The design of a voltage conversion SIP based on electrothermal coupling method (English)
- New search for: Su, Hao-hang
- New search for: Fu, Shuai
- New search for: Su, Hao-hang
- New search for: Fu, Shuai
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ISBN:
- Conference paper / Electronic Resource
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Title:The design of a voltage conversion SIP based on electrothermal coupling method
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Contributors:Su, Hao-hang ( author ) / Fu, Shuai ( author )
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2021-09-14
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Size:487986 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Study on Warpage and Peeling Mitigation of Wafer Level During Metal Plating ProcessLi, Dayang / Xiao, Ming / Wang, Zhiqi et al. | 2021
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Reliability and Thermal Degradation of First-Level Thermal Interface MaterialsSu, Yunpeng / Li, Junhong / Ma, Qiangquiang / Ren, Linlin / Zeng, Xiaoliang / Sun, Rong et al. | 2021
- 1
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An Accurate Simulation Method of Package Warpage Experimental Results Based on FEMNeng, Liqiang / Song, Tingting / Shao, Guangping / Pang, Jian / Tuobei, Sun / Ouyang, Keqing et al. | 2021
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Simulation Analysis of Residual Stress of Sintered Nano-Silver under Multilayer Stacked ModuleLiang, Zhentang / Wang, Hongyue / Zhou, Bin / Li, Guoyuan et al. | 2021
- 1
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A stretchable high-sensitive capacitive sensor for aerodynamic pressure measurementYang, Xiaofeng / Chen, Jian / Chen, Si / Zhou, Bin / Shi, Yijun / Fu, ZhiWei et al. | 2021
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Inorganic Stabilizer Introduced Flux System with High Tackiness: an Efficient and Novel Material Solution for the Micro LED Mass TransferJi, Liangzheng / Zhang, Jing et al. | 2021
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Enhanced Discharged Energy Density in Polyetherimide Composites by Boron Nitride/Aluminum Nitride Hybrid FillersWu, Xudong / Gao, Shiyi / Wu, Xin / Zhang, Shuo / Cao, Zhijun / Tan, Daniel Q. et al. | 2021
- 1
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Study on the Electromagnetic and Thermal Characteristics of Aerostatic Spindle for Wafer GrindingZhao, Chen / Lezhi, Ye / Xuanjie, Song / Zhiyue, Wang / Guangjie, Liu / Yumin, Zhao et al. | 2021
- 1
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The Influence Analysis of Geometry on Void in Molded Underfill for Flip ChipYan, Yamei / Chen, Gui / Xiao, Xiaoyu / Wang, Yan / Zhu, Wenhui et al. | 2021
- 1
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BGA chip torsion finite meta analysis at high temperature.Yu-Qing, Yue / Chao, Jiang / Yan-Ting, Chen / Jing, Wei / Lv, Wu et al. | 2021
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Research on adjustment of the electrical resistivity of Aluminum Nitride ceramicFan, Jinhu / Tang, Zirong / Wang, Jie et al. | 2021
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Random Vibration Response Analysis of Sip Power Supply ModuleLin, Tao / Wang, WeiYin / Li, Jun et al. | 2021
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The Influence of Different Phosphor Coating Methods on the Temperature of LEDChen, Kun / Hu, Deming / Yang, Liang et al. | 2021
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The Influence of Molding Compound Properties on System-in-Package Reliability for 5G ApplicationLiu, Dashun / Chen, Kai / Qin, Yijing / Zhong, Yong / Wan, Zhaorong / Liu, Richeng / Lu, Dong / Xue, Ke / Wu, Jingshen et al. | 2021
- 1
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Experimental and Computational Study of Shielding Effectiveness of Metal GridsLin, Zhiqiang / Liu, Xuebin / Shi, Xinrong / Hu, Yougen / Sun, Rong et al. | 2021
- 1
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Study on hermetic package of antiradiation direct-head transmitterWang, Chuanwei / Wu, Yukun / Zhang, Jiabo / Pan, Kuang / Wang, Daochang / Liang, Yi et al. | 2021
- 1
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Key factor analysis of nano silica on the dispersion in underfillDu, Xiaomeng / Wang, Ning / Du, Mingyong / Zhang, Leicong / Zhao, Tao / Zhu, Pengli / Sun, Rong / Cao, Jiakai / Ruan, Jianjun et al. | 2021
- 1
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Research on the Reliability of Board Level Interconnect Solder Joints under Thermal-Mechanical CouplingLiu, Xin / Yu, Yongjian / Xie, Weikun / Zhang, Kaihong / Zhu, Kai et al. | 2021
- 1
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On-Die Clock Tree Low PSIJ Through PDN OptimizationHuddar, Vinod Arjun et al. | 2021
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The Study on Electromigration of Solder Joints under Thermal Cycling LoadNiu, Leyi / Tian, Xiaodi / Jia, Fei et al. | 2021
- 1
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The Study of Effects to the Thermo-Mechanical Performance of the First Level Thermal Interface MaterialsWang, Zhenyu / Ren, Linlin / Zeng, Xiangliang / Ye, Wenbo / Xu, Yonglun / Zeng, Xiaoliang / Pang, YunSong / Rong, Sun et al. | 2021
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Research on Double-Layer Networks-on-Chip for Inter-Chiplet Data Switching on Active InterposersDuan, Xiaolong / Miao, Min / Zhang, Zhuanzhuan / Sun, Liang et al. | 2021
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A Cost-saving Thermal Test Chip Design in a Test Vehicle of Large BGASun, Jianjun / Lai, Yuanting / Yang, Hao / Pang, Jian / Sun, Tuobei / Ouyang, Keqing et al. | 2021
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Design and optimization of a pneumatic DOD solder ball 3D printing systemMin, Zhixian / Pan, Huiming / Zhao, Dinglei / Liu, Sheng / Wang, Zhiqin / Chen, Zhiwen et al. | 2021
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Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance ThermographyWang, Dazheng / Zheng, Libing / Si, Weikang / Yang, He / Gao, Yingying et al. | 2021
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Study on the Transport Performance of Microstrip Circuit Board with Voids in Solder LayerLiu, Zhidan / Zhao, Zhiping / Zhang, Fei / Chen, Shuai et al. | 2021
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Study on Gold Wire Sweep in Cantilever Chip-Stacked Package during Molding ProcessCao, Sicheng / Yang, Daoguo / Li, Wangyun / Wang, Xiyou / Xue, Shirui / Yun, Zhanfei et al. | 2021
- 1
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Plane Position Measurement for $\mu \text{LED}$ Based on Single CameraBai, Jie / Niu, Pingjuan / Gu, Erdan et al. | 2021
- 1
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Optical Path design of a high coupling efficiency DFB laser package based on collimatorLv, Xiaomeng / Liao, Ao / Xu, Weihua / Liu, Yangzhi / Wu, Yilong / Qiao, Lan / Zhao, Yong / Yang, Junli et al. | 2021
- 1
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Thermomechanical and Electrical Properties of the $\text{SiO}_{2}/\text{ZrW}_{2}\mathrm{O}_{8}/\text{Epoxy}$ CompositeLi, Chaofan / Luo, Suibin / Yu, Shuhui / Chu, Baojin / Sun, Rong et al. | 2021
- 1
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Low Temperature Curing Copolyimide with Monomer Containing Pyrazine MoietyLi, Changqing / Zhang, Guoping / Li, Jinhui / Li, Yingying et al. | 2021
- 1
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Preparation and microwave properties of $\text{TiO}_{2}/\text{PTFE}$ composites reinforced by mullite fibersWeng, Zhangzhao / Luo, Jun / Lv, Hongfeng / Zhou, Shuai / Wang, Xiaoqiang / Luo, Daojun et al. | 2021
- 1
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Flexible Thermal Interface Materials Through Controlling the Ratio of Silicone Oil Functional GroupsTu, Wendian / Ren, Linlin / Du, Guoping / Sun, Rong / Zeng, Xiaoliang / Li, Junwei et al. | 2021
- 1
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Effect of Temperature on the Fatigue Damage of SAC305 SolderLong, Xu / Guo, Ying / Chang, Xiaotong / Su, Yutai / Shi, Hongbin / Huang, Tao / Tu, Bingyi / Wu, Yanpei et al. | 2021
- 1
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Process Development and Failure Analysis of Super-Size Embedded Silicon Fan-out PackageFu, Dongzhi / Ma, Shuying / Wang, Jiao et al. | 2021
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Effect of Ni-CNTs on wetting properties, microstructure, and creep resistance of Sn58Bi-0.1Er composite solderLi, Qi / Liu, FengMei / Yi, Yaoyong / Zhang, Xueying / Gao, Haitao et al. | 2021
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A Comparative Study on the Influences of Various Nickel Powders on the EMI Shielding Performance of Conductive Polymer CompositesWang, Yong / Tian, Dingkun / Xu, Yadong / Zhang, Baotan / Zhao, Tao / Hu, Yougen / Sun, Rong et al. | 2021
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A hybrid degradation modeling of light-emitting diode using permutation entropy and data-driven methodsWen, Minzhen / Jing, Zhou / Ibrahim, Mesfin S. / Fan, Jiajie / Zhang, Guoqi et al. | 2021
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A compact chip filter for 5G communication frontend based on Glass IPD technologyZhang, Zhitao / Gu, Ling / Hu, Shanwen / Zhang, Yuehua / Zhang, Xinlei et al. | 2021
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Research on Conformal Phased Array T/ R Module Based on LCP SubstrateLuo, Yan / Liu, Kai / Gao, Qiu / Ding, Lei / Zhou, Yi / Wang, Lichun et al. | 2021
- 1
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Characterizing the die attach layer delamination effect on the heat transferring performance in LED package with entropy generation analysisAi, Binjie / Cai, Miao / Yang, Daoguo / Lu, Guangsheng / Zhang, Kailin / Zhang, Guoqi et al. | 2021
- 1
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Evaluation of Aging Performance of Thermal Gel Subjected to Laser Flash TestsYao, Yimin / Xu, Yonglun / Bai, Xue / Pang, Yunsong / Ren, Linlin / Zeng, Xiaoliang / Deng, Fei / Xu, Jian-Bin / Sun, Rong et al. | 2021
- 1
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Design method of triaxial vibration fixture for complex integrated circuitsWang, Xiaoqiang / Li, Bin / Deng, Chuanjin / Deng, Rui / Wang, Ruolei / Jiang, Kun et al. | 2021
- 1
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Fabrication of Flexible Printed Circuits on Polyimide Substrate by Using Ag Nanoparticle Ink through 3D Direct-writing and Reliability of the Printed CircuitsLi, Cheng-Bo / Ma, Xiao / Huang, Hai-Jun / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2021
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Stress-strain study of QFN solder joints with different structural parameters under random vibration loadingLi, Maolin / Huang, Chun-yue / Wang, Zhuo / Wei, Wei et al. | 2021
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Research on Thermal Characteristics of High Power 3D Microchannel Multichip PackageWei, Xiangli / Yang, Daoguo / Li, Wangyun / Wang, Xiyou / Lu, Guangsheng / Xue, Shirui et al. | 2021
- 1
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Failure Mechanism Study for Flip Chip QFN Crack Issue under Temperature Cycling TestXue, Ke / Lu, Dong / Chen, Kai / Qin, Yijing / Li, Dayang / Tang, Qi et al. | 2021
- 1
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Challengeable Mechanical Issues in Microelectronic Packages for DevelopmentsXue, Xiangdong / Wei, Jianghao / Wang, Yuming / Yang, Jianxin et al. | 2021
- 1
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Artificial Neural Networks Modeling Technology for Substrate Integrated Suspended LineYan, Shuxia / Yang, Nana / Chen, Zhifeng / Huang, Peng / Shi, Weiguang et al. | 2021
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Inner microcrack induced by intermetallic compound in right-angle Au/Sn3.0Ag0.5Cu/Au solder jointsYue, Wu / Zhang, Zhenyu / Liang, Bunv / Li, Jing / Xue, Cheng et al. | 2021
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The effect of silicon anisotropy on the thermal stress of TSV structure of 3D packaging chip under thermal cyclic loadsLiang, Jingyang / Ning, Minjie / Ding, Chao / Liu, Tianhan / Dai, Zongbei / Qin, Hongbo et al. | 2021
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A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics PackagingZhang, Donglin / Zhao, Xiuchen / Liu, Yingxia / Liu, Ying / Huo, Yongjun et al. | 2021
- 1
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Significant Effect of Temperature and Solders on The Growth Behavior of CU6Sn5 on (110) Cu Single CrystalDong, Chong / Shang, Min / Guo, Ying / Chen, Xiangxu / Zhang, Jun / Dong, Changlong / Ma, Haoran / Ma, Haitao et al. | 2021
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Microstructure evolution and interfacial reaction of Co-P/SAC305/Co-P solder joints at high current densityFan, Tao / Yang, Donghua / Qin, Haotong / Chen, Yuqian / Chen, Tao / Zhai, Xiang / Ran, Teng et al. | 2021
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Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor DevicesZhong, Yi / Bao, Shuchao / Li, Ke / Zhang, Mingchuan / Yu, Daquan et al. | 2021
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Simulation and experimental analysis of a cost-effective miniaturized transceiver for X-band applicationBan, Yu / Liu, Jie et al. | 2021
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Study of Package Reliability according to the Epoxy Molding CompoundJo, Eunsol / Park, Jung-Rae / Jung, Cheong-Ha / Kim, Gu-Sung et al. | 2021
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Silver film prepared by spark ablation for conductive patternLiang, Peilin / Zhang, Yu / Tong, Jin / Huang, Zhongwei / Cui, Chengqiang / Zhong, Keju et al. | 2021
- 1
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Die chipping FDC development at wafer saw processXue, Dongpeng / Zhong, Caiden / Zhang, Elley / Jiang, Weiting / Zhang, Cong et al. | 2021
- 1
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112G High Speed Interface Package Design and SimulationZhang, Jiangtao / Zhang, Li / Pang, Jian / Sun, Tuobei / Ouvang, Keqing et al. | 2021
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Mixed Cu Nanoparticles and Cu Microparticles with Promising Low-temperature and Low-pressure Sintering Properties and Inoxidizability for Microelectronic Packaging ApplicationsLai, Haiqi / Wen, Jian / Yang, Guannan / Zhang, Yu / Cu, Chengqiang et al. | 2021
- 1
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Simulation Research on Electromigration of BGA DevicesTian, Wenchao / Zhang, Yiming / Chen, Yong / Chen, Si / Cui, Hao et al. | 2021
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Study of Efficient Automatic Detection of Coplanarity and Position of CCGA DevicesZhang, Qi / Liu, Xiaoyan / Chen, Leida / Nan, Xujing et al. | 2021
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Research on the board level reliability of CQFJ ceramic packageYang, Zhen-tao / Yu, Fei / Liu, Lin-jie / Gao, Ling et al. | 2021
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Failure Analysis of Anisotropic Conductive Adhesive Packages in Narrow-Pitch Flip Chip PackagingChen, Gui / Wang, Yan / Xiao, Xiaoyu / Yan, Yamei / Zhu, Wenhui et al. | 2021
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Research Progress of Extreme Low Temperature Reliability of Typical Electronic Interconnection StructuresSun, Zhaoning / Guo, Xiaotong / Zhao, Zhenbo / Ni, Yiqing / He, Guanghui et al. | 2021
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Reliability analysis on wafer bonding process of MEMS circulatorLuo, Dongxue / Wu, Yan / Sun, Junfeng / Yu, Miao et al. | 2021
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Impact Force Control of High-Speed Wire Bonding Machine Based on Fuzzy Active Disturbance Rejection ControllerLiu, Yachao / Gao, Jian / Zhan, Boyu / Zhang, Lanyu et al. | 2021
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Cure Shrinkage Characterization and Warpage Simulation Optimization of Epoxy Molding Compound for 5G ApplicationChen, Kai / Liu, Dashun / Qin, Yijing / Zhong, Yong / Wan, Zhaorong / Liu, Richeng / Lu, Dong / Xue, Ke / Wu, Jingshen et al. | 2021
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Reflow Soldering Process Optimization Based on Surface Evolver Solder Joint Shape Simulation and Finite Element Analysis of PCB AssemblyJin, Xing / Wang, Wenlong / Zhao, Wenzhong / Zhang, Yuting / Tan, Xiaopeng / Chen, Shuai et al. | 2021
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The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip PackageJiang, Ruoyu / Zhonz, Cheng / Wang, Haozhe / Li, Chenglong / Zheng, Yi / Ren, Linlin / Lu, Jibao / Sun, Rong / Wong, Ching-Ping et al. | 2021
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First-Principles study on the mechanical properties of Cu3Si compoundWang, Jian / Xu, Xiaowei / Ding, Chao / Liu, Tianhan / Dai, Zongbei / Qin, Hongbo et al. | 2021
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Numerical analysis on the effect of microstructures on the thermal and mechanical properties of carbon fiber / Al2O3 thermal padLiu, Shu / Lu, Xiaoxin / Huang, Jiabin / Lu, Jibao / Xu, Shen / Rong, Sun / Xu, Jianbin / Wong, Ching-Ping et al. | 2021
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Electroplating nanotwinned copper for ultrafine pitch redistribution layer (RDL) of advanced packaging technologyZhang, Yu-Bo / Gao, Li-Yin / Li, Xiao / Li, Zhe / Ma, Xu-Liang / Liu, Zhi-Quan / Sun, Rong et al. | 2021
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Comparison between two numerical methods for the computation of thermal conductivities of particulate composites: FEM and GeoDictLu, Xiaoxin / Huang, Jiabin / Xu, Jianbin / Lu, Jibao / Rong, Sun / Wong, Ching-Ping et al. | 2021
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Design and Analysis of MOSFET Based on Fan-out Panel-Level Package TechnologyLiang, Zhi / Shao, Dongdong / Ding, Kunpeng / Tian, Chuang et al. | 2021
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Determination of Parameters in Mixed-Mode Cohesive Zone Models for Modified Button Shear Tests by Particle Swarm OptimizationWu, Wenyu / Xue, Ke / Dai, Weijing / Liu, Dashun / Yang, Dali et al. | 2021
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Thermal Stress Study of 3D IC Based on TSV and Verification of Thermal Dissipation of STILiao, Shuaidong / Huang, Chunyue / Zhang, Huaiquan / Liu, Shoufu et al. | 2021
- 1
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Theoretical calculation and Simulation of BGA package stress under temperature cycling loadYueping, Zhang / Chuantao, Hou / Jun, Tong / Long, Wang et al. | 2021
- 1
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Soldering of Graphene Assembled Films with Ultrasonic Assistance and Its Utilization Potentiality in Electronic DevicesFu, Huaqiang / Xiao, Yong / He, Daping et al. | 2021
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Comparative Research of Infrared Thermography and Electrical Measurement Method for the Thermal Characteristics Test of GaN HEMT DevicesFu, Zhiwei / Zheng, Bingjie / Huang, Xu / Zhou, Bin / Yang, Xiaofeng / Guo, Huaixin et al. | 2021
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Effectiveness Validation on Equivalent Model for Wafer-Level Warpage PredictionSun, Guoli / Wei, Jiahui / Qin, Fei / Dai, Yanwei / Li, Kui / Li, Baoxia et al. | 2021
- 1
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Nano silver particles prepared by spark ablation as packaging interconnection materialTong, Jin / Zhang, Yu / Liang, Peilin / Huang, Zhongwei / Cui, Chengqiang / Zhong, Keju et al. | 2021
- 1
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Experimental Tests and Stress Analysis of SnPb Solder Joints in a Ceramic PoP DeviceGuo, Kaiyu / Ran, Honglei / Wang, Jun et al. | 2021
- 1
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Study on thermal stability of all copper interconnect structures under thermal shockLi, Hao / Shen, Jun / Xie, Jiacheng et al. | 2021
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Research on Electromigration Behavior of Cu Pillar Bumps under Pulse Current StressXu, JiLe / Lu, XiangJun / Fu, ZhiWei / Qu, ChenBing / Luo, Xiao / Wang, PengFei et al. | 2021
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A X Band Ceramic Package with Kilowatt-level High-power and Low LossZhou, Yangfan / Liu, Linjie / Qiao, Zhizhuang / Wang, Ke / Liu, Gai et al. | 2021
- 1
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Numerical Simulation Analysis of Flexible Printed Circuits Under Bending ConditionsLiu, Yongchao / Wang, Haozhe / Hu, Xianqin / Peng, Chao / Long, Xu / Lu, Jibao / Sun, Rong / Wong, Ching-Ping et al. | 2021
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Soft Degradation and Recovery under ESD stress of E-Mode GaN HEMTs with P-GaN GateWang, Mei / He, Zhiyuan / Ren, Yan / Hao, Lichao / Wu, Zhaohui / Li, Bin et al. | 2021
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Three Dimensional Wafer-level Vacuum Packaging of MEMS Resonant AccelerometerWang, Ziji / Xing, Chaoyang / Zhang, Jin / Su, Zhaoxi / Li, Wenqi / Luo, Bin / Shang, Jintang et al. | 2021
- 1
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Effect of SAC0307 content on properties of Cu/Zn powder/Al joint by ultrasonic excitation at low temperatureXu, Qianzhu / Gan, Guisheng / Jiang, Zhaoqi / Chen, Shiqi / Huang, Tian / Liu, Cong / Xu, Xiangtao et al. | 2021
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Design and Fabrication of Multi-Layer Silicone Microchannel Cooler for High-Power Chip ArrayWei, Tao / Huang, Haojie / Ma, Yupa / Qian, Jiyu et al. | 2021
- 1
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Investigation on the Warpage of Fan-Out Wafer-Level Packaging Using Curing Reaction Kinetics of CompositesLi, Wei / Huang, Jianhong / Xiao, Jinbo / Huang, Yiyong / Zhang, Houdun / Yu, Daquan et al. | 2021
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Warpage Behavior Study and Optimization for Ultra-Thin POP Memory with Multi-Stacked ChipsXia, Dongmei / Wang, Bei / Liao, Chengyu / Liu, Zuyao / He, Hongwen / Liu, Lu et al. | 2021
- 1
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An optimization method of ultra hign speed differential structure for BGA package*Jin, Nong / Qiao, Zhizhuang / Liu, Linjie / Wang, Ke / Zhou, Yangfan / Ren, Zan et al. | 2021
- 1
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Synthesis of Air-Sinterable Copper Nanoparticles for Die-AttachmentYao, Yue / Xu, Liang / Zhu, Pengli / Zhao, Tao / Sun, Rong / Huo, Yinachao et al. | 2021
- 1
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The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service LifeZhao, Fanny / Dong, Guoshuai / Wu, Hao / Yang, Guoming / Shieh, Brian / Lee, S. W. Ricky / Deng, Ronghua et al. | 2021
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Low-Temperature Bonding of High-Power Device Using Cu-Ag Composite Nanoparticle PasteLiu, Jiaxin / Wang, Qing / Mou, Yun / Chen, Mingxiang et al. | 2021
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Heat transfer analysis of phase change materials with metal foamsZhang, Yan / Wang, Huihui / Lu, Pei / Fan, Jingyu / Tu, Qixuan / Liu, Johan et al. | 2021
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Study on the Effect of Silica Submicron Particle Size and Content on Fracture Toughness of Filled Epoxy ResinZhou, Qin / Yu, Xuecheng / Zhang, Leicong / Zhu, Pengli / Sun, Rong et al. | 2021
- 1
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Copper Filling of High Aspect Ratio Through Ceramic Holes: Effect of Convection on Electrochemical Behavior of AdditivesQing, Wang / Jiaxin, Liu / Yilin, Wu / Mingxiang, Chen et al. | 2021
- 1
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Thickness measurement of multi-layer thin film alloy by X-ray fluorescence spectrometerZhong, Sung-Hua / Chen, Liang-Pin et al. | 2021
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Optimization of solder height for stencil printing process performance on length-width ratioSu, Dezhi / Wang, Cen / Wang, Hongkun / Zhao, Junxiang / Cheng, Hao / Zhang, Lejun et al. | 2021
- 1
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Novel water-soluble protective adhesive for wafer's laser dicingSun, Deliang / Li, Jinhui / Yi, Yuxi / Zhang, Guoping / Sun, Rong / Huang, Mingqi et al. | 2021
- 1
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Comparative Study on the Effects of Fe and Ni Additions on the Electromigration Properties of Sn58Bi Solder JointsHou, Zhuangzhuang / Dong, Yaru / Sun, Lingyao / Liu, Ying / Huo, Yongiun / Liu, Yingxia / Zhao, Xiuchen et al. | 2021
- 1
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Sequential Analysis of Drop Impact and Thermal Cycling of Electronic Packaging StructuresLiu, Yongchao / Long, Xu / Wang, Haozhe / Lu, Jibao / Sun, Rong / Wong, Ching-Ping et al. | 2021
- 1
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A High-Q Inductor based on Fan-Out Panel Level Package TechnologyNiu, Xulei / Wang, Zixu / Lin, Shaopan / Huang, Guochi / Lin, Tingyu et al. | 2021
- 1
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Simulation Analysis of Coupling Coil of 13.56MHz Magnetic Coupling Resonant Wireless Energy Transmission SystemZhan, Bihong / Xia, Wei / Xiong, Chunshui / Liu, Sheng et al. | 2021
- 1
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Wettability Improvement of Solder in Fluxless Soldering under Formic Acid AtmosphereBi, Yuhao / He, Siliang / Li, Wangyun / Yang, Daoguo / Nishikawa, Hiroshi et al. | 2021
- 1
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Deep Learning Product Classification Framework based on the Motivation of Target CustomersSun, Fei / Luh, Ding-Bang / Wang, Qidong / Zhao, Yulin / Sun, Yue et al. | 2021
- 1
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Evaluation of Fatigue Crack Growth in Solder Layer of IGBT Module under Power Cycle by Using J-integral MethodYang, Kai / Zhou, Longzao / Wu, Fengshun / Zhang, Yi / Han, Yang / Zhang, Zhou / Wan, Yang / Huang, Xiangmiao / Huang, Dayong et al. | 2021
- 1
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Fatigue Life Evaluation and Test Method for Representative Printed Circuit BoardTong, Jun / Chen, Hao / Liu, Hefeng et al. | 2021
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Study on the Antioxidation of Coated Nana-copperZhang, Weijie / Zhou, Quan / Gao, Chenshan / Liu, Debo / Li, Jun / Ye, Huaiyu et al. | 2021
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Design and Test of Transmission Line in SFQ CircuitZhou, Quan / Li, Lingyun / Wang, Zhen / Xu, Gaowei / Luo, Le / Xie, Xiaoming / Li, Kun / Ren, Jie et al. | 2021
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Simulation analysis of the influence of test conditions on the bonding strength of PCB padsWang, Huanhuan / Cai, Miao / Yang, Daoguo / He, Hengjian / Wu, Yanchen / Song, Lei et al. | 2021
- 1
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Evaluation of solder joints reliability of ball grid array assembly in astronavigation modulesQin, W. L. / Yan, Z. P. / Wu, M. H. et al. | 2021
- 1
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The Influence Of Soldering Voids In Power DevicesFang, Jianming / Wang, Min / Chen, Xuanlong et al. | 2021
- 1
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Novel Low-dielectric Fluorinated Carbon Fiber/Polyimide Materials with High ElongationWang, Tao / Li, Jinhui / Niu, Fangfang / Shan, Liang / Zhang, Guoping / Sun, Rong / Wong, Ching-Ping et al. | 2021
- 1
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Machine Learning based Prediction of Wire Bonding Profile in 3D stacked integrated microelectronic packagingOu, Zhengping / Long, Junyu / Ding, Shuquan / Chen, Yun / Hou, Maoxiang / He, Yunbo / Chen, Xin / Gao, Jian et al. | 2021
- 1
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Microstructure and mechanical properties of joints between GaAs solar cell electrode and Ag interconnector under temperature thermal cycleDing, Yuhan / Wang, Zhichao / Hua, Xueming / Shen, Chen / Wang, Min / Ma, Jusha / Qian, Bin et al. | 2021
- 1
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Study on a kind of thermal source chip for the performance analysis of micro channel heat sink: Simulation and experimental validationZhao, Ming / Zhang, Jian / Lu, Qian / Xiang, Weiwei / Li, Yangyang / Jiang, Miaomiao / Ye, Huijie / Peng, Ting et al. | 2021
- 1
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Fabrication of Soft Conductive Microspheres and Their Application in Electromagnetic Interference Shielding SheetsZhang, Luhui / Lei, Zuomin / He, Jinming / Zhu, Deliang / Hu, Yougen / Sun, Rong et al. | 2021
- 1
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Lightweight and Compressible Expandable Polymer Microspheres/Silver Flakes Composites for High-efficiency Electromagnetic Interference ShieldingWei, Jianhong / Xu, Yadong / Lin, Zhiqiang / Lei, Zuomin / Fu, Xianzhu / Hu, Yougen / Sun, Rong et al. | 2021
- 1
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The Effect of Dual Ultrasonic-assisted Soldering Process on the Properties of Cu/40%Zn+60%SAC0307 Powder/Al JointJiang, Zhaoqi / Gan, Guisheng / Xu, Qianzhu / Chen, Shiqi / Ma, Peng / Tang, Yufeng / Xu, Xiangtao et al. | 2021
- 1
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$\text{SiO}_{2}/\text{SiO}_{2}$ Bonding Technology Research on Wafer-level 3D StackingPeng, Zhang / Yu, Chengyu / Cen, Kai / Pu, Jie / Xia, Pengcheng / Wang, Chengqian et al. | 2021
- 1
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Design. Fabrication, and Test of an Embedded Si-Glass Microchannel Heat Sink for High-power RF ApplicationDu, Jianyu / Li, Weihao / Gao, Xu / Zheng, Deyin / Yang, Yuchi / Wang, Zetian / Zhao, Haoran / Kang, Jiajie / Wang, Wei et al. | 2021
- 1
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Blade Dicing on Wafer Saw StudyZhang, Qiuchen / Xia, Hongbin / Tan, Shwu Miin et al. | 2021
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The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer StackingSu, Yangquan / Ren, Kuili / Huang, Yiyong / Zhang, Mingchuan / Yu, Daquan et al. | 2021
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Thermal resistance of eutectic Ga-In-Sn/particles binary thermal interface materialsWang, Wendong / Lv, Meijuan / Guo, Jingdong et al. | 2021
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Failure Mechanism of Nickel-Chromium thin Film Chip ResistorsMao, Zhiyuan / Shi, Gaoming / Li, Weili / Kuang, Xianjun / Mo, Fuyao et al. | 2021
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Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating ProcessJin, Yinuo / Zheng, Bo / Wang, Jian / Wang, David H. / Yu, Qixing et al. | 2021
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Research on Effect of Annealing on Copper Deposited by Electroplating in High Density TSVWang, Wei / Geng, Fei / Sun, Peng / Ren, Yulong / Liu, Huan / Zhang, Kai et al. | 2021
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A 3D-MEMS Based Architecture for CS-CMOS Heterogeneous IntegrationHuang, Min / Liu, Pengfei / Zhang, Hongze / Wu, Yan / Zhu, Jian et al. | 2021
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3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with Through Glass ViasChen, Zuohuan / Zhao, Jin / Jiang, Feng / Wu, Heng / Zhang, Mingchuan / Yu, Daquan et al. | 2021
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A Flexible Ultrasonic Sensor Based on Piezoelectric Micromachined Ultrasonic Transducers (pMUTs)Tong, Zhihao / Wu, Zhipeng / Zhang, Songsong / Liu, Huicong / Lou, Liang et al. | 2021
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A Facile Bonding Material to Enable Interconnection among complex Surfaces through AgNWs AerogelHan, Zhehao / Li, Mingyu / Zhu, Wenbo / Peng, Fei / Fang, Yi et al. | 2021
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ATE board design solution of small PIN pitch DUTPan, Fei / Zhou, Qing / Zhou, Jie et al. | 2021
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Investigation of the RDL reliability based on RF characterizationWang, Hongyue / Zhang, Weijie / Shi, Yijun / Chen, Si / Fu, Zhiwei / Yang, Xiaofeng / Zhou, Bin et al. | 2021
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Research on point-to-point motion control of packaging equipmentLi, Zesheng / He, Yunbo / Liu, Shujin / Qian, Qihao et al. | 2021
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Micro-vision Image Stitching System for Large-scale and Fine-featured Circuit SubstratesWei, Yuanyang / Gao, Jian / Zhong, Yongbin / Zhang, Lanyu et al. | 2021
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A novel Cu@Sn@Ag core-shell particles for die attachment in power device packagingLiu, Jiahao / Xiao, Hui / Guo, Xiaotong / Wang, Xinjie / Yao, Zhijun / Mao, Xingchao / Liu, Hao / Chen, HongTao et al. | 2021
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Finite element analysis of thermal contact resistance in Press-Pack IGBT moduleAn, Tong / Zhou, Rui / Qin, Fei / Gong, Yanpeng / Liang, Chen et al. | 2021
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Low-temperature Cu/SiO2 hybrid bonding using a novel two-step cooperative surface activationKang, Qiushi / Wang, Chenxi / Li, Ge / Zhou, Shicheng / Tian, Yanhong et al. | 2021
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Scalable Modeling and Analysis of TSV Using Bumpless Interconnects TechnologyLi, Zewei / Cai, Zhikuang / Pan, Lei / Liu, Lu / Xu, Binbin / Guo, Yufeng et al. | 2021
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Thermodynamic simulation and analysis of metal bumps in flip-chip micro-LED packagingXiao, Xiaoyu / Yan, Yamei / Chen, Gui / Zhu, Wenhui et al. | 2021
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Strain rate and temperature effects on tensile properties of monocrystaline Cu6Sn5 by molecule dynamic simulationZhang, Jian / Huang, Wei / Pan, Kai-Lin et al. | 2021
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A TGV-based Antenna in Package for 5G mm-Wave ApplicationXu, Sha / Shi, Dianyang / Guo, Chunbing et al. | 2021
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Design and Simulation of 3D Antenna Based on Conical Via StructureLiu, Ziyu / Wang, Junhao / Zhu, Zhiyuan / Chen, Lin / Sun, Qingqing et al. | 2021
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Delamination Reduction by Material and Process OptimizationLi, Tina / He, Aaron / Chen, Phoebe / Lai, Aaron / Hang, Yuan / Feng, Colin et al. | 2021
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Copper adhesion promoters for polyimide: Heterocyclic compounds additives containing amino and hydroxyl groupsLi, Yingying / Zhang, Guoping / Li, Jinhui / Li, Changqing / Zhong, Ao / Sun, Deliang et al. | 2021
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High-Performance Thermal Grease with the Addition of Silver ParticlesZeng, Xiangliang / Wang, Zhenyu / Ye, Wenbo / Ren, Linlin / Zeng, Xiaoliang / Xia, Xinnian / Sun, Rong et al. | 2021
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$210^{\circ}\mathrm{C}$ reflow technology study in 3D PackagingSun, Lingyao / Dong, Yaru / Hou, Zhuangzhuang / Zhao, Xiuchen / Huo, Yongjun / Liu, Ying / Liu, Yingxia et al. | 2021
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Design and Analysis of a Fast-Speed Flip-Chip Bonding System with Force ControlZhu, Zhongyuan / Tang, Hui / Li, Jiedong / He, Sifeng et al. | 2021
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Review of Copper-Silver Core-Shell Sintering Pastes: Technology and Future TrendsZeng, Zejun / Zhang, Jing / Liu, Pan et al. | 2021
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Analysis of factors affecting the outgassing rate of MEMS vacuum packaging materialsYang, Yong / Zhou, Bin / Dai, Xuanjun / Huang, Yun et al. | 2021
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Effects of Surface Oxidation Treatments on the Interfacial Adhesion between Copper and UnderfillWang, Bin / Lin, Haoliang / Wu, Houya / Yang, Yuanyuan / Li, Gang / Zhu, Pengli et al. | 2021
- 1
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Design and Optimization of Temperature Sensor Based On LGA Package StructureLiu, Jianhui / Wang, Juntao / Li, Jun et al. | 2021
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Active Heat Dissipation By Chip on Thermoelectric Cooler for High-Power LEDLi, Shuang / Liu, Jinglong / Peng, Yang / Chen, Mingxiang et al. | 2021
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Sop welding joint bending stress finite element analysis and optimizationJinfeng, Gong / Chunyue, Huang / Maolin, Li / Shoufu, Liu et al. | 2021
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Topology Optimization Design Of Meta-Material Heat SpreaderBai, Xue / Hu, Qinghua / Zeng, Xiaoliang / Sun, Rong / Xu, Jianbin et al. | 2021
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High Yield and High Throughput Lithography Solution for Emerging High Density Fan-Out Panel Level PackagingJiang, Junbo / Zhang, Kang / He, Di / Xiang, Chen / Wu, Cheng-Tar / Shen, Minghao et al. | 2021
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Influence of IMC morphology on fatigue stress, strain and life of solder layer between SiC chip and DBC substrate in IGBT under thermal cyclingYang, Guang / Wu, Fengshun / Zhou, Longzao / Luan, Xinghe / Zou, Xinrui / Liu, Hui / Wan, Yang / Zhang, Xiaowei / Wang, Bin et al. | 2021
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Research on Reliability of Solder Layer in IGBT Module PackagingChi, Panwang / Lin, Shengru / Li, Yesu / Liu, Yiping / Lu, Jicun / Li, Ming / Gao, Liming et al. | 2021
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Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Ni/Sn-3.5Ag microsolder joints for 3D interconnectionTang, Chu / Zhu, Wenhui / Chen, Zhuo et al. | 2021
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Design and Verification of TDDB Test Structures For TSVLi, Kai / Chen, Si / Yang, XiaoFeng / Li, GuoYuan / Zhou, Bin et al. | 2021
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Modeling and Simulation of Interconnection Structure Compensation Design in High-speed ModulesZheng, Qi / He, Huimin / Bai, Lijuan / Wang, Yubo / Li, Dejian / Han, Shunfeng / Li, Bofu / Li, Dameng / Liu, Fengman / Cao, Liqiang et al. | 2021
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Research on Reliability Life Evaluation Method Based on Airborne T/ R ComponentsDeng, Rui / Deng, Chuanjin / Wang, Ruolei / Gong, Weixi / Cai, Zongqi / Jiang, Kun et al. | 2021
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Sawing Investigation for Thin Wafer Laminated with Die Attach FilmLiu, Haiyan / Pan, Qingyu / Xu, Sean / Wang, Jianhong / Li, Lu / Wu, Xueting et al. | 2021
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Research on the uniform temperature of heat dissipation for the reverse oblique microchannelTang, Qinglin / Liu, Dongcheng / Zeng, Yanping / Lan, Xin / Zheng, Lihua et al. | 2021
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Micron-Scale Silver Flake Paste Sintering Without Pressure for Power Electronic Die AttachmentHuang, Shijun / Luo, Ruidong / Wu, Zhen / Li, Cai-Fu et al. | 2021
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Enhancement of Copper Nanoparticle Paste by Pressure-less Sintering on Different Substrates in Pt-catalyzed Formic Acid AtmosphereLi, Junlong / Xu, Yang / Shang, Panju / Wang, Yinghui / Suga, Tadatomo et al. | 2021
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Process Optimization for CCGA Surface Mount Assembly Based on Physics of FailureXiao, Hui / Li, Weiming / Zou, Yabing / Guo, Xiaotong / Liu, Jiahao et al. | 2021
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Double-sided Electroplating Process for Through Glass Vias (TGVs) FillingLi, Ke / Wu, Heng / Chen, Weijian / Yu, Daquan et al. | 2021
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Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element AnalysisZhong, Cheng / Li, Chenglong / Peng, Tao / Wang, Yunxia / Li, Gang / Zhu, Pengli / Lu, Jibao / Sun, Rong / Wong, China-Ping et al. | 2021
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Defect Localization and Optimization of PIND for Large Size CQFP DevicesWang, Shinan / Ma, Yong / Zhang, Kaihong / Yu, Yongjian / Wan, Yongkang / Xie, Weikun et al. | 2021
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Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED DisplaysCheng, Yuanjie / Lo, Jeffery C. C. / Qiu, Xing / Lee, S. W. Ricky et al. | 2021
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Anisotropic BN Nanosheet/polymer Composite Bulk Material: A Study on Mechanical PropertyJing, Chen / Liang, Zeng Xiao / Qi, ZhangGuo / Hua, Hu Qing / Yu, Ye Huai / Pan, Liu et al. | 2021
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Study on Current Carrying Capacity of a Novel Interconnect Material ZrTe3Wen, Xiaokun / Ni, Liangyi / Lei, Wenyu / Yang, Li / Liu, Yuan / Zhang, Pengzhen / Chang, Haixin / Zhang, Wenfeng et al. | 2021
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Effect of dimension of board and micro-bumps on interconnection stress under drop testLv, Mingtao / Liu, Shimei / Chen, Taotao / Liu, Yunpeng / Liu, Junfu / He, Hu et al. | 2021
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Preparation and Properties of Low Melting Point Sn-P-F-O-Matrix Phosphor-in-Glass for white LEDHu, Deming / Yang, Liang / Xie, An / Cao, Chunyan / Shu, Xiayun / Fan, Chenrui / Deng, Jinrong / Chen, Kun et al. | 2021
- 1
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A thermal network model for thermal analysis in automotive IGBT modulesTian, Yanzhong / An, Tong / Qin, Fei / Gong, Yanpeng / Liang, Chen et al. | 2021
- 1
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Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preformXu, Hongyan / Zhang, Wei / Liu, Xuan / Xu, Ju et al. | 2021
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Study on image alignment technology based on CCD thermal reflection methodYang, He / Si, Weikang / Wang, Dazheng / Gao, Yingying / Zheng, Libing et al. | 2021
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Effect of Surface Stress on Indentation Response of Elastic-Plastic MaterialsLong, Xu / Shen, Ziyi / Chang, Xiaotong / Su, Yutai / Shi, Hongbin / Huang, Tao / Wu, Yanpei / Tu, Bingyi et al. | 2021
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Simulation Study on Thermomechanical Reliability in Embedded Die Package Fabrication ProcessZhou, Zhou / Fan, Haibo / Shi, Yuning et al. | 2021
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Thermal And Optical Modeling On Intelligent LED HeadlightsQin, Yikang / Cai, Miao / Chen, Xindong / Li, Jinyang / Yang, Daoguo / Zhang, Guoqi et al. | 2021
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Analysis on the Thermal Stress of Al-Si Thin Film using DIC MethodPan, Huiming / Xu, Guoliang / Chen, Zhiwen / Zhang, Chongming / Sun, Chao / Liu, Sheng / Liu, Li et al. | 2021
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Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain RatesLong, Xu / Su, Tianxiong / Chang, Chao / Huang, Jiaqiang / Chang, Xiaotong / Su, Yutai / Shi, Hongbin / Huang, Tao / Wu, Yanpei et al. | 2021
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Coupling Damage Accumulation of Die-Attach Solder Layer with Distributed Void Defects for Power ElectronicsShi, Yidian / Peng, Cheng / Zhu, Wenhui / Chen, Taotao / Liu, Yunpeng / Liu, Junfu / He, Hu et al. | 2021
- 1
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Loading rate on mode II fracture toughness of sintered silverLi, Yanning / Dai, Yanwei / Qin, Fei / Zhao, Shuai et al. | 2021
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Study on The Heat Dissipation Performance of Symmetrical Broken-line Microchannel RadiatorWang, Pengfei / Wang, Hongyue / Shi, Yijun / Lu, Xiangjun / Xu, Jile et al. | 2021
- 1
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A Segmented Plasma Etching Method for 2.5D/3D Through Silicon ViasLin, Yuanwei et al. | 2021
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A Bubble-free Electroosmotic Pump with Polyaniline-wrapped Platinum-coated Titanium Mesh ElectrodesYang, Qian / Li, Liang / Chen, Wen / Gao, Meng / Ye, Le et al. | 2021
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Study on die-bonding key technology of UV LED packagingLiu, Wei / Zi, Chunfang / Lin, Qingping et al. | 2021
- 1
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Method for preparing silicon photonic chip edge packaging structure based on inclined deep etching processZhao, Heng / He, Laisheng / Feng, Junbo / Ge, Bangtong et al. | 2021
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Effects of cetyltrimethylammonium bromide (CTAB) on electroplating twin-structured copper interconnectsDong, Yi / Li, Zhe / Gao, Li-Ying / Li, Xiao / Liu, Zhi-Quan / Sun, Rong et al. | 2021
- 1
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Tensile deformation mechanism of Sn-37Pb solder alloy at cryogenic temperaturesGuo, Xiaotong / Zhang, Kun / Liu, Jiahao / Li, Yong / Zuo, Xinlang / Xiao, Hui / He, Guanghui et al. | 2021
- 1
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Research on High-speed SerDes Interface Testing TechnologyXie, Weikun / Cao, Guangqiang / Ji, Weiwei et al. | 2021
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Fuzzy Tuning Algorithm for Feedforward Parameter Based on IC Package for Mass Transfer of Micro-LED Equipment XY Motion PlatformFan, Wenbin / He, Yunbo / Qiu, Guofu et al. | 2021
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Study on the Effect of Assembly Errors on the Electrostatic Tuning Ability in Micro Umbrella Shell ResonatorsXu, Lu / Luo, Bin / Shang, Jintang / Su, Zhaoxi / Han, Shouyu / Zhang, Yinghui et al. | 2021
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Simulation and Optimization of 3D Heterogeneous Integration of Inertial Micro-SystemWang, Nanxin / Ma, Shenglin / Jin, Yufeng / Xing, Chaoyang / Li, Nannan / Sun, Peng et al. | 2021
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Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element ModelingZhou, Chunming / Zhou, Peng / Hu, Yuehua / Zhang, Hao et al. | 2021
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Studies on the Effects of Soldering Layer Structures on TEC Module Performance and Thermal StressYu, Dianru / Yin, Zhihao / Liu, Guanghui / Xu, Hongyan / Xu, Ju et al. | 2021
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Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA PackageWang, Hong-Guang / Zhou, Min-Bo / Fei, Jiu-Bin / Sun, Li / Yang, Bing-Xian / Hu, Wei-Lin / Ke, Chang-Bo / Zhang, Xin-Ping et al. | 2021
- 1
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Properties of room temperature bonded and UV cured temporary bonding adhesive for ultra-thin wafer's handlingLi, Xujun / Liu, Qiang / Sun, Deliang / Li, Zhipeng / Zhang, Guoping / Sun, Rong et al. | 2021
- 1
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Solid-Liquid Mixing-state Organic Lenses for Deep-Ultraviolet Light-Emitting Diodes to Enhance the Light-Extraction EfficiencyDeng, Zihao / Li, Jiexin / Liang, Jiayong / Li, Jiayi / Li, Jiasheng / Ding, Xinrui / Li, Zongtao et al. | 2021
- 1
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Warpage measurement of substrates and printed circuit boards with Shadow MoiréHuang, Xingjia / Ou, Changping / Zhu, Shengcong / Huang, Yixiu et al. | 2021
- 1
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Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High ReliabilityShuai, Zhou / Zhangzhao, Weng / Baojun, Qiu / Daojun, Luo / Xiaoqiang, Wang / Kaixue, Ma et al. | 2021
- 1
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A Study of Copper Oxidization Mechanism at Metal InterfaceZhang, Ruolin / Tang, Ying / Wang, Xu / Cao, William / Rai, Pradeep et al. | 2021
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Low Temperature and Short Time Au/Sn Solid-liquid Diffusion Bonding for 3D IntegrationLiu, Ziyu / Wenchao, Wang / Zhiyuan, Zhu / Lin, Chen / Qingqing, Sun et al. | 2021
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Research on 3D interposer/chip stacking technology and reliabilityZhang, Ning / Li, Baoxia / Yan, Qiucheng / Wu, Daowei et al. | 2021
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Characterizatoin of Longitudinal Thermal Conductivity of Graphene FilmChen, Jiajia / Gong, Xinjian / Guo, Sihua / Zhang, Yong / Chen, Jin / Wang, Yuanyuan / Liu, Johan et al. | 2021
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Measurement Process Optimization in Using Lock-in Thermography for Fault Localization of CoWos PackagesChao, Shuanshe / Mei, Na / Lin, Xinyi / Sun, Tuo Bei / Yang, Dan / Ouyang, Keqing et al. | 2021
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Study in multilayer wiring technology on high-heat-conduction substratesDing, Lei / Chen, Jing / Liu, Kai / Luo, Yan / Zhao, Yue / Wang, Lichun et al. | 2021
- 1
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Lightweight Silver Nanowire Aerogel for Electromagnetic Interference ShieldingPeng, Fei / Fang, Yi / Han, Zhehao / Zhu, Wenbo / Li, Mingyu et al. | 2021
- 1
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Effect of Electromigration on Interfacial Reaction In Ni/Sn63Pb37/Cu BGA Solder JointsZhang, Fei / Chen, Shuai / Liu, Zhidan / Wang, Wenlong et al. | 2021
- 1
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Approach Towards Accurate Modeling of Thermal Resistance in Thermal Management of PCBWei, Jianghao / Wan, Tao / Xue, Xiangdong / Wang, Yuming et al. | 2021
- 1
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Feasibility Analysis of Crack Initiation Identification of Sintered Silver for a Fast Lifetime PredictionTang, Jiuyang / Zhang, Jing / Zhang, Guoqi / Liu, Pan et al. | 2021
- 1
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Research on Failure Mechanisms of Localized IGBT drive boardChen, Tiezhu / Zhou, Liang et al. | 2021
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Machine Learning Enabled Optimization of Pick-up Process for Thin DieYao, Peilun / Chen, Haibin / Yang, Jinglei / Wu, Jingshen et al. | 2021