg, Horst / Buergi, Daniel / Chylak, Bob / Wu, Jie / Yauw, Oranna / Friederichs, Ulf / Barthold, Ulrich et al. | 2018
- 419
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Plasma Treatment for Fluxless Flip-Chip Chip-Joining ProcessGodard, Maxime / Drouin, Dominique / Darnon, Maxime / Martel, Serge / Fortin, Clement et al. | 2018
- 425
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Effects of Laser Selective Reflow on Solder Joint Microstructure and ReliabilityWentlent, Luke / Genanu, Mohammed / Alghoul, Thaer et al. | 2018
- 434
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Die Attach Delamination Analysis and Modeling Between Temperature Cycling and Thermal Shock for Exposed Pad Lead Frame DevicesKoziol, Madison / Suzuki, Yutaka / Gurrum, Siva / Khan, Muhammad et al. | 2018
- 440
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A Comparison Study of Cu Dissolution Mechanism and Kinetics in Solder Joints under Electromigration and Extended ReflowGoyal, Deepak / Liu, Pilin / Overson, Alan et al. | 2018
- 448
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Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating TemperatureLall, Pradeep / Yadav, Vikas / Suhling, Jeff / Locker, David et al. | 2018
- 460
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Innovative Design of Crackstop Wall for 14nm Technology Node and BeyondRabie, Mohamed / Polomoff, Nicholas A. / Hassan, Md Khaled / Calero-DdelC, Victoria L. / Degraw, Danielle / Hecker, Michael / Thiele, Michael / Bazizi, El Mehdi et al. | 2018
- 467
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Back-end-of-Line (BEOL) Mechanical Integrity Evaluation: A Mixed-Mode Double Cantilever Beam Test for Crackstop Strength AssessmentCioban, Max / Sinha, Tuhin / Shaw, Thomas M. et al. | 2018
- 476
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Study of the Long Term Reliability of 3D IC under Near-Application ConditionsAhmed, Omar / Jalilvand, Golareh / Dieguez, Jessica / Su, Peng / Jiang, Tengfei et al. | 2018
- 483
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The Expermental and Numerical Study of Electromigration in 2.5D PackagingXu, Jiefeng / Niu, Yuling / Cain, Stephen R. / McCann, Scott / Lee, Ho Hyung / Refai-Ahmed, Gamal / Park, S.B. et al. | 2018
- 490
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Modeling and Design of a 3D Interconnect Based Circuit Cell Formed with 3D SiP Techniques Mimicking Brain Neurons for Neuromorphic Computing ApplicationsMiao, Min / Wang, Liyuan / Chen, Tianfang / Sun, Lei / Duan, Xiaoyang / Zhang, Jincan / Li, Na / Fang, Runiu / Sun, Xin / Liu, Huan et al. | 2018
- 498
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Surface Mount Electroosmotic Pump for Integrated Microfluidic Printed Circuit BoardsBabikian, Sarkis / Jinsenji, Makoto / Bachman, Mark / Li, G.P. et al. | 2018
- 504
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Cryogenic Qubit Integration for Quantum ComputingDas, Rabindra / Yoder, Jonilyn / Rosenberg, Danna / Kim, David / Yost, Donna-Ruth / Mallek, Justin / Hover, David / Bolkhovsky, Vladimir / Kerman, Andrew / Oliver, William et al. | 2018
- 515
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A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiPBorel, Stephan / Duperrex, L. / Deschaseaux, E. / Charbonnier, J. / Clediere, J. / Wacquez, R. / Fournier, J. / Souriau, J.-C. / Simon, G. / Merle, A. et al. | 2018
- 521
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Supply-Chain Security Enhancement by Chaotic Wireless Chip-Package-Board Interactive PUFTakahashi, Masanori / Nagata, Makoto / Miura, Noriyuki et al. | 2018
- 527
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Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil TransceiversNieweglowski, Krzysztof / Seiler, Patrick / Fritsche, David / Lungen, Sebastian / Plettemeier, Dirk / Carta, Corrado / Ellinger, Frank / Bock, Karlheinz et al. | 2018
- 533
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Long Range LiDAR Characterisation for Obstacle Detection for use by the Visually Impaired and BlindO'Keeffe, Rosemary / Gnecchi, Salvatore / Buckley, Steve / O'Murchu, Cian / Mathewson, Alan / Lesecq, Suzanne / Foucault, Julie et al. | 2018
- 539
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Pressure-Less Sintering on Large Dies Using Infrared Radiation and Optimized Silver Sinter PasteSchmitt, Wolfgang / Chew, Ly May / Miller, Robert et al. | 2018
- 545
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Direct Bonding Silver to Aluminum Using Eutectic Reaction in AirFu, Shao-Wei / Lee, Chin C. et al. | 2018
- 551
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Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) BondingCho, Junghyun / Dong, Fei / Yin, Liang / Shaddock, David et al. | 2018
- 557
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Nano-Cu Sintering Paste for High Power Devices Die Attach ApplicationsZhao, Jinjin / Yao, Min / Lee, Ning-Cheng et al. | 2018
- 564
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Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-Temperature Power ModulesTatsumi, Hiroaki / Lis, Adrian / Monodane, Takeshi / Yamaguchi, Hiroshi / Kashiba, Yoshihiro / Hirose, Akio et al. | 2018
- 568
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Detection of Liquefaction by DSC for Cu-Sn TLP BondingLemettre, Sylvain / Alphonse, Pierre / Isac, Nathalie / Hammami, Sana / Seok, Seonho / Moulin, Johan / Bosseboeuf, Alain et al. | 2018
- 574
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High Performance Metal-Based Nanocomposite Thermal Interface Materials Toward Enhanced Cooling Efficiency in Electronic ApplicationsNagabandi, Nirup / Yegin, Cengiz / Akbulut, Mustafa et al. | 2018
- 580
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Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiPKi, WonMyoung / Lee, WonGeoL / MoK, InSu / Lee, IlBok / Do, WonChul / Kolbehdari, Moh / Copia, Alex / Jayaraman, Suresh / Zwenger, Curtis / Lee, KangWook et al. | 2018
- 587
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High Performance, High Density RDL for Advanced PackagingYu, C. H. / Yen, L. J. / Hsieh, C. Y. / Hsieh, J. S. / Chang, Victor C. Y. / Hsieh, C. H. / Liu, C. S. / Wang, C. T. / Yee, KC / Yu, Doug C. H. et al. | 2018
- 594
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Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed LayersLau, John / Li, Ming / Lei, Yang / Li, Margie / Xu, Iris / Chen, Tony / Chen, Sandy / Yong, Qing Xiang / Janardhanan, Kumar / Kai, Wu et al. | 2018
- 601
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Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based ProcessChen, Wei-Chung / Lee, Chiu-Wen / Kuo, Hung-Chun / Chung, Min-Hua / Wang, Chaung-Chi / Huang, Shang-Kun / Liao, Yen-Sen / Wang, Chen-Chao / Tarng, David et al. | 2018
- 607
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Micro Bump System for 2nd Generation Silicon Interposer with GPU and High Bandwidth Memory (HBM) Concurrent IntegrationLee, Jaesik / Lee, Chun Yang / Kim, Chongho / Kalchuri, Shantanu et al. | 2018
- 613
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Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large PackagesLiu, Fuhan / Ito, Hirokazu / Zhang, Rui / DeProspo, Bartlet H / Benthaus, Fabian / Akimaru, Hisanori / Hasegawa, Kouichi / Sundaram, Venky / Tummala, Rao R et al. | 2018
- 619
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Advanced Anodic Aluminum Oxide Interposer Fabrication and 3D Embedded InductorsChan, Hsiang-Yu / Bachman, Mark / Li, Guann Pyng et al. | 2018
- 625
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2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out PackagesRavichandran, Siddharth / Yamada, Shuhei / Park, Giback / Chen, Han-Wen / Shi, Tailong / Buch, Chintan / Liu, Fuhan / Smet, Vanessa / Sundaram, Venky / Tummala, Rao et al. | 2018
- 631
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Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)Huang, Chen-Yu / Hsu, Yuan-Hung / Lu, Ying-Ju / Yu, Kuo-Hua / Tsai, Wen-Shan / Lin, Chang-Fu / Chung, C. Key et al. | 2018
- 638
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A Novel Application of Chemical Mechanical Polishing for Panel Level Organic and Glass SubstrateCheng, Shyh-Lian / Chen, Wei-Chun / Lin, Puru Bruce / Ko, Cheng-Ta / Chen, Yu-Hua et al. | 2018
- 643
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Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip PackageChen, ChiYuan / Hsu, Ian / Lin, Stanley / Kang, KeonTaek / Hsieh, Ming-Che et al. | 2018
- 649
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The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump InterconnectionLee, SeYong / Lee, HanMin / Park, JongHo / Shin, SangMyung / Kim, WooJeong / Choi, TaeJin / Paik, Kyung-Wook et al. | 2018
- 656
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Chip-Package Interaction Challenges for Large Die ApplicationsWu, Zhuo-Jie / Carey, Charles / Donavan, Samantha / Hunt, Doug / Justison, Patrick / Anemikos, Theo / Cincotta, John / Gagnon, Hugues / Chacon, Oswaldo / Martel, Robert et al. | 2018
- 663
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Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large PitchNah, Jae-Woong / Hung, Li-Wen / Andry, Paul / Knickerbocker, John et al. | 2018
- 669
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Reduce the Wafer Warpage Introduced by Cu in RDL Through Adjusting the Cooling TemperaturesCheng, Gong / Xu, Gaowei / Gai, Wei / Luo, Le et al. | 2018
- 675
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Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding ConceptWoehrmann, Markus / Braun, Tanja / Toepper, Michael / Land, Klaus-Dieter et al. | 2018
- 682
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Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal ManagementHong, Jisun / Choi, Kyoungsei / Oh, Dan / Park, SB / Shao, Shuai / Wang, Huayan / Niu, Yuling / Pham, Van Lai et al. | 2018
- 693
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Stacking Yield Prediction of Package-on-Package Considering the Statistical Distributions of Top/Bottom Package Warpages and Solder Ball HeightsWei, Hsiu-Ping / Han, Bongtae et al. | 2018
- 703
-
Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive BondingGoodhue, Normand-Pierre / Danovitch, David / Moussodji Moussodji, Jeff / Papineau, Benoit / Duchesne, Eric et al. | 2018
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Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out PackagesPark, JongHo / Lee, HanMin / Lee, SeYoung / Kyung, Youjin / Kim, Jung Hak / Lee, Kwangjoo / Paik, Kyung-Wook et al. | 2018
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Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material PropertiesZhang, Qiming / Lo, Jeffery C. C. / Lee, S. W. Ricky / Xu, Wei et al. | 2018
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Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh EnvironmentLall, Pradeep / Deshpande, Shantanu / Nguyen, Luu et al. | 2018
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Study of Interface Micro-Voids Between Sputter Cu & Plating Cu: The Role of PhotoresistOu, Y. B. / Yang, T. L. / Wu, W. C. / Chen, B. T. / Lee, K. Y. / Huang, H. L. / Liu, C. S. / Pang, Ponder / Chen, Edward / Liu, K. C. et al. | 2018
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Prediction of Statistical Distribution of Vibration-Induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-Rich Solder AlloysWei, Hsiu-Ping / Yang, Yu-Hsiang / Wu, Bulong / Han, Bongtae et al. | 2018
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Experimental Strain Energy Density Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages MeasurementsLibot, Jean-Baptiste / Dulondel, F. / Milesi, P. / Alexis, J. / Arnaud, L. / Dalverny, O. et al. | 2018
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Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test MethodThukral, Varun / Zaal, J.J.M. / Roucou, R. / Jalink, J. / Rongen, R.T.H.. et al. | 2018
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Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection TechniqueB. Reddy, Vishnu V. / Ume, I. Charles / Mebane, Aaron / Imediegwu, Chidinma / Akinade, Kola / Chaudhuri, Amiya R. / Rogers, Bryan / Hill, Mark / Guirguis, Cherif / Lee, Tae-Kyu et al. | 2018
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Enhanced Design and Reliability Analysis of Copper Post Wafer Level PackageKuo, Kuei Hsiao / Chen, Austin / Wang, Yen Neng / Wang, Jiunn Jie / Chang, Jovi / Chien, Feng Lung / Lee, Rick et al. | 2018
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Development of Integrated Thermistor Sensor and Heating Electrode for Renal Denervation ProcedureLim, Ruiqi / Cheng, Ming-Yuan / Chen, Weiguo / Choong, David Sze Wai / Park, Jae Hyung / Oh, Jung Soo / Song, Sebastian Seung Woo / Park, Eul Joon / Gu, Yuandong et al. | 2018
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Nanomembrane Hybrid Electronics for Wireless Detection of Sourness and Saltiness Toward an Artificial Taste SystemLee, Yongkuk / Mahmood, Musa / Kim, Yun Soung / Mishra, Saswat / Yeo, Woon-Hong et al. | 2018
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Cost-Efficient Formation of Flexible Pressure Sensor with Micropillar Arrays by Metal-Assisted Chemical Etching for Wearable Electronic SkinHu, Yougen / Zhang, Xinyu / Zhu, Pengli / Zhao, Tao / Zhang, Yuan / Sun, Rong / Wong, Ching-Ping et al. | 2018
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A Harmonic RF Phase-Shifter Based Wireless pH SensorMondal, Saikat / Kumar, Deepak / Karuppuswami, Saranraj / Chahal, Premjeet et al. | 2018
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Integration of Chip-Scale SERF Atomic Magnetometers for Magnetoencephalography MeasurementLi, Guoliang / Shang, Jintang / Ji, Yu / Lu, Lin / Pan, Zhihua et al. | 2018
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Cu-In Fine-Pitch-Interconnects with Enhanced Shear StrengthBickel, Steffen / Hoehne, Robert / Panchenko, Iuliana / Meyer, Joerg / Wolf, M. Juergen et al. | 2018
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Study of Wearables with Embedded Electronics Through Experiments and SimulationsChow, Justin H. / Sitaraman, Suresh K. / May, Christopher / May, Joseph et al. | 2018
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Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs Using Fan-Out Wafer Level Packaging TechnologyUemura, Hiroshi / Warabi, Kaori / Ohira, Kazuya / Kurita, Yoichiro / Yoshida, Haruhiko / Furuyama, Hideto / Sugizaki, Yoshiaki / Shibata, Hideki et al. | 2018
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Single-Mode Optical Coupling Technology Using Movable Micro-Mirror Array and Surface-Emitting DFB Laser Array for High-Density 3-D IntegrationSuzuki, Takanori / Adachi, Koichiro / Matsuoka, Yasunobu / Tanaka, Shigehisa et al. | 2018
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3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and BeyondKim, Do-Won / Li, Hong Yu / Chang, Ka Fai / Loh, Woon Leng / Chong, Ser Choong / Cai, Hong / Surya, Bhattacharya et al. | 2018
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Broadband, Polarization-Insensitive Lensed Edge Couplers for Silicon PhotonicsSnyder, Bradley / Lepage, Guy / Balakrishnan, Sadhishkumar / Verheyen, Peter / Pantouvaki, Marianna / Absil, Philippe / Van Campenhout, Joris et al. | 2018
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400 Gbps 2-Dimensional Optical Receiver Assembled on Wet Etched Silicon InterposerLi, Chenhui / Stabile, Ripalta / Kraemer, Finn / Li, Teng / Raz, Oded et al. | 2018
- 854
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EOCB-Platform for Integrated Photonic Chips Direct-on-Board Assembly within Tb/s ApplicationsLamprecht, Tobias / Betschon, Felix / Lambrecht, Joris / Ramon, Hannes / Yin, Xin / Bruderer, Alex / Premerlani, Romeo et al. | 2018
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Integrated Multi-wavelength Laser Source for SensingPare-Olivier, Gabriel / Ayotte, Simon / Costin, Francois / Babin, Andre / Morin, Michel / Filion, Benoit / Bedard, Keven / Ghislain, Bilodeau / Girard-Deschenes, Emile / Chretien, Philippe et al. | 2018
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Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic LoadingChowdhury, Md Mahmudur / Hoque, Mohd Aminul / Fu, Nianjun / Suhling, Jeffrey C. / Hamasha, Sa'd / Lall, Pradeep et al. | 2018
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Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy SystemMurayama, Kei / Aizawa, Mitsuhiro / Oi, Kiyoshi et al. | 2018
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The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring JointsLovberg, Andreas / Tegehall, Per-Erik et al. | 2018
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Microstructure Evolution of Cu/In/Cu Joints After Solid-Liquid InterdiffusionChiu, Yu Shan / Kao, C. Robert et al. | 2018
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Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance MonitorsSivasubramony, Rajesh Sharma / Adams, Nardeeka / Alhendi, Mohammed / Khinda, Gurvinder Singh / Kokash, Maan Z / Lombardi, Jack P / Raj, Arun / Thekkut, Sanoop / Weerawarne, Darshana L / Yadav, Manu et al. | 2018
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Board Level Reliability Investigation of FO-WLP PackageHou, Stephen / Tsai, K. H. / Wu, M.F. / Ku, M.F. / Tsao, P.H. / Chu, L. H. et al. | 2018
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Multi-Axis Loading Impact on Thermo-Mechanical Stress-Induced Damage on WLCSP and Components With Via-in Pad Plated Over (VIPPO) Board Design ConfigurationSheikh, Mohamed / Hsiao, Andy / Xie, Weidong / Perng, Steven / Ibe, Edward / Loh, Karl / Lee, Tae-Kyu et al. | 2018
- 916
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Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration ConceptZoschke, Kai / Oppermann, Hermann / Paul, Johannes / Knoll, Heiko / Braun, Franz-Josef / Saumer, Monika / Theis, Martin / Frank, Peter / Lenkl, Andreas / Klose, Fabian et al. | 2018
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High Dielectric Constant Molding Compounds for Fingerprint Sensor PackagesTang, Tom / Chen, Kelly / Tsai, Kevin / Lu, Max / Tsai, Jensen / Wang, Yu-Po et al. | 2018
- 932
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Concept for Using MID Technology for Advanced PackagingWurz, Ing. / Wurz, Marc Christopher / Bengsch, Sebastian / Roesener, Bernd / Beringer, Sebastian et al. | 2018
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Chipless RFID with Fully Inkjet Printed Tags: A Practical Case Study for Low Cost Smart Packaging ApplicationsWittkopf, Jarrid / Ge, Ning / Ionescu, Robert / Staehler, Wagston / Pederson, Doug / Holder, Helen et al. | 2018
- 948
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Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical MonitorAlghoul, Thaer M. / Yadav, Manu / Thekkut, Sanoop / Sivasubramony, Rajesh S. / Greene, Christopher M. / Poliks, Mark D. / Borgesen, Peter / Wentlent, Luke / Meilunas, Michael / Stoffel, Nancy et al. | 2018
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Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS ApplicationsLee, Bongsub / Katkar, Rajesh / Gao, Guilian / Fountain, Gill / Lee, Sangil / Wang, Liang / Mandalapu, Chandrasekhar / Uzoh, Cyprian / Mirkarimi, Laura / Sykes, Bob et al. | 2018
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Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell ResonatorsSu, Zhaoxi / Shang, Jintang / Luo, Bin / Wong, Ching-Ping et al. | 2018
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Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level PackagingOi, Yosuke / Fujii, Yasuhito / Hiraoka, Takashi / Yada, Yukio / Kan, Katsushi et al. | 2018
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Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test ResultsKikuchi, Kazuhiro / Nedzu, Yuusuke / Sugino, Takashi et al. | 2018
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The Impact of Thermal Shrinkage of Glass Carriers on Achieving Fine Pitch Wiring Through Fan-Out WLP/PLP ProcessNomura, Shuhei / Hayashi, Kazutaka et al. | 2018
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Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-upPhommahaxay, Alain / Podpod, Arnita / Slabbekoorn, John / Sleeckx, Erik / Beyer, Gerald / Beyne, Eric / Guerrero, Alice / Bai, Dongshun / Arnold, Kim et al. | 2018
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Novel Microwave Process for RDL Photosensitive Dielectric Polymer Curing on FOWLP Reconstructed WaferYamamoto, Kazunori / Wang, Chun-Mei / Wang, Xiang-Yu / Koh, Tuck-Foong / Deng, Felix et al. | 2018
- 1000
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Fabrication of Fine Via and Line / Space in Low CTE Film For Panel Fan-out Using a Dry Etching TechnologyMorikawa, Yasuhiro / Sato, Muneyuki / Murayama, Takahide / Fujinaga, Tetsushi et al. | 2018
- 1005
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Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDLNair, Chandrasekharan / DeProspo, Bartlet / Hichri, Habib / Arendt, Markus / Liu, Fuhan / Sundaram, Venky / Tummala, Rao et al. | 2018
- 1010
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Seal Rings Toughness Characterization by Numerical and Experimental ApproachesRaid, Idir / Gallois-Garreignot, Sebastien / Estevez, Rafael / Coutellier, Vincent et al. | 2018
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Reliability Life Assessment of WLCSP Using Different Creep ModelsRamachandran, V. / Wu, K. C. / Lee, C. C. / Chiang, K. N. et al. | 2018
- 1023
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On the Uniqueness and Sensitivity of Nanoindentation Testing for Determining Elastic and Plastic Material Properties of Electroplating Copper Filled in Through-Silicon-Via (TSV)El Barbary, Mahmoud / Chen, Liangbiao / Liu, Yong / Qin, Fei / Fan, Xuejun et al. | 2018
- 1030
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Co-design for Extreme Large Package Solution with Embedded Fine Pitch Interposer (EFI) TechnologyChe, Fa Xing / Ho, David / Chai, T.C. et al. | 2018
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Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar PackagesWang, Wei / Zhang, Dingyou / Sun, Yangyang / Rae, David / Zhao, Lily / Zheng, Jiantao / Schwarz, Mark / Shah, Milind / Syed, Ahmer et al. | 2018
- 1044
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A Study of Organic Chip Carrier Fatigue CrackingLi, Shidong / Iruvanti, Sushumna / Sikka, Kamal / Wang, Rui et al. | 2018
- 1050
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Developments for Highly Reliable Electronics - Experiments on Combined Thermal and Vibration LoadingKarsten, Meier / Mike, Roellig / Karlheinz, Bock et al. | 2018
- 1054
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Package Co-design of a Fully Integrated Multimode 76-81GHz 45nm RFCMOS FMCW Automotive Radar TransceiverMi, Minhong / Moallem, Meysam / Chen, Jie / Li, Ming / Murugan, Rajen et al. | 2018
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Embedded Active Elements in 3D Printed Structures for the Design of RF CircuitsMohd Ghazali, Mohd Ifwat / Karuppuswami, Saranraj / Mondal, Saikat / Chahal, Premjeet et al. | 2018
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Miniaturized High-Performance Filters for 5G Small-Cell ApplicationsAli, Muhammad / Liu, Fuhan / Watanabe, Atom / Raj, P. Markondeya / Sundaram, Venkatesh / Tentzeris, Manos M. / Tummala, Rao. R. et al. | 2018
- 1076
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3D-IPD with High Aspect Ratio Cu Pillar InductorKung, Cheng-Yuan / Chen, Chien-Hua / Lee, Teck Chong / Lin, Hung-Yi / Lin, Shiuan-Yu / Hsieh, Yu-Chang / Lee, Pao-Nan / Wang, Chen-Chao et al. | 2018
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Ultra-Compact, High-Performance, 3D-IPD Integrated Using Conformal 3D InterconnectsGhannam, Ayad / Magnani, Alessandro / Bourrier, David / Parra, Thierry et al. | 2018
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Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass SubstratesZihan, Wu / Viswanathan, Sukhadha / Jotz, Matthias / Maune, Holger / Jost, Matthias / Raj, P. Markondeya / Sundaram, Venkatesh / Tummala, Rao et al. | 2018
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Through Glass Via (TGV) Based Band Pass Filter for 5G CommunicationsBowrothu, Renuka / Yoon, Yong-Kyu / Zhang, Jay et al. | 2018
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Direct Fabrication for Polymer Optical Waveguide in PMT Ferrule Using the Mosquito MethodIshigure, Takaaki / Masuda, Hikaru / Date, Kumi / Marushima, Chinami / Enomoto, Tadayuki et al. | 2018
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Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive FunctionsJanta-Polczynski, Alexander / Cyr, Elaine / Langlois, Richard / Fortier, Paul / Taira, Yoichi / Boyer, Nicolas / Barwicz, Tymon et al. | 2018
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Low Reflectance and Reflowable Thermoplastic Optical Lens Without AR CoatingYakabe, Sho / Watanabe, Takuro / Shimazu, Takayuki / Hokari, Ryohei / Kurihara, Kazuma / Okabe, Shouhei et al. | 2018
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Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric ActuatorsCardarelli, Simone / Calabretta, Nicola / Stabile, Ripalta / Williams, Kevin / Luo, Xiao / Mink, Jan et al. | 2018
- 1130
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Co-integration of High-Bandwidth Photonic and Electronic RDL on 2.5D Glass Interposers Using Low Optical Absorption Photoimageable Dielectric PolymerZhang, Rui / Liu, Fuhan / Gallagher, Michael / Anzures, Ed / Sundaram, Venky / Tummala, Rao et al. | 2018
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Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic SystemsBottger, Gunnar / Schroder, Henning / Schneider-Ramelow, Martin / Lang, Klaus-Dieter et al. | 2018
- 1140
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Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board CouplingMangal, Nivesh / Missinne, Jeroen / Van Campenhout, Joris / Van Steenberge, Geert / Snyder, Brad et al. | 2018
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Low-Cost and Self-Formed Vertical Nanowires with Aspect Ratio >100x in Deep Si-Trenches for Future 3D-LSI/IC ApplicationsMurugesan, M. / Bea, T. Fukushima J.C. / Hashimoto, H. / Koyanagi, M. et al. | 2018
- 1152
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First Demonstration of Silicon-Like >250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut PlanarizationDeProspo, Bartlet / Liu, Fuhan / Nair, Chandrasekharan / Kubo, Atsushi / Wei, Frank / Chen, Ye / Sundaram, Venkatesh / Tummala, Rao R. et al. | 2018
- 1158
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Dielectric Quality of 3D Capacitor Embedded in Through-Silicon Via (TSV)Lin, Ye / Tan, Chuan Seng et al. | 2018
- 1164
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Experimental Assessment and Analysis of the Influence of Radiation on Through-Silicon ViasZeng, Qinghua / Chen, Jing / Jin, Yufeng et al. | 2018
- 1170
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Co-deposition of Nano-Size SiC Particles in Micro-ViaWu, Houya Wu / Wang, Yan / Wang, Fuliang / Chen, Zhuo / He, Hu / Wang, Liancheng / Zhu, Wenhui et al. | 2018
- 1176
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A Study of Crystal Orientation of Solder TSVsOhra, Yuki / Inagaki, Yuki / Mizutani, Atsushi / Asami, Kazushi et al. | 2018
- 1181
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Characterization of Optical End-Point Detection for Via Reveal ProcessingJourdain, Anne / Tutunjyan, Nina / DeVos, Joeri / Sardo, Stefano / Piumi, Daniele / Miller, Andy / Beyne, Eric / Walsby, Edward / Ashraf, Huma / Thomas, Dave et al. | 2018
- 1188
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Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)Chen, Zhaohui / Lau, Boon Long / Ding, Zhipeng / Ching Wai, Eva Leong / Han, Beibei / Bu, Lin / Chang, Hyun-Kee / Chai, Tai Chong et al. | 2018
- 1194
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Fan Out Package: Performance and Scalability PerspectiveKim, Jong Heon / Kwon, Young Tae / Kwon, Yong Ho / Yeo, Yong Woon / Lee, Young Mo / Park, Yoon Mook / Lee, Eung Ju / Lee, Jun Kyu / Kim, Nam Chul / Lee, Sangdon et al. | 2018
- 1200
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Board Level Reliability Enhancement of WLCSP with Large Chip SizeTsao, Pei-Haw / Lu, T. H. / Chen, T. M. / Chang, K. C. / Kuo, C. M. / Lii, M. J. / Chu, L. H. et al. | 2018
- 1206
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Controlling Underfill Lateral Flow to Improve Component Density in Heterogeneously Integrated Packaging SystemsFaucher-Courchesne, Christophe / Danovitch, David / Brault, Lise / Paquet, Marie-Claude / Turcotte, Eric et al. | 2018
- 1214
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Dual-Carrier Process Using Mechanical and Laser Release Technologies for Advanced Wafer-Level PackagingFowler, Michelle / Massey, John P. / Trichur, Ramachandran K. / Koch, Matthew et al. | 2018
- 1220
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Optimization of Electrodeposited Copper for Sub 5 µm L/S Redistribution Layer Lines by Plating AdditivesSchmidt, Ralf / Beck, T. / Rooney, R. / Gewirth, A. et al. | 2018
- 1226
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UBM/RDL Deposition by PVD for FOWLP in High Volume ProductionJones, Chris / Burgess, Steve / Wilby, Tony / Densley, Paul et al. | 2018
- 1233
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Embedded Components for High Temperature Automotive ApplicationsGrubl, Wolfgang / Gross, Stephanie / Schuch, Bernhard et al. | 2018
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New Failure Mechanism in High Temperature Resin MaterialsGuyenot, Michael / Maas, D. / Ratchev, R. / Khoshamouz, A. / Gottwald, T. / Kreuer, S. et al. | 2018
- 1245
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Next Generation of Automotive Radar with Leading-Edge Advances in SiGe Devices and Glass Panel Embedding (GPE)Shi, Tailong / Gong, Yunyi / Ravichandran, Siddharth / Sundaram, Venky / Cressler, John D. / Tummala, Rao et al. | 2018
- 1251
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Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power ElectronicsVladimirova, Kremena / Widiez, Julie / Letowski, Bastien / Perreau, Pierre / Enyedi, Gregory / Coudrain, Perceval / Rouger, Nicolas / Crebier, Jean-Christophe et al. | 2018
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Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power DensityBoettge, Bianca / Naumann, F. / Behrendt, S. / G. Scheibel, M. / Kaessner, S. / Klengel, S. / Petzold, M. / G. Nickel, K. / Hejtmann, G. / Z. Miric, A. et al. | 2018
- 1270
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Mechanism of Ultrasonic-Assisted Sintering of Cu@Ag NPs Paste in air for High-Temperature Power Device PackagingJi, Hongjun / Li, Mingyu et al. | 2018
- 1276
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Design Consideration of a 3D Stacked Power Supply on ChipOno, Kota / Hiura, Kengo / Matsumoto, Satoshi et al. | 2018
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Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect FabricJangam, SivaChandra / Bajwa, Adeel Ahmed / Thankkappan, Kannan K / Kittur, Premsagar / Iyer, Subramanian Srikantes et al. | 2018
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High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical DesignHeyfitch, Vadim / Dong, Shen / Na, Nanju / Shi, Hong / Gandhi, Jaspreet / Xi, Jane / Wu, Susan et al. | 2018
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Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL PackagesYou, Se-Ho / Jeon, Seonghwan / Oh, Dan / Kim, Kilsoo / Kim, Jaechoon / Cha, Seung-Yong / Kim, GyoungBum et al. | 2018
- 1302
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FCBGA Fundamental Technology Realizing 56 Gbps PAM-4 System with 50 cm Electric TransmissionNakagawa, Kazuyuki / Chujo, Norio / Yagyu, Masayoshi / Uematsu, Yutaka / Tsuchiya, Keita / Katayama, Shinji / Sato, Yoshiaki / Uchida, Hiroyuki / Baba, Shinji et al. | 2018
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De-sensitization Design and Analysis for Highly Integrated RFSoC and DRAM Stacked-Die DesignLin, Sheng-Mou / Hsu, Chih-Chun / Hsu, Yi-An / Han, Fu-Yi / Ho, Duen-Yi / Wu, Wen-Zhou / Chen, Charles Nan-Cheng et al. | 2018
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Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave ApplicationsClingenpeel, Timothy / Hwangbo, Seahee / Garraud, Nicolas / Arnold, David / Yoon, Yong-Kyu et al. | 2018
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Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip LastHuang, Chih-Yi / Hsieh, Tsun-Lung / Pan, Po-Chih / Jhong, Ming-Fong / Wang, Chen-Chao / Hsieh, Sheng-Chi et al. | 2018
- 1330
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Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and VibrationLall, Pradeep / Thomas, Tony / Suhling, Jeff et al. | 2018
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Interface Fracture Toughness Characterization in Electronic Packages Using the Crack Surface Displacement Extrapolation MethodGromala, Przemyslaw / Jeronimo, Mateus / Prisacaru, Alexandru / Schulz, Marcus / Keller, Juergen et al. | 2018
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Simulation for Enhancing Automotive Power Module DBC Reliability During Assembly ProcessLiu, Yong / Qian, Qiuxiao et al. | 2018
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A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead DevicesGurrum, Siva / Prakuzhy, Manu / Li, Guangxu / Lin, Hung-Yun / Gandhi, Saumya / Arroyo, J. Carlos / Mortan, Frank / Nangia, Amit et al. | 2018
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High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded TechnologyHou, Fengze / Guo, Xueping / Wang, Qidong / Wang, Wenbo / Lin, Tingyu / Cao, Liqiang / Zhang, G. Q. / Ferreira, J. A. et al. | 2018
- 1371
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Mars 2020 Rover Laser Power Supply Thermomechanical AnalysisCepeda-Rizo, Juan / Tuman, David et al. | 2018
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Mechanical Modelling of High Power Lateral IGBT for LED Driver ApplicationsRajaguru, Pushparajah / Bailey, Chris / Lu, Hua / Castellazzi, Alberto / Antonini, Mattia / Pathirana, Vasantha / Udugampola, Nishad / Udrea, Florin / Mitchelson, Paul / Aldhaher, Samer et al. | 2018
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On-chip Solid-State CMOS Compatible Micro-SupercapacitorsAndersson, Rickard / Saleem, Amin M. / Desmaris, Vincent / Song, Bo / Wong, Ching Ping et al. | 2018
- 1389
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Fabrication of High Capacitance Density Capacitor Using Spray Coated Ba0.6Sr0.4TiO3 Thin FilmsTetsi, Emmanuel / Bord Majek, Isabelle / Philippot, Gilles / Aymonier, Cyril / Lemire, Roxan / Audet, Jean / Bechou, Laurent / Drouin, Dominique et al. | 2018
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Structuring Methods of Polymers for low Cost Sensor ManufacturingBengsch, Sebastian / Wurz, Marc Christopher / Aue, Maximilian / de Wall, Sascha et al. | 2018
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Solely Calcine Controlled Ferroelectricity and Resistivity of Barium Titanate Thin Films and Their Advanced Memory ApplicationsSchumann, Todd / Zhu, Xiaochen / Neff, Jacob / Hebard, Arthur / Zmuda, Henry / Yoon, Yong-Kyu et al. | 2018
- 1407
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Electrochemical Analysis of Mechanically Flexible Magnesiumion Battery Electrodes in a Polymer Gel Perchlorate ElectrolyteHoughton, Todd / Yu, Hongbin et al. | 2018
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Demonstration of Hermetic Sealing on Ultra-Thin, Wafer-Integrated Aluminum-Polymer Capacitors for High-Voltage and High-Temperature ApplicationsSpurney, Robert / Sharma, Himani / Pulugurtha, Markondeya / Tummala, Rao / Lollis, Naomi / Weaver, Mitch / Gandhi, Saumya / Romig, Matt et al. | 2018
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Hydrothermal Exfoliation for Two-Dimension Boron Nitride NanosheetsYang, Guang / Wang, Haixu / Wang, Ning / Sun, Rong / Wong, Ching-Ping et al. | 2018
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Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C RangeHook, Michael David / Mayer, Michael / Hunter, Stevan et al. | 2018
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Molecular Dynamics Simulation of Microwelds Formation and Breakage During Ultrasonic Copper Wire BondingLong, Yangyang / He, Bo / Cui, Weizhe / Zhuang, Xiaoying / Twiefel, Jens et al. | 2018
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Investigation for Highly Reliable Free Air Ball Formation for Silver Bonding WireAraki, Noritoshi / Ichiyama, Yasutomo / Oishi, Ryo / Yamada, Takashi et al. | 2018
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Corrosion Mechanisms of Cu Wire Bonding on Al PadsQin, Wentao / Anderson, Harold / Anderson, Tom / Chang, George / Barrientos, Denise et al. | 2018
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Low Temperature Solder - A Breakthrough Technology for Surface Mounted DevicesSahasrabudhe, Shubhada / Mokler, Scott / Renavikar, Mukul / Sane, Sandeep / Byrd, Kevin / Brigham, Eric / Jin, Owen / Goonetilleke, Pubudu / Badwe, Nilesh / Parupalli, Satish et al. | 2018
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Advances in Wire Bonding Technology to Overcome Resonance ConditionsShah, Aashish / Schulze, Gary / Brunner, Jon / Qin, Ivy / Chylak, Bob / Wong, Nelson et al. | 2018
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3-D Antenna-in-Package Design with Metallic Coating TechniqueHsu, Chih-Chun / Lin, Sheng-Mou / Chen, Ying-Chih / Wu, Wen-Zhou / Chou, Che-Ya / Chen, Charles Nan-Cheng / Gao, Gavin / Wang, Chen-Chao et al. | 2018
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Void-Free Copper Pillar Hybrid Wafer Bonding Using a BCB Based Polymer Adhesive and Chemical Mechanical PolishingGallagher, Michael / Kozhukh, Julia / VanHanehem, Matthew / Anzures, Ed / Bell, Rosemary / Kondo, Masaki et al. | 2018
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Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoTMartins, Alberto / Pinheiro, Marcio / Ferreira, Ana Filipa / Almeida, Rodrigo / Matos, Filipe / Oliveira, Joana / Silva, Rui Pedro / Santos, Hugo / Monteiro, Manual / Gamboa, Hugo et al. | 2018
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Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System IntegrationMa, Shuying / Wang, Jiao / Zheng, Fengxia / Xiao, Zhiyi / Wang, Teng / Yu, Daquan et al. | 2018
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"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC InterconnectsDe Vos, Joeri / Van Huylenbroeck, Stefaan / Jourdain, Anne / Heylen, Nancy / Peng, Lan / Jamieson, Geraldine / Tutunjyan, Nina / Sardo, Stefano / Miller, Andy / Beyne, Eric et al. | 2018
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Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based InterconnectsHanna, Amir / Alam, Arsalan / Fukushima, Takafumi / Moran, Steven / Whitehead, William / Jangam, Siva Chandra / Pal, Saptadeep / Ezhilarasu, Goutham / Irwin, Randall / Bajwa, Adeel et al. | 2018
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Heterogeneous Multi-die Stitching: Technology Demonstration and Design ConsiderationsJo, Paul / Hossen, Md Obaidul / Zhang, Xuchen / Zhang, Yang / Bakir, Muhannad et al. | 2018
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Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing SolutionsKnickerbocker, John / Budd, R. / Dang, B. / Chen, Q. / Colgan, E. / Hung, L.W. / Kumar, S. / Lee, K. W. / Lu, M. / Nah, J.W. et al. | 2018
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Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking ApplicationsJourdain, Anne / De Vos, Joeri / Rassoul, Nouredine / Zahedmanesh, Houman / Miller, Andy / Beyer, Gerald / Beyne, Eric / Walsby, Edward / Patel, Jash / Ansell, Oliver et al. | 2018
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Development of a Polyimide/SiC-Whisker/Nano-Particles Composite with High Thermal Conductivity and Low Coefficient of Thermal Expansion as Dielectric Layer for Interposer ApplicationSun, Yunna / Luo, Jiangbo / Yang, Zhuoqing / Wang, Yan / Ding, Guifu / Wang, Zhenqian et al. | 2018
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An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out PackagesOKamoto, Daichi / Shibasaki, Yoko / Shibata, Daisuke / Hanada, Tadahiko / Liu, Fuhan / Sundaram, Venky / Tummala, Rao R et al. | 2018
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Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die StackingFukuzumi, Shizu / Onozeki, Hitoshi / Suzuki, Naoya / Nonaka, Toshihisa et al. | 2018
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Reliability Studies of 5 µm Diameter Photo Vias with Daisy Chain Resistance Using Dry Film Photosensitive Dielectric MaterialKubo, Atsushi / Nair, Chandrasekharan / DeProspo, Bartlet / Liu, Fuhan / Ando, Tomoyuki / Sundaram, Venky / Tummala, Rao et al. | 2018
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Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration ApplicationsPanigrahi, Asisa Kumar / C, Hemanth Kumar / Bonam, Satish / K, Brince Paul / Ghosh, Tamal / Paul, Nirupam / Vanjari, Siva Rama Krishna / Singh, Shiv Govind et al. | 2018
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Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET SubstrateChoi, Kwang-Seong / Braganca Junior, Wagno Alves / Jeong, leeseul / Jang, Keon-Soo / Moon, Seok Hwan / Bae, Hyun-Cheol / Eom, Yong-Sung / Cho, Min Kyo / Chang, Seung Il et al. | 2018
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Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed LayersLau, John / Li, Ming / Yang, Lei / Li, Margie / Yong, Qing Xiang / Cheng, Zhong / Chen, Tony / Xu, Iris / Fan, Nelson / Kuah, Eric et al. | 2018
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Passivation Materials for a Reliable Fine Pitch RDLStephane, Moreau / Allouti, Nacima / Ribiere, Celine / Charbonnier, Jean / Bouchu, David / Michel, Jean-Philippe / Buffet, Nicolas / Chausse, Pascal et al. | 2018
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Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) MethodPham, Van-Lai / Niu, Yuling / Wang, Jing / Wang, Huayang / Singh, Charandeep / Park, Seungbae / Zhong, Cheng / Koh, Sau Wee / Wang, Jifan / Shao, Shuai et al. | 2018
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Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile ApplicationsChen, Cheng / Wang, Teng / Yu, Daquan / Ma, Shuying / Zhu, Kai / Xiao, Zhiyi / Wan, Lixi et al. | 2018
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Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out PackagesHsu, Chia-Kuei / Lin, Po-Yao / Lin, Wen-Yi / Yew, Ming-Chih / Yeh, Shu-Shen / Lee, Kuang-Chun / Wang, Jin-Hua / Lai, Po-Chen / Yang, Che-Chia / Jeng, Shin-Puu et al. | 2018
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Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-Time Moiré InterferometryWu, Bulong Wu / Han, Bongtae et al. | 2018
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Reliability Study of Large Fan-Out BGA Solution on FinFET ProcessYu, C.K. / Chiang, W.S. / Huang, P.S. / Lin, M.Z. / Fang, Y.H. / Lin, M.J. / Peng, Cooper / Lin, Benson / Huang, Michael et al. | 2018
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Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress TestLall, Pradeep / Luo, Yihua / Nguyen, Luu et al. | 2018
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Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip PackageQuelennec, Aurore / Ayadi, Yosri / Vandier, Quentin / Duchesne, Eric / Fremont, Helene / Drouin, Dominique et al. | 2018
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Improving Solder Joint Reliability for PoP Packages in Current Mobile EcosystemDhandapani, Karthikeyan / Zheng, Jiantao / Roggeman, Brian / Hsu, Marcus et al. | 2018
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Experimental Investigation of Temperature and Mean Stress Effects on High Cycle Fatigue Behavior of SnAgCu-Solder AlloyManiar, Youssef / Konstantin, Georg / Kabakchiev, Alexander / Binkele, Peter / Schmauder, Siegfried et al. | 2018
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Water Effects in Polymers Through Molecular DynamicsIwamoto, Nancy et al. | 2018
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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power CyclingShao, Shuai / Niu, Yuling / Wang, Jing / Liu, Ruiyang / Park, Seungbae / Lee, Hohyung / Refai-Ahmed, Gamal / Yip, Laurene et al. | 2018
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Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last PackagesShih, Meng-Kai / Chen, Ryan / Chen, PeterBS / Lee, Ying-Chih / Chen, KarenYU / Hu, Ian / Chen, Tang-Yuan / Tsai, Lung / Chen, Eatice / Tsai, Eddie et al. | 2018
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Analog Power Filtering: Modeling, Measuring & Analog PIMr., Matthew S. Doyle / Mr., Layne A. Berge / Mr., Kyle B. Schoneck et al. | 2018
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Improved Staggered Through Silicon Via Inductors for RF and Power ApplicationsSun, Xiao / Van der Plas, Geert / Beyne, Eric et al. | 2018
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Realization of High Electrical Performance On-chip Thick Copper Inductor Package by Via Interface Process Improvement for Metal ContactYang, T. L. / Yang, S. B. / Huang, W. L. / Chen, C. C. / Kuo, C. C. / Huang, G. C. / Wu, K. Y. / Chang, T. C. / Hsu, C.C. / Chang, C. L. et al. | 2018
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An Approach for PDN Simplification of a Mobile ProcessorMoon, Sungwook / Nam, Seungki / Son, Jungil / Sunha Lee, Sunha Lee et al. | 2018
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Design Optimization and Accurate Extraction of On-die Decoupling Capacitors for High-Performance ApplicationsLiu, Xiaoping / Ren, Jihong / Beyene, Wendem / Ku, Simon / Heah, Chin Hong / Hsu, Sherman et al. | 2018
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Signal and Power Integrity Analysis of InFO Interconnect for Networking ApplicationChang, Po-Hao / Hsieh, Chia-Yuan / Chang, Chun-Wei / Chuang, Chih-Lun / Chiang, Chen-Feng et al. | 2018
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A System-in-Package Based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded InductorsLee, Edward / Amir, Mohammad Faisal / Sivapurapu, Sridhar / Pardue, Colin / Torun, Hakki Mert / Bellaredj, Mohamed / Swaminathan, Madhavan / Mukhopadhyay, Saibal et al. | 2018
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Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression BondingCheemalamarri, Hemanth Kumar / panigrahi, Asisa Kumar / Bonam, Satish / Paul, Nirupam / Vanjari, Siva Rama Krishna / Singh, Shiv Govind et al. | 2018
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Reliability Test of Organic Substrate Processed by Newly Desmear Method "PhotodesmearTM"Endo, Shinichi / Habu, Tomoyuki / Muto, Yasushi / Yabu, Shintaro et al. | 2018
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Highly-Conductive Stretchable Electrically Conductive Composites by Halogenation Treatment and Its Application in Stretchable ElectronicsZheng, Peng / Zhuo, Haoyue / Zou, Yuxiao / Guo, Wei / Wu, Hao / Li, Zhuo et al. | 2018
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Electroplating Enhanced Silver Nanowire Networks for Transparent HeatersWang, Shang / Tian, Yanhong et al. | 2018
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Wet-Spun Graphene Sheets as Flexible Heat Spreaders for Efficient Thermal ManagementYang, Guang / Yan, Yuze / Li, Zhuo / Li, Chaowei / Yao, Yagang et al. | 2018
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Aging Characteristics of Green Mold Compound for Use in Encapsulation of Microelectronic DevicesManoharan, Subramani / Patel, Chandradip / Dunford, Steven / Morillo, Carlos / McCluskey, Patrick et al. | 2018
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Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress BuffersMavinkurve, A. / Zaal, Jeroen / Liang, Yukai / Xu, Sean / Storez, Antoine / Guo, Yuan / Teng, Seng / Chopin, Sheila et al. | 2018
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High Temperature Mechanical Behavior of SAC and SAC+X Lead Free SoldersAlam, Mohammad S. / Hassan, KM Rafidh / Suhling, Jeffrey C. / Lall, Pradeep et al. | 2018
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Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of DeathLall, Pradeep / Zhang, Hao / Lall, Rahul et al. | 2018
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Backward Compatible Connectors for Next Generation PCIe Electrical I/OShan, Lei / Freidman, Daniel / Kennedy, Craig / Persak, Warren / Lau, Kevin et al. | 2018
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PCB Pin Area Wire Modeling Based on Representative Layer 2D MisregistrationChen, Zhaoqing et al. | 2018
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Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level PackagingLee, Chia-Hsin / Su, Jay / Liu, Xiao / Wu, Qi / Lin, Jim-Wein / Lin, Puru / Ko, Cheng-Ta / Chen, Yu-Hua / Shen, Wen-Wei / Kou, Tzu-Ying et al. | 2018
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High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA ApplicationJoo, Kisu / Lee, Kyu Jae / Hwang, Jung Woo / Yoon, Jin-Ho / Kim, Yoon-Hyun / Park, Joo-Wook / Yim, Myung Jin / Jeong, Se Young et al. | 2018
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Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic WavesBrand, Sebastian / Bottge, Bianca / Kogel, Michael / Naumann, Falk / Zijl, Jurrian / Kersjes, Sebastiaan / Behrens, Thomas / Altmann, Frank et al. | 2018
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Reliability Study and Finite Element Modeling of a Wearable Sensor Patch (WSP) to Monitor ECG SignalsPoliks, Mark / Soman, Varun / Turner, James / Schadt, Mark / Shay, Michael / Egitto, Frank et al. | 2018
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Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal CycleRovitto, Marco / Morelli, Arianna / Passagrilli, Carlo / Villa, Claudio Maria et al. | 2018
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Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal AgingZhou, Shiqi / Mokhtari, Omid / Nishikawa, Hiroshi et al. | 2018
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Low Dielectric Properties Encapsulation for High Frequency DevicesKanagawa, Naoki / Sasaki, Daisuke / Yamatsu, Shigeru et al. | 2018
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Controlling Die Warpage by Applying Under Bump Metallurgy for Fan-Out Package Process ApplicationsPark, Hwan-Pil / Kim, Young-Ho / Jang, Young-Moon / Choa, Sung-Hoon et al. | 2018
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Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) AssemblyBajwa, Adeel Ahmad / Jangam, SivaChandra / Pal, Saptadeep / Vaisband, Boris / Irwin, Randall / Goorsky, Mark / Iyer, Subramanian S. et al. | 2018
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Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level PackagingZhang, Hong / Liu, Xiao / Rickard, Shawna / Puligadda, Rama / Flaim, Tony et al. | 2018
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The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 µm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA)Park, Hwan-Pil / Kim, Seongchul / Lee, Taeyoung / Yoo, Sehoon / Kim, Young-Ho / Park, Jae-Yong Park et al. | 2018
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Laser-Based Full Cut Dicing Evaluations for Thin Si Wafersvan Borkulo, Jeroen / Stam, Richard van der et al. | 2018
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Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal PerformanceTang, Gongyue / Chai, Tai Chong / Zhang, Xiaowu et al. | 2018
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Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-on-Wafer (WOW) IntegrationKim, Y. S. / Kodama, S. / Mizushima, Y. / Araki, N. / Hsiao, C. / Chang, H. / Lin, C. / Ohba, T. et al. | 2018
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Design, Fabrication and Characterization of TSV Interposer Integrated 3D Capacitor for SIP ApplicationsLi, Jiwei / Ma, Shenglin / Liu, Huan / Guan, Yong / Chen, Jing / Jin, Yufeng / Wang, Wei / Hu, Liulin / He, Shuwei et al. | 2018
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High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature ApplicationsYang, Chun An / Kao, C. Robert / Nishikawa, Hiroshi / Lee, Chin C. et al. | 2018
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RF Characterization, Analysis and Miniaturization Impact of RDL InterconnectsJacquinot, Helene / Farcy, Alexis / Lacrevaz, Thierry / Morot, Kevin / Flechet, Bernard / Segaud, Roselyne / Velard, Remi / Arnaud, Lucile / Barbe, Jean-Charles / Cheramy, Lucile et al. | 2018
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Integration of the SERF Magnetometer and the Mz Magnetometer Using Micro-Fabricated Alkali Vapor CellZhang, Jin / Shang, Jintang / Li, Guoliang / Lu, Lin / Pan, Zhihua / Ji, Yu / Wong, Ching-Ping et al. | 2018
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Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface ResistanceNedumthakady, Nithin / DeProspo, Bartlet / Raj, P. Markondeya / Sundaram, Venky Sundaram / Tummala, Rao / Byers, Kyle / Garrison, Sean / Gibson, Chris / Elsbury, Michael et al. | 2018
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Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond ContactsKlengel, Robert / Naumann, Falk / Tismer, Sebastian / Klengel, Sandy et al. | 2018
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Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal TransmissionsWatanabe, Atom / Lin, Tong-Hong / Raj, P. Markondeya / Sundaram, Venky / Tentzeris, Manos M. / Tummala, Rao R. / Ogawa, Tomonori et al. | 2018
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Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal CyclingHamasha, Sa'd / Akkara, Francy / Abueed, Mohammed / Rababah, Mumen / Zhao, Cong / Su, Sianan / Suhling, Jeffery / Evans, John et al. | 2018
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Electromigration Behavior and Mechanical Properties of the Whole Preferred Orientation Intermetallic Compound Interconnects for 3D PackagingHuang, M.L. / Zou, L. / Yin, S.Q. et al. | 2018
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3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive FilmYamatsu, Shigeru / Watanabe, Kazuki / Kanagawa, Naoki / Ishikawa, Takatoshi / Kojio, Teppei et al. | 2018
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2D Magnetic Inductors for DC-DC Converters on Glass InterposerLafage, Vincent / Beilliard, Yann / Sridhar, Arvind / Brunschwiler, Thomas / Drouin, Dominique et al. | 2018
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Modeling and Characterization of a Hermetic Ceramic Package and Its Performance Impact on a 1.5-7V Input, 3-A, Radiation-Hardened Ultra-Low Dropout (LDO) RegulatorValle, Javier / Ming, Li / Murugan, Rajen / Holloway, Jeff / Stiborek, Leon et al. | 2018
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Electrical Characterization of a High Speed HBM Interface for a Low Cost InterposerDittrich, Michael / Heinig, Andy / Hopsch, Fabian et al. | 2018
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Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D System-in-Packaging (SiP) Using Compact Through Glass Via (TGV)-Integrated AntennasHwangbo, Seahee / Yoon, Yong-Kyu / Shorey, Aric B. et al. | 2018
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Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDsHanss, Alexander / Schmid, Maximilian / Bhogaraju, Sri Krishna / Conti, Fosca / Elger, Gordon et al. | 2018
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Comparison of Package-on-Package Technologies Utilizing Flip Chip and Fan-Out Wafer Level PackagingLujan, Amy et al. | 2018
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Fork Type Structure of Silicon Waveguide for Optical Efficiency OptimizationWang, Warren / Yang, OnionZY / Tu, Shian / Lu, Meiju / Chen, Jihan / Lin, Vincent et al. | 2018
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Effect of Improved Optimization of DFE Equalization on Crosstalk and Jitter in High Speed Links with Multi-level SignalDikhaminjia, Nana / He, J. / Deng, H. / Tsiklauri, M. / Drewniak, J. / Chada, A. / Mutnury, B. et al. | 2018
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Copper Transparent Antennas on Flexible Glass by Subtractive and Semi-Additive Fabrication for Automotive ApplicationsLombardi, Jack / Malay, Robert / Schaffner, James / Song, Hyok Jae / Huang, Ming-Huang / Pollard, Scott / Poliks, Mark / Talty, Timothy et al. | 2018
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Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned FilmsOstrowicki, Gregory / Gurrum, Siva / Nangia, Amit et al. | 2018
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Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold ThicknessJeong, Haksan / Myung, Woo-Ram / Jung, Kwang-Ho / Jung, Seung-Boo et al. | 2018
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Design of a Compact Broadband Butler Matrix and Its Application in Organic Beam-Former at the 5 GHz BandHsu, Chung-Yi / Chiang, Chia-Ling / Hwang, Lih-Tyng / Chang, Fa-Shian et al. | 2018
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Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element MethodsLiang, Shui-Bao / Ke, Chang-Bo / Wei, Cheng / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2018
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Electrical Design for the Development of FOWLP for HBM IntegrationLim, Teck Guan / Wee, David HO Soon et al. | 2018
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Accurate Electrical Modeling of Through Silicon Via with Minority Carrier Redistribution EffectLiu, Huan / Fang, Runiu / Sun, Xin / Miao, Min / Jin, Yufeng et al. | 2018
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Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF DevicesCai, Han / Ma, Shenglin / Wang, Wei / Jin, Yufeng / Chen, Jing / Zhang, Jian / Xiang, Weiwei / Hu, Liulin / He, Shuwei et al. | 2018
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Alternative Deposition Solution for Cost Reduction of TSV IntegrationVitiello, Julien / Piallat, Fabien et al. | 2018
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Evaluation of Mechanical Stress Induced During IC PackagingCherman, Vladimir / Lofrano, Melina / Gonzalez, Mario / Cadacio, Francisco / Rebibis, Kenneth June / Beyne, Eric / Takano, Akihito / Higashi, Mitsutoshi et al. | 2018
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Wireless EAS Sensor Tags for Volatile Profiling in Food PackagesKaruppuswami, Saranraj / Mohd Ghazali, Mohd Ifwat / Mondal, Saikat / Chahal, Premjeet et al. | 2018
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High Throughput and Improved Edge Straightness for Memory Applications Using Stealth DicingSuzuki, Natsuki / Ohba, Takayuki / Kondo, Yuta / Sakamoto, Takeshi / Uchiyama, Naoki / Atsumi, Kazuhiro et al. | 2018
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Thick 3D Printed RF Components: Transmission Lines and Bandpass FiltersPark, Kyoung Youl / Ghazali, Mohd Ifwat Mohd / Wiwatcharagoses, Nophadon / Chahal, Premjeet et al. | 2018
- 2192
-
Introduction of a New Metric for the Solder Joint Reliability Assessment of BGA Packages on System LevelSchempp, Fabian / Dressler, Marc / Kraetschmer, Daniel / Loerke, Friederike / Wilde, Juergen et al. | 2018
- 2198
-
Compact Optical Coherent Receiver for Avionics ApplicationsAyotte, Simon / Bilodeau, Ghislain / Blanchet-Letourneau, Jocelyn / Morin, Michel / Deladurantaye, Pascal / Costin, Francois / Babin, Andre / Perron, Louis-Philippe / Brochu, Guillaume / Davidson, Charles-Andre et al. | 2018
- 2205
-
Parylene as a Dielectric Material for Electronic Applications in SpaceSelbmann, Franz / Baum, Mario / Wiemer, Maik / Joseph, Yvonne / Otto, Thomas et al. | 2018
- 2211
-
Practical Design Method to Reduce Crosstalk for Silicon Wafer Integrated Fan-Out Technology (SWIFT®) PackagesLim, HoJeong / Yang, JeongKyu / Fuentes, Ruben et al. | 2018
- 2218
-
Fully Inkjet-Printed Three-Dimensional Bandpass Filter on Liquid Crystal Polymer SubstrateKao, Hsuan-Ling / Cho, Cheng-Lin et al. | 2018
- 2223
-
A Dynamic Bending Method for PoP Package Board Level Reliability ValidationLee, Jeffrey / Chen, Cheng-Chih / Brown, Lane / Mehretu, Esme / Obrien, Thomas / Lu, Feng et al. | 2018
- 2230
-
Eliminating Harmful Intermetallic Compound Phase in Silver Wire Bonding by Alloying Silver with IndiumWu, Jiaqi / Lee, Chin C. et al. | 2018
- 2237
-
Cyanate Ester/Epoxy Co-Curing System with Thermal Stabilizers for High Temperature StabilityWu, Fan / Song, Bo / Moon, Kyoung-Sik / Wong, CP et al. | 2018
- 2243
-
Demonstration of 28GHz Band Pass Filter Toward 5G Using Ultra Low Loss and High Accuracy Through Quartz ViasSato, Yoichiro / Kidera, Nobutaka et al. | 2018
- 2248
-
Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power ElectronicsXu, Shanshan / Lewis, Ryan / Wen, Rongfu / Yang, Ronggui / Lee, Yung-Cheng / Kim, Woochan / Nguyen, Luu et al. | 2018
- 2260
-
Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology NodesXu, Tingge / Wu, Zhuo-Jie / Zhang, Haojun / Graas, Carole / Justison, Patrick et al. | 2018
- 2267
-
Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon InterposerWietstruck, Matthias / Marschmeyer, Steffen / Kulse, Philipp / VoB, Thomas / Lisker, Marco / Kruger, Andreas / Wolansky, Dirk / Fraschke, Mirko / Kaynak, Mehmet et al. | 2018
- 2275
-
A New, Efficient Method for Preparation of 3D Integrated Systems by Laser TechniquesKlengel, Robert / Klengel, Sandy / Schusser, Georg / Krause, Michael et al. | 2018
- 2280
-
Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography ApplicationsRavi, Bharath Viswanath / Xie, Mayue / Goyal, Deepak et al. | 2018
- 2288
-
Practical High Speed PCB Stackup Tool - Generation and ValidationJiang, Wei / Cai, kevin / Sen, Bidyut / Wang, Guoan et al. | 2018
- 2295
-
A Volatile Molecular Sensor Using Terahertz Resonators on Porous SubstratesKaruppuswami, Saranraj / Byford, Jennifer A. / Chahal, Premjeet et al. | 2018
- 2301
-
Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu Pattern Laminated Fabrics Using B-Stage Non-Conductive Films (NCFs)Jung, Seung-Yoon / Paik, Kyung-Wook et al. | 2018
- 2307
-
Process Development of 4-Die Stack Module Using Moldable UnderfillChong, Ser Choong / Li, Hongyu / Xie, Ling / Lim, Simon Boon / Chen, Zhaohui et al. | 2018
- 2313
-
Integrated Fully Solid-State Capacitor Based on Carbon Nanofibers and DielectricsAndersson, Rickard / Saleem, Amin Muhammad / Desmaris, Vincent et al. | 2018
- 2319
-
Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid EnvironmentKim, Ji-Hye / Lee, Tae-Ik / Kim, Taek-Soo / Paik, Kyung-Wook et al. | 2018
- 2332
-
Design Considerations of a Matching Circuit for Low Power Wake-Up ReceiversOu, Jack et al. | 2018
- 2336
-
Novel Solder Alloy with Wide Service Temperature Capability for Automotive ApplicationsLee, Ning-Cheng / Geng, Jie / Zhang, Hongwen / Mutuku, Francis et al. | 2018
- 2345
-
Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large PackagesMcCann, Scott / Lee, Ho Hyung / Refai-Ahmed, Gamal / Lee, Tom / Ramalingam, Suresh et al. | 2018
- 2351
-
Effect of Shallow Cycling on Flexible Power-Source Survivability under Bending Loads and Operating Temperatures Representative of Stresses of Daily MotionLall, Pradeep / Abrol, Amrit / Leever, Ben / Marsh, Jason et al. | 2018
- 2359
-
Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder JointsFahim, Abdullah / Ahmed, Sudan / Suhling, Jeffrey C. / Lall, Pradeep et al. | 2018
- 2360
-
Fan-Out Wafer-Level Packaging for Heterogeneous IntegrationLau, John / Li, Ming / Li, Margie / Chen, Tony / Xu, Iris / Yong, Qing Xiang / Cheng, Zhong / Fan, Nelson / Kuah, Eric / Li, Zhang et al. | 2018
- 2367
-
Broad-Band Dielectric Probes for On-Wafer Characterization of Terahertz DevicesByford, Jennifer A. / Chahal, Premjeet et al. | 2018
- 2374
-
Machine Learning Driven Advanced Packaging and Miniaturization of IoT for Wireless Power Transfer SolutionsTorun, Hakki Mert / Pardue, Colin / Belleradj, Mohamed L. F / K. Davis, Anto / Swaminathan, Madhavan et al. | 2018
- 2382
-
Application of Additive Manufacturing Technologies for Realization of Multilayer Microstrip Directional FilterSorocki, Jakub / Piekarz, Ilona / Gruszczynski, Slawomir / Wincza, Krzysztof / Papapolymerou, John et al. | 2018
- 2389
-
3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and ChallengesWei, Tiwei / Oprins, Herman / Cherman, Vladimir / De Wolf, Ingrid / Beyne, Eric / Yang, Shoufeng / Baelmans, Martine et al. | 2018
- 2397
-
Design and Surface Modification of PET Substrates Using UV/Ozone Treatment for Roll-to-Roll Processed Solar Photovoltaic (PV) Module PackagingHah, Jinho / Song, Bo / Moon, Kyoung-Sik / Graham, Samuel / Wong, C. P. et al. | 2018
- 2404
-
A Study on the High Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar WaveguideZhang, Shuye / Lin, Tiesong / He, Peng / Park, Junyong / Park, Gapyeol / Song, Huijin / Kim, Joungho / Paik, Kyung-Wook et al. | 2018
- 2416
-
Deep Understanding the role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural ChangesCheng, Gong / Xu, Gaowei / Gai, Wei / Luo, Le et al. | 2018
- 2422
-
A 56 Gbps I/O Interface Design with Exact Power Source Simulation: Total I/O Circuit Design with over 28 GHz from Driver to Receiver Device ModelsOgawa, Daisuke / Iguchi, Daisuke / Wada, Yasutaka / Hashimoto, Kaoru / Taira, Yusuke / Hara, Nobutaka / Otsuka, Kanji et al. | 2018
- 2431
-
Enhancements on Underfill Materials' Thermal Conductivity by Insulation Coating Layer Control of Conductive ParticlesKim, Tae-Ryong / Joo, Kisu / Lim, Boo Taek / Choi, Sung-Soon / Lee, Boung Ju / Yoon, Euijoon / Jeong, Se Young / Yim, Myung Jin et al. | 2018
- 2444
-
Accurate Core Alignment for Polymer Optical Waveguide in the Mosquito Method for High-Efficient CouplingMorimoto, Yoshie / Date, Kumi / Ishigure, Takaaki et al. | 2018
- 2450
-
Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-Heating CVD for Thermal ApplicationsHansson, Josef / Samani, Majid Kabiri / Nylander, Andreas / Ye, Lilei / Wang, Nan / Nilsson, Torbjorn / Liu, Johan et al. | 2018
- 2457
-
Size and Shape Effect in the Determination of the Fracture Strength of Silicon Nitride in MEMS Structures at High TemperaturesNavarrete Gonzalez, Alex Axel / Brace, Eric / Nieva, Patricia et al. | 2018
- 2464
-
A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip AssemblyLee, HanMin / Lee, SeYong / Park, JongHo / Chung, Chang-kyu / Jang, Kyung-Woon / Kim, Il / Choi, SeongWoo / Paik, Kyung-Wook et al. | 2018
- 2470
-
Suspended Microstrip Low-Pass Filter Realized Using FDM Type 3D Printing with Conductive Copper-Based FilamentPiekarz, Ilona / Sorocki, Jakub / Wincza, Krzysztof / Gruszczynski, Slawomir / Papapolymerou, John et al. | 2018
- 2477
-
Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical ReliabilityWang, Jing / Niu, Yuling / Park, Seungbae / Yatskov, Alexander et al. | 2018
- 2484
-
Piezoelectric Ceramics and Flexible Printed Circuits (FPCs) Interconnection Using Anisotropic Conductive Films (ACFs) for Ultrasound Transducers AssemblyPark, Jae-Hyeong / Paik, Kyung-Wook et al. | 2018
- 2492
-
Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF ApplicationsSun, Yunheng / Cai, Han / Li, Jiwei / Ma, Shenglin / Jin, Yufeng / Wang, Wei / Chen, Jing / Miao, Min / Hu, Liulin / He, Shuwei et al. | 2018
- 2498
-
A Novel Integration of Stereolithography and Inkjet Printing for Multichip Modules with High Frequency Packaging ApplicationsBahr, Ryan / Teharani, Bijan / Tentzeris, Manos / Byers, Kyle et al. | 2018
- 2505
-
Author Index| 2018
- 2530
-
Publisher's Information| 2018