Facile preparation of sintered Cu-Ag bimetallic nanoparticle paste with low porosity (English)
- New search for: Zhi, Jiang
- New search for: Yanhong, Tian
- New search for: Huang, Yuan
- New search for: Wen, Jiayue
- New search for: Zhi, Jiang
- New search for: Yanhong, Tian
- New search for: Huang, Yuan
- New search for: Wen, Jiayue
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ISBN:
- Conference paper / Electronic Resource
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Title:Facile preparation of sintered Cu-Ag bimetallic nanoparticle paste with low porosity
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Contributors:
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2016-08-01
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Size:513826 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Author index| 2016
- 1
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Table of contents| 2016
- 1
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Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad crateringZhang, Qiming / Lo, Jeffery C. C. / Lee, S. W. Ricky et al. | 2016
- 1
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[Copyright notice]| 2016
- 7
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Research on damage-mechanism based prediction methodologies for thermo-mechanical reliability of solder joints in electronic packagingXiao, Hui / Luo, Daojun / Wang, Hongqin et al. | 2016
- 14
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Investigation on damage behavior of lead-free solder joints based on finite element modelingXiao, Hui / Wan, Zhonghua / Luo, Daojun et al. | 2016
- 19
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Facile preparation of sintered Cu-Ag bimetallic nanoparticle paste with low porosityZhi, Jiang / Yanhong, Tian / Huang, Yuan / Wen, Jiayue et al. | 2016
- 22
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Development of multi-stack dielectric wafer bondingPeng, Lan / Kim, Soon-Wook / Inoue, Fumihiro / Wang, Teng / Phommahaxay, Alain / Verdonck, Patrick / Jourdain, Anne / De Vos, Joeri / Sleeckx, Erik / Struyf, Herbert et al. | 2016
- 26
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Investigation of single cut process in mechanical dicing for thick metal waferLiu, Haiyan / Wei, Yadong / Wang, Jianhong / Xu, Sean et al. | 2016
- 31
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Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadingsLong, Xu / Chen, Bingjie / Yao, Yao et al. | 2016
- 37
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Analysis of board level vibration reliability of PoP structure with underfill materialXia, Jiang / Li, GuoYuan / Zhou, Bin et al. | 2016
- 43
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Interconnection of Cu wire/Au plating pads using parallel gap resistance microwelding processLiu, Yang / Tian, Yanhong / Liu, Baolei / Xu, Jikai / Feng, Jiayun / Wang, Chenxi et al. | 2016
- 47
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Fuzzy PID control for impact force of high speed wire bonding processGao, Jian / Dai, Guanhao / Jiang, Yongjun / Wang, Xiaochu / Chen, Yun / Tang, Hui / He, Yunbo et al. | 2016
- 53
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A study for a typical leakage failure of PCBA with no-cleaning processHe, Xiao / Zhou, Liang / Shen, Jianghua et al. | 2016
- 57
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In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesiveZeng, Jinfeng / Ma, Hongru / Tian, Xun / Ma, Yanqing et al. | 2016
- 61
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Multi-layered red, green, and blue phosphor-in-glass for ultraviolet-excited white light-emitting diodes packagingPeng, Yang / Cheng, Hao / Chen, Zhen / Chen, Mingxiang / Li, Ruixin et al. | 2016
- 65
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Luminous efficacy enhancement of phosphor-in-glass based white light-emitting diodes through patterned structurePeng, Yang / Cheng, Hao / Chen, Zhen / Chen, Mingxiang / Wang, Han et al. | 2016
- 69
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Three-dimensional microfabrication of copper column by localized electrochemical depositionXiao, Hongbin / Zeng, Peng / Ren, Xinyu / Wang, Fuliang et al. | 2016
- 73
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Failure analysis for laminate delaminationYang, Ying et al. | 2016
- 76
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Numerical simulation of thermo-mechanical behavior in high power diode laser arraysLu, Yao / Nie, Zhiqiang / Zhang, Pu / Wang, Zhenfu / Xiong, Lingling / Wang, Shuna / Wu, Dihai / Liu, Xingsheng et al. | 2016
- 84
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Fluid dynamics of jetting dispensing process based on simulation and experimentWu, Tao / Deng, Guiling / Zhou, Can / Chen, Wang et al. | 2016
- 88
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Effect of moisture related properties of mold compound on the reliability of power packagesGe, Dandong / Ming, Xue / Shen, Wenjie / Yun, Zhao et al. | 2016
- 94
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Development of RGB phosphor-in-glass for ultraviolet-excited white light-emitting diodes packagingLi, Ruixin / Li, Hong / Peng, Yang / Cheng, Hao / Chen, Zhen / Chen, Mingxiang et al. | 2016
- 98
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Research on the risk identification of mechanical stress damage during electronic assembly processWang, Hongqin / Xiao, Hui / Liang, Chaohui / Lu, Tao / Tian, Wanchun et al. | 2016
- 105
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The realization of big networking and cloud computing dream from contact interconnect methodology to process technology (Part 2)Wang, Paul / He, David / Mai, Goterry / Chung, DF / Kearns, Don et al. | 2016
- 111
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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW modeNie, Zhiqiang / Lu, Yao / Wu, Dihai / Wang, Shuna / Zhang, Pu / Xiong, Lingling / Li, Xiaoning / Shen, Zenan / Wu, Di et al. | 2016
- 116
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Influence of low temperature on tensile properties and fracture behavior of Sn3Ag0.5Cu solder alloyTian, Ruyu / Tian, Yanhong / Wang, Chenxi et al. | 2016
- 119
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Assessment of assembly quality of Chip scale Package LEDs on insulated metal substrateLiu, E / Ankit, Bindhya Raj / Gordon, Elger et al. | 2016
- 125
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Simulation research of the BGA configuration on the RF transmission performanceWang, Bo / Ma, Qiang / Tang, Liang / Chen, Tao et al. | 2016
- 128
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Flexible ultrathin micro-supercapacitors based on laser-reduced graphene with superior electrochemical performance and aesthetic propertyLai, Wenhui / Xie, Binghe / Wang, Yang / Yang, Cheng / Wang, Ronghe et al. | 2016
- 133
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A high-performance flexible pseudo-supercapacitor constructed on conductive clothXu, Yang / Wang, Teng / Yang, Cheng / Wang, Ronghe et al. | 2016
- 138
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Numerical simulation and experiment study on the resistance loss of glue pipeline transportationChen, Wang / Deng, Guiling / Zhou, Can / Yuan, Zungang et al. | 2016
- 142
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Influence of nano-particles on creep behaviors of Cu/Sn-0.3Ag-0.7Cu-xPOSS/Cu composite solder jointsHu, Yangduanrui / Ma, Limin / Guo, Fu et al. | 2016
- 147
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Thin and large die assembly pick up process optimization by dynamic modelingQian, Richard / Liu, Yong et al. | 2016
- 153
-
Low-dielectric-constant novel periodic mesoporous organosilica thin film for interlayer dielectricZhang, Jiawei / Zhang, Guoping / Sun, Rong / Lee, S. W. Ricky / Wong, C. P. et al. | 2016
- 157
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High mechanical strength and high dielectric graphene/polyuthane composites healded by near infrared laserWu, Shuwen / Li, Jinhui / Zhang, Guoping / Sun, Rong / Wong, Chingping et al. | 2016
- 162
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Numerical model with competitively adsorptive mechanism for copper electrodeposition of TSVShen, Jie / Luo, Wei / Dong, Wenhao / Li, Ming / Gao, Liming et al. | 2016
- 166
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Modelling the melting of Sn0.7Cu solder using the enthalpy methodKunwar, Anil / Givernaud, Julien / Ma, Haoran / Meng, Zhixian / Shang, Shengyan / Wang, Yunpeng / Ma, Haitao et al. | 2016
- 170
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Effect of universal interconnect's geometrical parameters on metal-elastomer interface strengthQin, Qing / Pan, Kailin / Yang, Fan / Cao, Weiwu / Li, Tingting / Wang, Wenjia / Han, Xufeng et al. | 2016
- 175
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Localized electrochemical deposition of micrometer copper columns as affected by adding sulfuric acidLi, Yijie / Li, Jianping / Wang, Fuliang et al. | 2016
- 180
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Thermal analysis and optimization of IGBT power electronic module based on layout modelTang, Hongyu / Ye, Huaiyu / Wang, Mingming / Fan, Xuejun / Zhang, Guoqi et al. | 2016
- 186
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Enhanced thermal conductivity and mechanical properties of epoxy resin-alumina-silicon carbide fibers three-phase compositesZeng, Xiaoliang / Guo, Kun / Yu, Shuhui / Sun, Rong / Xu, Jian-bin et al. | 2016
- 191
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Open circuit caused by inner-layer separation in printed circuit boardHuang, Xingjia / Ou, Changping / Huang, Xuanyu / Su, Bing / Zhou, Weili et al. | 2016
- 195
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High performance silver nanowire based transparent electrodes reinforced by EVA resin adhesiveLi, Ziheng / Yang, Cheng / Wang, Ronghe et al. | 2016
- 200
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Water-dispersible graphene paste for flexible conductive patterns and filmsHu, Yougen / Zhao, Tao / Zhu, Pengli / Liang, Xianwen / Zhu, Yu / Su, Haibo / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 206
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Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materialsLiu, Xiaojian / Wang, Chunqing / Zheng, Zhen / Liu, Wei et al. | 2016
- 209
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Reliability analysis of conductive adhesive joints on aluminumChen, Jie / Wen, Yulan et al. | 2016
- 213
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Underfill technology for fine pitch flip chip applicationsZhu, Pengli / Li, Gang / Guo, Qian / Zhao, Tao / Lu, Daoqiang Daniel / Sun, Rong / Wong, Chingping et al. | 2016
- 218
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Preparation water dispersible reduced graphene oxide as ink materials for the flexible and wearable energy storage devicesSu, Haibo / Zhu, Pengli / Zhou, Fengrui / Han, Yankang / Shuai, Xingtian / Hu, Yougen / Li, Tingxi / Sun, Rong / Wong, Chingping et al. | 2016
- 222
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Modeling and control of the temperature field in jet dispensing valveLi, Weisong / Shan, Xiuyang / Zhang, Haining et al. | 2016
- 227
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A compact QCW conduction-cooled high power semiconductor laser arrayZhu, Qiwen / Zhang, Pu / Wang, Shuna / Wu, Dihai / Nie, Zhiqiang / Xiong, Lingling / Song, Yunfei / Liu, Xingsheng et al. | 2016
- 234
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Electromigration simulation of Cu pillar interconnect microstructure of 3D packagingLeng, Zhiyuan / Xiao, Ming / He, Man / Xia, Weisheng / Wang, Bo et al. | 2016
- 240
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Comparing the copper and gold wire bonding during thermalsonic wire bonding processPan, Yongjun / Zhu, Fulong / Lin, Xinxin / Tao, Jiaquan / He, Liping / Wang, Han / Liu, Sheng et al. | 2016
- 244
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Preparation and properties of silicone -cycloaliphatic epoxy resins for LED packagingZong, Yangyang / Gui, Dayong / Yu, Si / Liu, Canqun / Chen, Wei / Qi, Zhongnan et al. | 2016
- 249
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Preparation of nickel oxide/graphene aerogel composites and its electrochemical performance for supercapacitorChen, Wei / Gui, Dayong / Yu, Si / Liu, Chanqun / Zhao, Liqing / Liu, Jianhong et al. | 2016
- 253
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Light decomposition characteristics of UV-irradiated polycarbonateYu, Si / Qian, Cheng / Gui, Dayong / Chen, Wei / Zong, Yangyang / Liu, Canqun et al. | 2016
- 257
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Simulation and design of a hot-film air flow sensor with sapphire as substrateXu, Chunlin / Zhan, Shannan / Chu, Jingcao / Wang, Xuefang / Liu, Sheng et al. | 2016
- 261
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Inkjet-printed Ag tracks sintered at room-temperature on flexible substrateZhang, Zhihao / Jin, Xin / Cao, Huijun et al. | 2016
- 264
-
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradientZhao, Ning / Zhong, Yi / Huang, Mingliang / Ma, Haitao / Dong, Wei et al. | 2016
- 268
-
Electromigration behavior of Sn3.0Ag0.5Cu/Sn58Bi structural composite solder interconnectWang, Fengjiang / Zhou, Lili / Wang, Xiaojing et al. | 2016
- 273
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Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigrationZhao, Ning / Deng, Jianfeng / Zhong, Yi / Huang, Mingliang / Ma, Haitao et al. | 2016
- 277
-
Effect of silver nanoparticles decoration on the thermal conductivity of boron nitride nanosheets/silicon carbide nanowires bioinspired composite paperYao, Yimin / Zeng, Xiaoliang / Sun, Rong / Xu, Jian-bin / Wong, Ching-ping et al. | 2016
- 283
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Influence of microstructure inhomogeneity on the electromigration behavior of flip chip solder jointsWang, Sansan / Wang, Ying / Zhang, Ping / Guo, Lei / Qin, Hongbo / Jiang, Hongjie / Yan, Hong et al. | 2016
- 289
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A highly sensitive flexible capacitive pressure sensor with micro-array dielectric layerShuai, Xingtian / Zhu, Pengli / Liang, Xianwen / Hu, Yougen / Zhang, Yu / Guo, Qian / Su, Haibo / Sun, Rong / Wong, Chingping et al. | 2016
- 295
-
Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature applicationJi, Hongjun / Li, Minggang / Li, Mingyu et al. | 2016
- 301
-
Effects of bath temperature on co-electroplating Au-Sn alloys for electronic packagingTang, Fangwu / Huang, Mingliang / Huang, Feifei et al. | 2016
- 304
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Effects of nano-structured reinforcements on the recrystallizationand damage mode of of Sn-3.0Ag-0.5Cu solder jointsGu, Penghao / Han, Jing / Guo, Fu et al. | 2016
- 310
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Effect of reduction temperatures on the thermal and electrical conductivities of reduced graphene oxide films on the Cu foilsLiu, Shao-Qing / Zhang, Kai / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 313
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Enhancement of thermal conductivity of phase change materials by 3D graphene @ Al2O3 foamsJi, Yaqiang / Wen, Haoran / Zhang, Kai / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 318
-
Electroplating fabrication and characterization of Sn-Ag-Cu eutectic solder filmsXie, Jin-Qi / Zhong, Zhe / Zhang, Kai / Yuen, Matthew M.F. / Lee, S.W. Ricky / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 322
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Growth pattern and morphology of micro nickel column by localized electrochemical depositionSun, Jiadong / Liu, Defu / Wang, Fuliang / Chen, Tao et al. | 2016
- 327
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The study of the growth behavior of Cu6Sn5 at the Sn/Cu interface during the heating preservation stageJiang, Chengrong / Guo, Bingfeng / Ma, Haoran / Kunwar, Anil / Meng, Zhixian / Ma, Haitao et al. | 2016
- 331
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Low melting alloy composites as thermal interface materials with low thermal resistanceWen, Haoran / Ji, Yaqiang / Zhang, Kai / Yuen, Matthew M.F. / Lee, S.W. Ricky / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 334
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Analysis of photoluminescence mechanisms and thermal quenching effects for multicolor phosphor films used in high color rendering white LEDsZhang, Mengni / Fan, Jiajie / Qian, Cheng / Fan, Xuejun / Ji, Aimin / Zhang, Guoqi et al. | 2016
- 341
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Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuitsZhong, Zhe / Xie, Jinqi / Zhang, Kai / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 344
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Conductive anodic filament reliability and failure analysis for halogen-free packaging substrateHu, Chaohui / Zhou, Lina et al. | 2016
- 348
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Influence of electric current on the grain orientation of Cu-Sn intermetallic compounds in Cu/molten Sn/Cu interconnection systemFeng, Jiayun / Liu, Baolei / Tian, Yanhong / Zhang, Baoyou et al. | 2016
- 352
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Inherent growth habit of Cu6Sn5 phase at the liquid Sn0.7wt%Cu solder/ (111)Cu joint interfaceCao, Huijun / Zhang, Zhihao et al. | 2016
- 356
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Fast analysis and implementation of microelectronic packaging MSL with equal moisture distribution methodDing, Qiulin / Ma, Xiaosong / Liu, Zhixue / Zhang, G.Q. et al. | 2016
- 361
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Oxidation resistant core-shell Cu@SiO2 nanowires for composites with high dielectric performanceShen, Yanbin / Luo, Suibin / Yu, Shuhui / Sun, Rong / Wong, C. P. et al. | 2016
- 365
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Fabrication of microlens array encapsulation layer based on porous film by breath figure method for chip-on-board light-emitting diodesZhang, Zefeng / Guo, Xing / Lei, Xiang / Wu, Jiading / Xu, Chunlin / Liu, Sheng / Zheng, Huai et al. | 2016
- 370
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Effects of temperature and humidity on the formation of solder bead and microstructure in Sn-58Bi Solder jointYang, Yang / Zhao, Xuewei / Ma, Limin / Zhang, Fuwen / Hu, Qiang / Guo, Fu et al. | 2016
- 375
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Analysis of lead-free solder paste based on performance degradationLi, Cui / Lei, Yongping / Lin, Jian / Tian, Ye et al. | 2016
- 380
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Study on TSV-Cu protrusion under different annealing conditions and optimizationDeng, Qi / Huang, Lingang / Shang, Jing / Li, Ming et al. | 2016
- 384
-
One failure analysis of voltage stabilizing circuitLuo, Chuan / Hu, Yongda / Bao, Shengxiang / Cui, Yongqiang et al. | 2016
- 387
-
Thermal analysis and design of SG-DBR laser arrayHan, Ximeng / Gao, Jinwei / Yu, Yonglin / Cheng, Qiang et al. | 2016
- 391
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Fast MSL analysis of microelectronic packages by using equal weight increasing methodLiu, Zhixue / Ma, Xiaosong / Ding, Qiulin / Zhang, G.Q. et al. | 2016
- 395
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In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stageGuo, Bingfeng / Jiang, Chengrong / Kunwar, Anil / Zhao, Ning / Ma, Haitao et al. | 2016
- 400
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Heat transfer without phase change of gas-water two-phase flow in microgapZhang, Jinsong / Liu, Chao / Xu, Ge et al. | 2016
- 406
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PoP assembly reliability test and assessment under random vibration loadingXia, Jiang / Li, GuoYuan / Zhou, Bin / Cheng, LanXian et al. | 2016
- 411
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Development and application of polymer-based nanocomposites dielectricsLuo, Suibin / Yang, Wenhu / Yu, Shuhui / Sun, Rong / Zhang, Guoping / Wong, C. P. et al. | 2016
- 417
-
Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulationLin, Xinxin / Zhu, Fulong / He, Liping / Pan, Yongjun / Tao, Jiaquan / Duan, Ke et al. | 2016
- 421
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The nonlinear voltage-current characteristics of three-phase SiC/CNTs/epoxy compositeJian, Wang / Shen, Yanbin / Luo, Suibin / Yang, Wenhu / Yu, Shuhui / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 425
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The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperaturesMa, Haoran / Kunwar, Anil / Meng, Zhixian / Guo, Bingfeng / Zhao, Ning / Ma, Haitao et al. | 2016
- 429
-
Impack of crosstalk on signal integrity of high density ceramic package for ICZhang, Xiao-jun / Jiang, Wei / Gao, Ling / Li, Hang-zhou et al. | 2016
- 434
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Preparation of highly conductive adhesives by insitu incorporation of silver nanoparticlesHan, Yankang / Zhang, Baotan / Zhu, Pengli / Liu, Qianqian / Hu, Yougen / Sun, Rong / Wong, Chingping et al. | 2016
- 439
-
Fabricating photosensitive polymer insulation layer by spin-coating for through silicon viasLiu, Qiang / Zhang, Guoping / Sun, Rong / Lee, S. W. Ricky / Wong, C. P. et al. | 2016
- 443
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Study of Package-on-Package solder joints under random vibration load based on PatranZhang, Long / Huang, Chun-yue / Huang, Wei / Li, Tian-ming / Hua, Jianwei et al. | 2016
- 448
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Synchronous laser scanning IR imaging for chip bonding defect inspectionChen, Li / Jiang, Haijun et al. | 2016
- 451
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Theoretical study of thermomigration effect on the pancake void propagation at the current crowding zone of solder jointsWang, Yuexing / Long, Xu / Yao, Yao et al. | 2016
- 455
-
Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration conditionHua, Jianwei / Huang, Chunyue / Liang, Ying / Li, Tian-ming / Zhang, Long et al. | 2016
- 461
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Thermal evaluation of partially molded 2.5D package with pin fin heat sink coolingZhang, H.Y. / Wang, Z.Q. / Lin, T. Y. et al. | 2016
- 468
-
A microwave-assisted solvothermal process to synthesize Al-doped ZnO powders and its optical and electrical propertiesLiu, Qianqian / Zhu, Pengli / Li, Gang / Guo, Qian / Shuai, Xingtian / Sun, Rong / Wong, Chingping et al. | 2016
- 473
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Effect of electromigration on interfacial reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnectsZhou, Q. / Li, Q. / Zhou, Y. / Wang, X.J. / Huang, M.L. et al. | 2016
- 477
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Thermal and flow characteristics of device integrated metallic foam heat sinks with central impingement flowZhang, H.Y. / Li, C. / Fan, P.Q. et al. | 2016
- 482
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Bonding wire fatigue life prediction of power module in thermal cycling testGuo, Yuanqi / Xu, Yangjian / Liang, Lihua / Liu, Yong et al. | 2016
- 486
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Advanced flip chip package on package technology for mobile applicationsHsieh, Ming-Che et al. | 2016
- 492
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Enhanced dielectric property and energy density of polydopamine encapsuled BaTiO3 nanofibers/PVDF nanocompositesLiu, Hongchang / Luo, Suibin / Yu, Shuhui / Ding, Shanjun / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 499
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Thermal behavior of microchannel cooled high power diode laser arraysWu, Dihai / Zhang, Pu / Nie, Zhiqiang / Xiong, Lingling / Song, Yunfei / Zhu, Qiwen / Lu, Yao / Dang, Yifan / Liu, Xingsheng et al. | 2016
- 506
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Solution-casting dielectric composite toward high energy storage density utilizing molybdenum disulfide sheetsDing, Shanjun / Yu, Shuhui / Shen, Yanbin / Liu, Hongchang / Sun, Rong / Wong, Ching-Ping et al. | 2016
- 510
-
A method for measuring thermal conductivity of paste materialsFeng, Wilson / Zhao, Fanny / Shieh, Brian / Lee, S. W. Ricky et al. | 2016
- 514
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Investigation on the effect of multiple parameters towards thermal management in 3D Stacked ICsXiao, Chengdi / He, Hu / Li, Junhui / Wang, Yan / Zhu, Wenhui et al. | 2016
- 520
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Molecular modeling of the mechanical properties and electrical conductivity of modified carbon nanotube with hydroxyl under the tensile behaviorYang, Ning / Chen, Xianping / Liu, Dongjing / He, Haisheng / Yang, Daoguo / Zhang, Guoqi et al. | 2016
- 524
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Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder ballsQiu, Yan / Huang, Mingliang / Wu, Aimin et al. | 2016
- 528
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Preparation of lead-free low-melting glass and its slurry for vacuum glass packagingZhang, Ping / Li, Hong / Xu, Xujia / Zhuo, Yong / Liu, Zirui et al. | 2016
- 534
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Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substratesChen, Y. / Huang, M.L. / Zhao, N. et al. | 2016
- 538
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Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applicationsHuang, Feifei / Liu, Yawei / Huang, Mingliang et al. | 2016
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Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnectsFan, M. / Huang, M.L. / Zhao, N. et al. | 2016
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Copper-based multimetal-contact RF MEMS switchJiang, Zhaoqun / Gong, Zhuhao / Liu, Zewen et al. | 2016
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Compact size and low profile IPD diplexer design applied on wireless module of mobile phoneHsieh, Sheng-Chi / Kung, Cheng-Yuan / Lee, Teck Chong / Chen, Chi-Han / Wang, Chen-Chao / Chou, Yuan-Hsi et al. | 2016
- 555
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Parametric study of DRIE process for enhancing the profile-preserving property of square through silicon viaGuan, Yong / Zeng, Qinghua / Chen, Jing / Meng, Wei / Jin, Yufeng / Ma, Shenglin et al. | 2016
- 558
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Warpage simulation for multilayered MIS substrate by application of image recognition methodHe, Xi / Tan, Lin / Zhang, Lidong / Chen, Lingzhi / Chen, Chuan / Cai, Jian et al. | 2016
- 563
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A new low-cost approach to fabricate silicon dioxide for insulator of through-silicon-viaZheng, Shuai / Zhang, Junhong / Gao, Lanya / Zhang, Shanshan / Li, Ming et al. | 2016
- 567
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Effect of heat treatment on the adhesion characteristics of flexible copper clad laminate with ion injectionZang, Yanli / Wang, Jie / An, Bing / Wu, Yiping / Lv, Weiwen / Liu, Hui et al. | 2016
- 571
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3D integrated eWLB /FO-WLP technology for PoP & SiPLin, Yaojian / Kang, Chen / Chua, Linda / Choi, Won Kyung / Yoon, Seung Wook et al. | 2016
- 576
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A comparative study of properties and microstructures on thermal fatigue testing of a high-power LEDChen, Jibing / Wan, Nong / Li, Juying / He, Zhanwen / Wu, Yiping et al. | 2016
- 580
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Analysis of the influence of different parameters on dippingZhang, Xiaorui / Chen, Xinxin / Li, Fei / Tian, Wenya / Li, Junhui / Zhu, Wenhui et al. | 2016
- 584
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Application of failure analysis process flow in multifunctional SiPGuo, Han / Mao, Genyang / Zhong, Jianhua / Chen, Yu / Wang, Qian et al. | 2016
- 588
-
Design of the printed circuit board for board level drop impact base on the JEDEC standardGu, Jian / Lei, Yongping / Lin, Jian / Fu, Hanguang / Wu, Zhongwei et al. | 2016
- 592
-
Thermal modeling and analysis on a novel no-substrate LEDCOB moduleNie, Yaoyao / Yang, D.G. / Cai, Miao / Liu, Dongjing / Mo, Yuezhu et al. | 2016
- 597
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Thermal characterization of a novel 3D stacked package structure by CFD simulationChen, Cheng / Qiu, Delong / Hou, Fengze / Liu, Fengman / Su, Meiying / Wang, Qidong / Cao, Liqiang / Wan, Lixi et al. | 2016
- 603
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Fabrication and filling quality optimization of the high density and small size through silicon via array for three-dimensional packagingGuan, Yong / Zeng, Qinghua / Chen, Jing / Meng, Wei / Jin, Yufeng / Ma, Shenglin et al. | 2016
- 608
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Positive feedback on imposed thermal gradient by interfacial bubbles in Cu/liquid Sn-3.5Ag/Cu jointsKunwar, Anil / Ma, Haoran / Qi, Meng / Sun, Junhao / Qu, Lin / Guo, Bingfeng / Zhao, Ning / Wang, Yunpeng / Ma, Haitao et al. | 2016
- 612
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Investigation on graphene/Ag nano-particles composite ink for flexible electronicsZhu, Haixin / Nie, Nantian / Wang, Fuliang et al. | 2016
- 616
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Random vibration simulation and structural optimization for DC/DC converter modules assemblyTao, Lu / Hui, Xiao / Junhua, Zhu / Hongqin, Wang et al. | 2016
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A dynamic shear experiment based on Hopkinson pressure barXiaoyan, Niu / Yingjie, Yu / Lianhua, Ma / Cong, Chen et al. | 2016
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Thermal management of downhole electronics cooling in oil & gas well logging at high temperatureMa, Yupu / Shang, Bofeng / Hu, Run / Luo, Xiaobing et al. | 2016
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A remote phosphor coating by lens wetting for phosphor-converted white light-emitting diodesYu, Xingjian / Liu, Falong / Ma, Yupu / Huang, Mengyu / Luo, Xiaobing et al. | 2016
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Simulation of droplet spreading process on heterogeneous striped surface by lattice Boltzmann methodHuang, Mengyu / Yuan, Chao / Yu, Xingjian / Wu, Ruikang / Luo, Xiaobing et al. | 2016
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Electronic properties and work functions of silicane/fully hydrogenated h-BN and silicane/graphane nanosheetsLiang, Qiuhua / Jiang, Junke / Sun, Xiang / Chen, Xianping et al. | 2016
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Study on the thermal conductivity of graphene/Si interface structure based on molecular dynamicsLiu, Dongjing / Yang, D.G. / Yang, Ning / Yang, Ping et al. | 2016
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Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysisMo, Yuezhu / Yang, D.G. / Cai, Miao / Liu, Dongjing / Nie, Yaoyao et al. | 2016
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Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPCChen, Jibing / Wan, Nong / Li, Juying / He, Zhanwen / Wu, Yiping et al. | 2016
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The numerical investigation of influence for shape-parameters to the current carrying capacity of solder joints in the CuCGAZhao, Zhili / Liu, Yingjie / Jia, Keming / Wang, Guanglin / Ge, Qi et al. | 2016
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Folding differential capacitive accelerometer made of LTCCMingjie, Qin / Jin, Yufeng / Miao, Min / Tang, Xiaoping / Lu, Huixiang / Yan, Yingzhan et al. | 2016
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The influence of aspect ratio of copper column on warpage of CuCGA structureZhao, Zhili / Dang, Guangyue / Jia, Keming / Liu, Haitao / Wang, Guanglin et al. | 2016
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Simulation study on creep behavior of BGA solder joints under temperature cyclingLi, Xin / Wang, Lifeng / Liu, Haitao et al. | 2016
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Step nano-mechanical behavior of SnAgCu solder joints under nano-indentation methodWang, Lifeng / Liu, Haitao / Dai, Wenqin / Zhang, Pule et al. | 2016
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The effect of rare earth elements on the shear behavior of BGA solder joints under board-levelJia, Keming / Wang, Lifeng / Liu, Yingjie / Dang, Guangyue / Liu, Haitao et al. | 2016
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Effect of resin content on PCB warpage and anti-shock performance of BGA solder jointLili, Ma / Hang, Chen et al. | 2016
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Interface adhesion study of Cu interconnection and low-k organic materialsShang, Jing / Hao, Jianxia / Deng, Qi / Hang, Tao / Li, Ming et al. | 2016
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A full chip scale numerical simulation method for thermal management of 3D ICWang, Ningyu / Jin, Yufeng / Pi, Yudan / Wang, Wei et al. | 2016
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Failure mechanism study of power packages during MSL and temperature cycling test with finite element analysisYang, Yongbo / Ge, Dandong / Shen, Wenjie et al. | 2016
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Impact of test stress (Tcmin) on intermittent operating lifeChen, Yuan / Hou, Bo et al. | 2016
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Investigation on rheological characterization of solder pasteHe, Xinyue / Wang, Yanqing / Zhou, Jian / Xue, Feng et al. | 2016
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Investigation of jet printing performance of lead-free solder pasteLi, Saipeng / Wang, Yanqing / Zhou, Jian / Xue, Feng et al. | 2016
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Investigation on the defect induced thermal mechanical stress for TSVLi, Fei / Xiao, Chengdi / He, Hu / Li, Junhui / Zhu, Wenhui et al. | 2016
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The preparation and characterization of high refractive index and heat-resistant silicone nanocompositesLiu, Canqun / Gui, Dayong / Yu, Si / Chen, Wei / Zong, Yangyang et al. | 2016
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Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressorYuwen, Hui-Hui / Zhang, Xin-Ping et al. | 2016
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Study on short-circuit failure of solder-joint interconnectionsZhonghua, Wan / Hui, Xiao et al. | 2016
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Graphane/fully hydrogenated h-BN bilayer: Marvellous dihydrogen bonding and effective band structure engineeringJiang, Junke / Liang, Qiuhua / Sun, Xiang / Chen, Xianping et al. | 2016
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Investigation of a suitable material for automotive grade 0 requirement mitigating lead delaminationDescartin, Allen M. / Lidong, Zhang / Jun, Li et al. | 2016
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A first-principle study of H2, CO, CH4, H2S and SO2 gas molecules on antimoneneMeng, Ruishen / Huang, Yiping / Yang, Qun / Chen, Xianping et al. | 2016
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Thermal resistance investigation of ceramic substrates for high-power light-emitting diodes packagingChen, Zhen / Cheng, Hao / Peng, Yang / Chen, Mingxiang / Li, Ruixin et al. | 2016
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Adsorption of CO2 and CO gas on impurity-decorated phosphorenes: A first-principles studyYang, Qun / Huang, Yiping / Meng, Ruisheng / Chen, Xianping et al. | 2016
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Effects of thermal aging and electromigration on tensile strength of SnAgCu solder joints with different volumeWang, Gang / Yin, Li-Meng / Yao, Zong-Xiang / Wang, Jin-Zhao et al. | 2016
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Tuning electronic properties of bilayer boron-phosphide by stacking order and electric field: A first principles investigationTan, Chunjian / Zhou, Qiang / Chen, Xianping et al. | 2016
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The study of adsorption behavior of small molecules on stanene: A search of superior gas sensorsZhou, Qiang / Huang, Yiping / Tan, Chunjian / Chen, Xianping et al. | 2016
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First-principles study of gas adsorptin on indium nitride monolayer as gas sensor applicationsSun, Xiang / Huang, Yiping / Jiang, Junke / Liang, Qiuhua / Meng, Ruishen / Tan, Chunjian / Yang, Qun / Chen, Xanping et al. | 2016
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Research on the design of mechanical shock test fixture of ceramic package for packaging CCDYang, Zhen-tao / Peng, Bo / Gao, Ling et al. | 2016
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Microstructure of solar cell interconnections by resistance weldingJi, Xiaoliang / An, Rong / Wang, Chunqing / Tian, Yanhong et al. | 2016
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Modeling and simulation of InAs/GaSb type-II superlattices with different interface layersZhou, Kuan / Yi, Dandan / Li, Ming / Zhao, Liancheng / Gao, Liming et al. | 2016
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The study of Cu-Cu low temperature bonding using formic acid treatment with/without Pt catalystYang, Wenhua / Lu, Yangting / Tadatomo, Suga et al. | 2016
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The Synthesis of Cu-Ag core-shell bimetallic nanoparticles for IC bondingWen, Jiayue / Tian, Yanhong et al. | 2016
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Analysis of decline of silicon-aluminum alloy cavity air tightnessCui, Yongqiang / Hu, Yongda / Bao, Shengxiang / Jiang, Wei / Luo, Chuan / Song, Lijie / Li, Qiang et al. | 2016
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Theoretical investigation of electric properties of the silicene / fully hydrogenated BN heterobilayerWang, Liming / Sun, Xiang / Meng, Ruishen / Tan, Chunjian / Yang, Qun / Chen, Xianping et al. | 2016
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Simulation based selection of the molding compound for power packaging based on the case study of D2PAKDoddaballapura, Karthik / Hong, Yan / Jakub, Gromala Przemyslaw et al. | 2016
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Enhancement of H2S detection in impurity-doped graphenePang, Jiu / Ma, Xiaosong / Yang, Qun / Meng, Ruishen / Tan, Chunjian / Sun, Xiang / Chen, Xianping et al. | 2016
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Flip chip CSP assembly with Cu pillar bump and molded underfillSun, Peng / Xu, Chen / Liu, Jun / Geng, Fei / Cao, Liqiang et al. | 2016
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A simplification method of solder joints for thermal analysis in 3D packagesTian, Wenchao / Cui, Hao et al. | 2016
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Fabrication of micro-lens array by means of ion wind for chip-on Board (COB)Chu, Jingcao / Lei, Xiang / Wu, Jiading / Xu, Chunlin / Chen, Tianwen / Zheng, Huai / Liu, Sheng et al. | 2016
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A simplification method of TSV interposer for thermal analysis in 3D packagesTian, Wenchao / Cui, Hao et al. | 2016
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Effect of reverse leakage current on the reliability of InGaN/GaN high power LEDsZheng, Chenju / Lv, Jiajiang / Zhou, Shengjun / Liu, Sheng et al. | 2016
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Reverse pulse current (RPC) electrodeposition of anti-corrosive nickel-tungsten ultrathin film for connector applicationWang, Yuequan / Hang, Tao / Li, Ming et al. | 2016
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Study on bumps deformation of flip chip bonding processLezhi, Ye / Zhiyue, Wang / Jiapeng, Wang / Qizhou, Zhou et al. | 2016
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Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnectsLiang, Shui-Bao / Ke, Chang-Bo / Tan, Meng-Ying / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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An Arrhenius-type constitutive model to predict the deformation behavior in lead-free soldersXiaoyan, Niu / Yingjie, Yu / Lianhua, Ma / Cong, Chen et al. | 2016
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Effect of as-pinted bondline thickness on assembling high power laser diodes by sintering of nanosilver pasteYan, Haidong / Mei, Yunhui / Li, Xin / Li, Hailong / Lu, Guo-Quan et al. | 2016
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Study of interconnection between Ni nano-array and nano-Ag solderZheng, Zhen / Yang, Fan / Wang, Chunqing et al. | 2016
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The effects of Cu nanoparticles addition in Sn-3.0Ag-0.5Cu solder paste on the microstructure and shear strength of the solder jointsLiu, Ping / Gu, Xiaolong / Fu, Haifeng / Liu, Yang et al. | 2016
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A Study on microstructure of tin-lead solder joints under thermal cyclingLi, Qi-hai / Chen, Wei-wei / Li, Weiming et al. | 2016
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Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder jointsLi, Wang-Yun / Cao, Shan-Shan / Zhang, Xin-Ping et al. | 2016
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Scalable synthesis and application of mono-dispersed hierarchical silver micro-particlesYang, Rui / Yang, Cheng / Deng, Yubin / Luo, Yingying / Wu, Dang / Wang, Yang / Cui, Xiaoya / Wang, Ronghe et al. | 2016
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A novel wafer level high Q planar inductor using Ni-Zn ferrite/BCB composite thick filmZheng, Tao / Xu, Gaowei / Luo, Le et al. | 2016
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Effects of long-term high temperature services on surface micro-structures and components of Sm2Co17 magnets with Ni-coatingAi, Libo / Bao, Shengxiang / Hu, Yongda / Li, Qiang / Song, Lijie / Wang, Xueke / Cui, Yongqiang / Luo, Chuan / Jiang, Wei et al. | 2016
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Experimental study of measuring LED's temperatures via thermocoupleChen, Qi / Hu, Run / Hu, Jinyan / Xie, Bin / Yu, Xingjian / Luo, Xiaobing et al. | 2016
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Combined surface activation bonding for Cu/SiO2 hybrid bonding for 3D integrationHe, Ran / Fujino, Masahisa / Suga, Tadatomo / Yamauchi, Akira et al. | 2016
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The effects of graphene-based films as heat spreaders for thermal management in electronic packagingHuang, Shirong / Bao, Jie / Ye, Hui / Wang, Ning / Yuan, Guangjie / Ke, Wei / Zhang, Dongsheng / Yue, Wang / Fu, Yifeng / Ye, Lilei et al. | 2016
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A novel surface humidity controlled bonder for low-temperature wafer bondingWang, Chenxi / Xu, Jikai / Liu, Yannan / Tian, Yanhong / Wang, Chunqing / Suga, Tadatomo et al. | 2016
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A design of a multi-sensor platform by System-Level integration in the packageLi, Cheng / Guo, Han / Zhang, Xuesong / Wang, Qian / Cai, Jian et al. | 2016
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Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow processChen, Hailiang / Jing, Xiangmeng / Shang, Jintang et al. | 2016
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Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting componentsZhang, Lang / Zhou, Min-Bo / Qiu, Fu-Shun / Ma, Xiao / Zhang, Xin-Ping et al. | 2016
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Magnetic and dielectric properties of Li0.63Zn0.37Fe2O4−xCaTiO3 composites for LTCC applicationGao, Yixing / Li, Jie / Li, Qiang / Ma, Guokun / Yu, Ximeng / Zhang, Huaiwu et al. | 2016
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The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stressLee, Jeffrey ChangBing / Chen, Cheng-Chih / Lee, Dem / Lin, Alice et al. | 2016
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Integrated manufacturing of microphone-array node for wireless sensor network (WSN)Xu, Gaowei / Gai, Wei / Zheng, Tao / Liang, Defeng / Luo, Le / Chen, Juying et al. | 2016
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Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acidsZhu, Jie-Fei / Jin, Hong / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste jointsJin, Hong / Zhu, Jie-Fei / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Novel underfill material with low coefficient of thermal expansioneZhang, Baotan / Zhu, Pengli / Li, Gang / Sun, Rong / Wong, Chingping et al. | 2016
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Influence of Li-doping on phase structure and magneto-dielectric behaviors in BiFeO3Li, Qiang / Bao, Shengxiang / Liu, Yingli / Hu, Yongda / Jing, Yulan / Li, Jie / Ai, Libo / Wang, Xueke et al. | 2016
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Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modelingHuiping, Yu / Mingqing, Hu / Fei, Qin / Tong, An / Pei, Chen / Bensong, Pi et al. | 2016
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Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structureJiang, Han / Liang, Shui-Bao / Yuwen, Hui-Hui / Zhang, Xin-Ping et al. | 2016
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Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradientLiang, Shui-Bao / Ke, Chang-Bo / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting componentsChen, Guo-Liang / Zhou, Min-Bo / Zhang, Lang / Lin, Yuan-Jiang / Zhang, Yu-Peng / Zhang, Xin-Ping et al. | 2016
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Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnectsMa, Wen-Jing / Ke, Chang-Bo / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal agingHuang, Jia-Qiang / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering processTan, Meng-Ying / Zhou, Min-Bo / Huang, Jia-Qiang / Ma, Fa-Qian / Ma, Xiao / Zhang, Xin-Ping et al. | 2016
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10µm pitch Cu-Cu bonding interconnection for wafer level 3D integrationSong, Chongshen / Li, Hengfu / Feng, Guangjian / Cao, Liqiang / Zhang, Wenqi et al. | 2016
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Process development of a new TGV interposer for wafer level package of inertial MEMS deviceMa, Shenglin / Ren, Kuili / Xia, Yanming / Yan, Jun / Luo, Rongfeng / Cai, Han / Jin, Yufeng / Ma, Mingjun / Jin, Zhonghe / Chen, Jing et al. | 2016
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Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loadsLi, Wang-Yun / Cao, Shan-Shan / Zhang, Xin-Ping et al. | 2016
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Embedded package inductor for high speed SerDes designWu, Boping / Mo, Tingting et al. | 2016
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The study on optical interconnection and assembly technology based on long-rang surface plasmon polaritons gratingWei, Qi-qin / Xiao, Jing / Yang, Dao-Guo et al. | 2016
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Enhanced thermal conductivity of QDs-polymer film for light-emitting diodes via electrospinningLei, Xiang / Zheng, Huai / Guo, Xing / Zhang, Zefeng / Wu, Jiading / Xu, Chunlin / Liu, Sheng et al. | 2016
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Application of Nano Silver sintering technique on the chip bonding for flip-chip and vertical light emitting diodesTao, Mian / Mei, Yun-Hui / Lee, S. W. Ricky / Yun, Feng / Lu, Guo-Quan et al. | 2016
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Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packagingHuang, Jia-Qiang / Zhou, Min-Bo / Li, Wang-Yun / Zhang, Xin-Ping et al. | 2016
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Single crystal copper nanocrystallization and sintered with silver nanoparticlesZhou, Wei / Zheng, Zhen / Wang, Chunqing et al. | 2016
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The study of LED packaging pollution failureChen, Lan / Xu, Huanxiang / Liu, Zilian / Cai, Yingying et al. | 2016
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Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallizationZhou, Min-Bo / Feng, Jian-Qiang / Yue, Wu / Zhang, Xin-Ping et al. | 2016
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Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structuresLin, Yuan-Jiang / Zhou, Min-Bo / Ma, Xiao / Zhang, Xin-Ping et al. | 2016
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Design and characterization of petaloid hollow Cu interconnection for interposerXia, Yanming / Ren, Kuili / Ma, Shenglin / Guan, Yong / Cai, Han / Luo, Rongfeng / Yan, Jun / Chen, Jing / Jin, Yufeng et al. | 2016
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Research and analysis on ecological evaluation technology of air conditionerPeng, Li / Ni, Yilin / Li, Ziqi et al. | 2016
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Fabrication process of a TSV interposer for radio frequency chip with integrated passive devicesMeng, Wei / Jin, Yufeng / Guan, Yong / Zeng, Qinghua / Chen, Jing et al. | 2016
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Research on the interfacial reaction and mechanism of Cu/Sn/Ni copper pillar bumpRao, Li / Hu, Fengtian / Xu, Penghui / Hu, Anmin / Gao, Liming / Li, Ming / Zhao, Wen et al. | 2016
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Study on conformal phosphor coating for phosphor converted white LEDs through ionic wind patterningWu, Jiading / Chu, Jingcao / Zhang, Zefeng / Xianglei, / Xu, Chunlin / Zheng, Huai / Huang, Jiahui / Liu, Sheng et al. | 2016
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Research of vacuum soldering on 10# steel and thick film ceramic substratesWang, Ningning / He, Zongpeng / Zhang, Binbin / An, Rong et al. | 2016
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Reliability prediction for IGBT solder joints using Clech AlgorithmLu, Hua / Bailey, Chris et al. | 2016
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Effects of post-CMP annealing on TSV Cu protrusion and leakage currentJin, Hai / Cai, Jian / Wang, Qian / Hu, Yang / Liu, ZiYu et al. | 2016
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Improved thermal design of fin heat sink for high-power LED lamp coolingHuang, Yicang / Shen, Shengnan / Li, Hui / Gu, Yunjie et al. | 2016
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Theoretical and numerical study on bulge testing of ground wafer to characterize mechanical properties and residual stressChen, Pei / Pan, Tian / Sun, Jinglong / Qin, Fei et al. | 2016
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Unlocking the full potential of Lithography for Advanced Packagingvan der Voort, Jelle / van der Beek, Gerrit / van der Grinten, Berend et al. | 2016
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Using wavelength modulation spectroscopy technique to detect trace ammonia gas in near-infrared spectral regionSun, Jiangping / Zhu, Guo / Guo, Xiongxiong / Zhang, Libin / Zou, Xixi / Gan, Zhiyin et al. | 2016
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Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processingBest, Keith / Singh, Gurvinder / McCleary, Roger et al. | 2016
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TSV-Cu protrusion induced by thermal cycling testChen, Si / Qin, Fei / Zhao, Jingyi / An, Tong et al. | 2016
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Edge chipping of silicon wafers in rotating grindingSun, Jinglong / Qin, Fei / Chen, Pei / An, Tong / Wang, Zhongkang et al. | 2016
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Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder jointsLi, Huaicheng / An, Tong / Bie, Xiaorui / Shi, Ge / Qin, Fei et al. | 2016
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Copper pillar bump design optimization based on Taguchi methodShi, Ge / Bie, Xiaorui / An, Tong / Qin, Fei et al. | 2016
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Effect of solder flux system on rheology and jet printing performance of solder pasteTu, Fuqiang / Wang, Yanqing / Zhou, Jian / Xue, Feng et al. | 2016
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Comparison of smoothing methods for the analysis of transient thermal resistanceLiu, Yanan / Chen, Zhangfu / Zhang, Jianhua / Yang, Lianqiao et al. | 2016
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An analysis on damage of light-emitting diodes reliability induced by electronic static dischargeNan, Tingting / He, Piaopiao / Yin, Luqiao / Zhang, Jianhua et al. | 2016
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Instrument for water vapor transmission rate of thin-film encapsulation in aging environmentLi, Sheng / Zhang, Zhilin / Zhang, Jianhua et al. | 2016
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Investigation of thermomechanical stress characteristics in high-power 808-nm AlGaAs/GaAs laser diode barsQiao, Yanbin / Chen, Yanning / Shao, Jin / Zhao, Dongyan / Zhang, Haifeng / Zhao, Yang / Zhang, Chong / Yang, Wei et al. | 2016
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Optimization of heat transfer of microchannels in LTCC substrate with via holes and liquid metalLiu, Nian / Jin, Yufeng / Miao, Min / Cui, Xiaole et al. | 2016
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Investigation on solder bump process polyimide cracking for wafer level packagingShi, Lei / Chen, Lin / Zhang, David Wei / Liu, Evan / Huang, Jin-Xin et al. | 2016
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Effect of the viscosity of organic carrier on the quality of laser-assisted glass frit bondingLi, Yi / Xiao, Yanyi / Wang, Wen / Yin, Luqiao / Zhang, Jianhua et al. | 2016
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Kirkendall voids evolution in Sn-Ag-In solder bumps and its effect on reliabilityDing, Xiaojun / Wang, Dongliang / Zhang, Lu / Chen, LiHua / Zhang, Wenji et al. | 2016
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Activated sintering and thermal properties of 1 wt. %Ag-W/Cu thermal-management compositesLuo, Guoqiang / Li, Yuan / Zhang, Jian / Dai, Yang / Shen, Qiang / Zhang, Lianmeng et al. | 2016
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Analysis and solution of bump deformation failure in Flip chip processWang, Ning / Li, Xiaoqing / Gu, Liqun / Li, Ying / Zhou, Jianwei / Chae, Jonghyun et al. | 2016
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3D interconnect technology based on low temperature copper nanoparticle sinteringZhang, B. / Carisey, Y.C.P. / Damian, A. / Poelma, R.H. / Zhang, G.Q. / van Zeijl, H.W. et al. | 2016
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Mechanism and process study for high performance COB developmentBao, Haomin / Zhang, Peng / Chen, Yinglei / Liu, Jiangtao / Zhou, Jianwei / Chae, Jonghyun et al. | 2016
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Thermal modeling and analysis for a novel packaging structure of CMOS image sensorHan, S. F. / Yang, D.G. / Cai, M. / Liu, D.J. / Nie, Y.Y. et al. | 2016
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Si/Si bonding based on self-propagating exothermic reactionZhang, Anna / Zhou, Zheng / Zhu, Wenbo / Mo, Liping / Wu, Fengshun et al. | 2016
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Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Cu solder jointsYan, Xingchen / Zhang, Yichen / Wang, Chunyan / Xu, Kexin / Wang, Junjie / Wei, Xicheng et al. | 2016
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Integrated of PDMS microfluidic channel with cantilever based bio-sensorWang, Shuaipeng / Chen, Yanning / Zhang, Haifeng / Zhao, Dongyan et al. | 2016
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Temperature monitoring of phosphor/silicone mixture in multichip-on board packaged light-emitting diodes with Bragg grating-based sensorChen, Quan / Wang, Min / Zhou, Shengjun / Liu, Sheng et al. | 2016
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Impacts of back-grinding process parameters on the strength of thinned silicon waferBie, Xiaorui / Qin, Fei / Zhou, Linfeng / Sun, Jinglong / Chen, Pei / Wang, Zhongkang et al. | 2016
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Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bonding processYue, Wu / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2016
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Dynamic stiffness analysis of repetitive control and applied to Advanced Metrology AnalyzerYao, Wu-Sung / Hu, Ian / Kao, Golden / Shih, Mengkai / Chen, Karen et al. | 2016
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Thermal dissipation enhancement of LED filament bulb by ionic windXu, Chunlin / Zhang, Zefeng / Chu, Jingcao / Wu, Jiading / Lei, Xiang / Zheng, Huai / Liu, Sheng et al. | 2016
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Via last TSV process for wafer level packagingJing, Xiangmeng / Dai, Fengwei / Zhang, Wenqi / Cao, Liqiang et al. | 2016
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Characteristics of coaxial-annular through-silicon-via in microwave fieldWang, Fengjuan / Wang, Gang / Yu, Ningmei et al. | 2016
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The role of ultrasonics in formation of bonding for solid state solder interconnectionsChen, Zhuo / Zhang, Xianhe / Fang, Xian / He, Hu / Zhu, Wenhui et al. | 2016
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Model simplification method for PBGA assembly simulation under random vibrationTang, Tao / An, Tong / Qin, Fei et al. | 2016
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Dynamic analysis of piezo-based accelerometer with asymmetric gapped cantilever arrayLuo, Zhang / Liu, Chaojun / Yu, Shuai / Liu, Sheng / Xu, Yong et al. | 2016
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An a-IGZO TFT pixel circuit with improved current mirror for active matrix organic light emitting diode displaysLiu, Lilin / Sun, Kun / Zhang, Xiangying / Teng, Dongdong / Wang, Gang et al. | 2016
- 1240
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Failure mechanisms and package reliability issues in optocouplersWu, Huiwei / He, Shengzong / Chen, Xuanlong / Xu, Guangning / Lei, Dengyun et al. | 2016
- 1244
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Design of 14–14.5GHz semiconductor microwave digital phase shiftersYang, Dan / Zhu, Zhaojun / Liu, Peng et al. | 2016
- 1247
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Vibration reliability test and analysis of plastic ball grid arrayLi, Huaicheng / An, Tong / Tang, Tao / Qin, Fei et al. | 2016
- 1251
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In-situ assembly for MEMS based pressure sensorShang, Yuanfu / Cao, Wan / Liu, Sheng et al. | 2016
- 1257
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Utilizing CdSe/ZnS core/shell QDs to improve the modulation bandwidth of WLED for visible light communicationXiao, Xiangtian / Tang, Haodong / Zhang, Tianqi / Chen, Wei / Chen, Wanli / Hao, Junjie / Wang, Rui / Wang, Kai et al. | 2016
- 1262
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A novel manufacturing scheme for TSVs with porous polymer insulation linersWu, Ke / Wang, Zheyao et al. | 2016
- 1267
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Integrated circuit ESD protection structure failure analysis based on TLP techniqueXie, Jiang / Shi, Qian / Gao, Yue et al. | 2016
- 1272
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PEM/OBIRCH in failure localization of flip-chipSun, Zhe / Chen, Xuanlong / Lin, Daotan et al. | 2016
- 1275
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Large-scale alignment quantum rods film for high efficiency wide color gamut LED displayWen, Zuoliang / Li, Shang / Qin, Jing / Hao, Junjie / Zhang, Tianqi / Tang, Haodong / Wang, Kai et al. | 2016
- 1280
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Influence of temperature on pumping rate and crystalline grain of copper filler in through-silicon viasPan, Xiaoxu / Huang, Pengfei / Su, Fei / Guan, Yong / Ma, Shenglin / Chen, Jing et al. | 2016
- 1284
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Application of three-dimensional X-ray microscopy in failure analysis for plastic encapsulated microelectronicsLin, Daotan / Sun, Zhe et al. | 2016
- 1288
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QFP plastic cavity carrier design for MPW chip packageLi, Zhenchao / Wang, Qian / Chen, Yu / Cui, Guangjun / Liu, Zhaolin et al. | 2016
- 1293
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Conductive property of inkjet printed film by reactive silver inks on PET flexible substrateTang, Xingming / Xu, Hongbo / Liu, Ximing / Zhao, Hongyun et al. | 2016
- 1297
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Research on failure mechanism of the phosphors and sealants for white light emitting diode packageWu, Hailin / Zhou, Lin / Luo, Haimei / Xiao, Wenpeng / Cao, Minggao / Hu, Yimin / Jing, Gang / Liu, Yan et al. | 2016
- 1301
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Design and analysis of video information transmission system based on visible LED light communicationLi, Nanbo / Cui, Zaifu / Lu, Han / Chen, Xuanyou / Wei, Junyan / Cai, Miao / Zhang, Ping / Yang, Daoguo et al. | 2016
- 1307
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High reliable wire bonding technology in microwave module packagingHan, Zongjie / Yan, Wei / Hu, Yongfang / Li, Xiaoxuan et al. | 2016
- 1311
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N-layer screen printed ceramic on stainless steel based pressure sensorWang, Xiaoping / Wu, Dengfeng / Cao, Wan / Li, Fanliang / Wang, Xiaoyan / Liu, Sheng et al. | 2016
- 1315
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Novel fabrication method of LED freeform lens based on electrohydrodynamicZhao, Zhili / Zheng, Huai / Guo, Xing / Zhang, Zefeng / Chu, Jinchao / Liu, Sheng et al. | 2016
- 1318
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Highly efficient chip scale package (CSP) LED based on surface patterningZhang, Tian'qi / Tang, Haodong / Li, Shang / Wen, Zuoliang / Xiao, Xiangtian / Zhang, Yulong / Wang, Fei / Wang, Kai et al. | 2016
- 1323
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Typical failure mechanisms of plastic encapsulated devices' internal connectionCai, Jinbao / Chen, Xuanlong / Wu, Huiwei / Kuang, Xianjun et al. | 2016
- 1327
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Study on the electrical performance of one differential pair bonding fingers on different layers in wire bonding packageLu, Feng / Cao, Yusheng / Lian, Binhao et al. | 2016
- 1330
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The finite element analysis on reliability of gold bumpLiu, Jiansong / Yao, Quanbin / Lin, Pengrong / Cao, Yusheng / Lian, Binhao et al. | 2016
- 1334
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Investigation of epoxy molding compound with high adhesion on PD plated lead framesLiu, Hongjie / Tan, Wei / Shi, Erzeng / Li, Lanxia / Cheng, Xingming / Han, Jianglong et al. | 2016
- 1341
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Failure analysis on the mechanical property of Through-Silicon Vias interface using a cohesive zone modelLi, Ganglong / Chen, Zhuo / Cao, Sen / Luo, Honglong / Jiang, Liulu / Zhu, Wenhui et al. | 2016
- 1346
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Study on the formation mechanism of liquid film on the Au/Cu bilayered filmLiu, W. / Zhang, S.D. / Jin, Y.F. / Zhang, T.Z. / Guo, L.C. et al. | 2016
- 1350
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Thermal effects of packaging material and structure on high power white LEDsYang, Xi / Wang, Zili / Ren, Yi / Sun, Bo et al. | 2016
- 1355
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Thermal properties of TIM using CNTs forest in electronics packagingZhang, Dongsheng / Liu, Jiawen / Sun, Shuangxi / Huang, Shirong / Bao, Jie / Wang, Ning / Liu, Johan / Lu, Xiuzhen et al. | 2016
- 1360
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Electrical characteristics and thermal reliability of blind through-silicon-vias with polyimide linersLiu, Bin / Yan, Yangyang / Zhang, Ziyue / Chen, Zhiming / Ding, Yingtao et al. | 2016
- 1365
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A brief overview of atomic layer deposition and etching in the semiconductor processingYuan, Guangjie / Wang, Ning / Huang, Shirong / Liu, Johan et al. | 2016
- 1369
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Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder jointsWen, Qiang / Li, Xunping / Li, Guoyuan et al. | 2016
- 1373
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A wet process to etch arrayed vias for through silicon via application of 3D packagingGao, Lanya / Zhang, Junhong / Zheng, Shuai / Zhang, Shanshan / Li, Ming et al. | 2016
- 1377
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Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packagingFu, Zhiwei / Zhou, Bin / Yao, Ruohe / Li, Xunping et al. | 2016
- 1381
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An analytical model for the underfill flow driven by capillary forces in chip packagingLuo, Wan / Liang, Jun-Jie / Zhang, Yun / Zhou, Hua-Min et al. | 2016
- 1387
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The effect of gap height on non-Newtonian underfill flow in chip packaging: Experiments and simulationsLuo, Wan / Liang, Jun-Jie / Zhang, Yun / Zhou, Hua-Min et al. | 2016
- 1391
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Applying novel non-destructive failure analysis techniques on the package related failuresChu, C.H. / Lin, Y.T. / Hsu, W.J. / Chang, C.T. / Kuo, P.S. / Hsieh, Y.F. et al. | 2016
- 1396
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Thermo-plastically stretchable electronic and sensor circuitsChtioui, Imen / Bossuyt, Frederick / Bedoui, Mohamed Hedi et al. | 2016
- 1401
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Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteriesZhang, Yan / Yue, Wang / Zhang, Shaochun / Huang, Shirong / Liu, Johan et al. | 2016
- 1406
-
MEMS bandpass filter based on substrate integrated waveguide structureCao, Ze-Hua / Wang, Chao et al. | 2016
- 1409
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Design of stepped impedance resonator bandpass hairpin filterCao, Ze-Hua / Wang, Chao et al. | 2016
- 1413
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High efficiency GaN power amplifier on C bandTang, Houlu / Wang, Zhaobi / Xu, Tao / Wang, Xiaolong et al. | 2016
- 1418
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The microanalysis of copper-coated diamond composite powders prepared by electroless platingZhang, Lianmeng / Xiong, Shuya / Liu, Ruxia / Zhang, Jian / Luo, Guoqiang / Shen, Qiang et al. | 2016
- 1423
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Failure analysis of die-bonding interfaces between LED chip and heat sinkLiu, W. / Zhang, S.D. / Jin, Y.F. / Zhang, T.Z. / Guo, L.C. et al. | 2016
- 1427
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ESD damage mechanism study of metal fuse areaZhang, Yaqun / Zhang, Huirong / Chiu, ChinTien / Tian, Haoran et al. | 2016
- 1430
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Application of orthogonal experiment method of copper samples of small size in Energy Dispersive spectroscopy quantitative analysisWang, Xueke / Bao, Shengxiang / Hu, Yongda / Li, Qiang / Ai, Libo et al. | 2016
- 1437
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Simulation and design of Ku band seven bit digital phase shifter based on ADSYang, Dan / Zhu, Zhaojun / Liu, Peng et al. | 2016
- 1440
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Research on process of Cu-Hf infiltration on 304 stainless steel by double glow plasma technologyWang, Jian / Tang, Yan / Wang, Yan / Xu, Jinyong / Wang, Yiguang et al. | 2016
- 1445
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A compact dual-band antenna for C-band applicationsHe, Jianzhi / Wei, Xi et al. | 2016
- 1447
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A wide-band waveguide orthomode transducerWei, Xi / He, Jianzhi et al. | 2016
- 1450
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Electromigration-induced morphology and microstructure changes in Sn58Bi/Sn3.0Ag0.5Cu compositional solder interconnectWang, Fengjiang / Zhou, Lili / Wang, JiHeng / Wang, Xiaojing et al. | 2016
- 1454
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Effects of impurities and grain size on welding performance of T3 copperWang, Xueke / Bao, Shengxiang / Hu, Yongda / Li, Qiang / Ai, Libo et al. | 2016
- 1461
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An efficient approach for designing Highpass filterDai, Shuhuai et al. | 2016
- 1464
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An analytical model for capacitance of silicon-insulator-silicon through-silicon-viasLi, Bohao / Li, An'an / Xiong, Miao / Yang, Jianxun / Chen, Zhiming / Ding, Yingtao et al. | 2016
- 1469
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Research on thermal coupling effect of multi-heating sources in MCMCheng, Ji / He, Xiaoqi et al. | 2016
- 1476
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A dual-band compact branch line coupler based on Γ-shaped transformerLiu, Peng / Yang, Dan et al. | 2016
- 1480
-
A new dual band Wilkinson power dividerLiu, Peng / Yang, Dan et al. | 2016
- 1483
-
Tape & Reel single side peel force test verificationQiao, Shuai / Tao, Lu-Qi / Ren, Tian-Ling / Liu, Zhao-Lin et al. | 2016
- 1487
-
Effect of voltage and gap on the morphology of the Ni micro-column by localized electrochemical depositionChen, Tao / Wang, Fuliang / Sun, Jiadong / Gao, Junling et al. | 2016
- 1493
-
Disposable electrochemical immunosensor based on r-GO/Thi/AuNPs nanocomposites for detection of NSELuo, Jinping / Wang, Yang / Xu, Huiren / Fan, Yan / Liu, Juntao / Cai, Xinxia et al. | 2016
- 1497
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Server platform power design optimization using switching voltage regulator modeling techniquesSingh, Amarjoyt / Zhou, Qing et al. | 2016
- 1503
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The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting formingSu, Dan / Wang, Chunxi / Liu, Sheng / Li, Xiaotian / Zhang, Honghai et al. | 2016
- 1508
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Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ballLiao, Daokun / Su, Dan / Liu, Sheng / Li, Xiaotian / Zhang, Honghai et al. | 2016
- 1512
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Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technologyWang, Chunxi / Liao, Daokun / Liu, Sheng / Li, Xiaotian / Zhang, Honghai et al. | 2016
- 1517
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Thermal imaging based on Thermoreflectance addresses the challenges for thermal analysis of today's advanced complex devicesKendig, Dustin / Tay, Andrew A. O. / Shakouri, Ali et al. | 2016
- 1522
-
Investigation of Cu wire neck crack under thermal cycling testFan, Haibo / Chow, WW / Lee, Kan / Wong, Fei / Chen, Haibin / Wu, Jingshen et al. | 2016
- 1526
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Characterization of 2.5D package warpage through Shadow Moiré technique and failure analysisLiu, Haiyan / Yu, Daquan / He, Hongwen / Liu, Xiaoyang / Lin, Tingyu et al. | 2016
- c1
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[Front cover]| 2016