Revealing Hidden Defects in Electronic Components With an AI-Based Inspection Method: A Corrosion Case Study (English)
- New search for: Weiss, E.
- Further information on Weiss, E.:
- https://orcid.org/0000-0001-9511-1472
- New search for: Weiss, E.
- Further information on Weiss, E.:
- https://orcid.org/0000-0001-9511-1472
In:
IEEE Transactions on Components, Packaging and Manufacturing Technology
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13
, 7
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1078-1080
;
2023
- Article (Journal) / Electronic Resource
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Title:Revealing Hidden Defects in Electronic Components With an AI-Based Inspection Method: A Corrosion Case Study
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Contributors:Weiss, E. ( author )
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Published in:IEEE Transactions on Components, Packaging and Manufacturing Technology ; 13, 7 ; 1078-1080
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Publisher:
- New search for: IEEE
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Publication date:2023-07-01
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Size:2222579 byte
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents – Volume 13, Issue 7
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 911
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Table of Contents| 2023
- 913
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Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon CarrierSouriau, J.-C. / Poulain, C. / Castagne, L. / Ladner, C. / Hilt, T. / Franiatte, R. / Mermin, D. / David, N. et al. | 2023
- 920
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Design for Silicon Piezoresistive Pressure Sensor ChipsHe, Feng / Feng, Yingqi / Dai, Junjie / Li, Junhui et al. | 2023
- 928
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Electrochemical Vibrating Fan Based on Manganese DioxideKwan, Kin Wa / Wu, Runni / Ngan, Alfonso Hing Wan et al. | 2023
- 935
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In Situ Diagnosis of Multisite Wire Bonding Failures for Multichip IGBT Power Modules Based on Crosstalk VoltageZhang, Wuyu / Qi, Lei / Ji, Bing / Zhang, Xiangyu / Cui, Xiang et al. | 2023
- 945
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A Fast Electrothermal Response Analysis Method for Interconnect Circuits With Multiexcitations in Multilayer PackagesLiu, Yang / Wu, Dehang / Xu, Zhifei / Chu, Xiuqin / Wang, Jun / Xu, Kai-Da et al. | 2023
- 957
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Study on the Fabrication and Characteristics of Tantalum-Nitride (TaN) Thin-Film Strain Gauges on the Silicon Substrate for Silicon-Based Heterogeneous Integration ApplicationCao, Linwei / Wang, Yuexing / Sun, Xiangyu / Zhou, Jie / Kang, Lingfeng / An, Ning et al. | 2023
- 965
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Bandpass Filters Using Single and Cascaded Novel Triple-Mode Ceramic MonoblocksWu, Xinhui / Cao, Yazi / Yuan, Bo / Qi, Yanzhu / Wang, Gaofeng et al. | 2023
- 978
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Inline Cavity Stepped Window Bandpass Filter With Two Transmission ZerosYu, Xuzhou / Wong, Sai-Wai / Lin, Jing-Yu / He, Yejun / Li, Wenting / Zhang, Long / Zhu, Lei / Yu, Li et al. | 2023
- 988
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Application of Ferroelectric Capacitors for Equalization of High-Speed Digital SignalingBorah, Dubari / Gupta, Aarushi / Kalkur, Thottam S. / Miller, Ken et al. | 2023
- 995
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A Novel Fractal RDRA for C-Band ApplicationsGaonkar, Abhijeet / M, Ayyappan / Patel, Pragati et al. | 2023
- 1003
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Inverse Design of Bonding Wire Array Based on Multifidelity Data-Enabled Neural NetworksZhang, Jingwei / Wei, Zhun / Zhu, Enze / Wu, Weiqiang / Chen, Yanning / Kang, Kai / Xie, Hao / Zhao, Dongyan / Yin, Wen-Yan et al. | 2023
- 1013
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High-Performance Interconnects With Reduced Far-End Crosstalk for High-Speed ICs and Communication SystemsGe, Jinqun / Floyd, Richard / Khan, Asif / Wang, Guoan et al. | 2023
- 1021
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A Wideband Physics-Based Model for Coplanar Waveguides With Redistribution Layer ProcessSun, Chenhong / Xia, Chenhui / Lu, Zihao / Lin, Fujiang / Xu, Yuehang / Sun, Liguo et al. | 2023
- 1030
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Three-Dimensional SIP Design of the Four-Channel RF Transceiver Based on Silicon and ALN for X-Band Radar ApplicationsLu, Xilong / Zhou, Shigang / Wei, Bin / Zhou, Liguo et al. | 2023
- 1045
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Review of the Failure Mechanism and Methodologies of IGBT Bonding WireLi, Qi / Li, Yang-Bo / Fu, Hao-Dong / Tu, Chun-Ming / Xiao, Biao / Xiao, Fan / Zhai, Dong-Yuan / Lu, Ji-Wu et al. | 2023
- 1058
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Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics PackagingYeo, Siang Miang / Yow, Ho-Kwang / Yeoh, Keat Hoe et al. | 2023
- 1064
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Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based ModulesZheng, Ting / Bakir, Muhannad S. et al. | 2023
- 1067
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A Surface-Mountable Suspended Integrated Strip-Line Technology Using Castellated ViasWells, Eric W. / Sigmarsson, Hjalti H. / Mcdaniel, Jay W. et al. | 2023
- 1070
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Double N Stubs for Impedance Matching Improvement of Pogo Pin Test Board at mmWave ApplicationsKung, Ming-Lung / Tung, Ya-Ting / Lin, Ken-Huang / Lu, Chun-Lang / Yao, Chun-Han / Luo, Yuan-Wen et al. | 2023
- 1074
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A Fully Symmetric High-Performance Transformer Balun Based on TSV for RF ApplicationsWang, Fengjuan / Zhang, Dingxi / Yin, Xiangkun / Yu, Ningmei / Yang, Yuan et al. | 2023
- 1078
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Revealing Hidden Defects in Electronic Components With an AI-Based Inspection Method: A Corrosion Case StudyWeiss, E. et al. | 2023
- 1083
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TechRxiv: Share Your Preprint Research with the World!| 2023
- 1084
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IEEE Open Access Publishing| 2023
- 1085
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Member Get-a-Member (MGM) Program| 2023
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Front Cover| 2023
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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information| 2023
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IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors| 2023
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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information| 2023