A Study on Thermal-Stress-Reliability of Si-Based PLC Substrate (English)
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In:
IEEE transactions on components, packaging and manufacturing technology / A
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20
, 3
; 327-333
;
1997
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ISSN:
- Article (Journal) / Print
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Title:A Study on Thermal-Stress-Reliability of Si-Based PLC Substrate
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Place of publication:New York, NY
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Publication date:1997
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Table of contents – Volume 20, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 265
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ForewordFitch, J.S. et al. | 1997
- 266
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Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loadingQiang Yu, / Shiratori, M. et al. | 1997
- 274
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Moisture absorption and desorption predictions for plastic ball grid array packagesGalloway, J.E. / Miles, B.M. et al. | 1997
- 280
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Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount packageBor Zen Hong, / Burrell, L.G. et al. | 1997
- 286
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Thermal phenomena in compact electronic enclosures: a numerical studyMaudgal, V.K. et al. | 1997
- 295
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Finite element analysis of PWB warpage due to the solder masking processUme, I.C. / Martin, T. / Gatro, J.T. et al. | 1997
- 307
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Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysisUme, I.C. / Martin, T. et al. | 1997
- 317
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Coffin-Manson fatigue model of underfilled flip-chipsGektin, V. / Bar-Cohen, A. / Ames, J. et al. | 1997
- 327
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A study on thermal-stress-reliability of Si-based PLC substrateKitazawa, I. / Mino, S. / Hibino, Y. et al. | 1997
- 334
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A high heat flux IGBT micro exchanger setupMeysenc, L. / Saludjian, L. / Bricard, A. / Rael, S. / Schaeffer, C. et al. | 1997
- 342
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Adhesion strength and microstructural evaluation in electroless Ni-P metallized AlN substrateChung-Daw Young, / Jenq-Gong Duh, et al. | 1997
- 355
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1/f noise in bismuth ruthenate based thick-film resistorsPeled, A. / Johanson, R.E. / Zloof, Y. / Kasap, S.O. et al. | 1997
- 361
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Three-dimensional visualization of multilayered assemblies using X-ray laminographyKalukin, A.R. / Sankaran, V. et al. | 1997
- 367
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EditorialPecht, M.G. et al. | 1997
- 368
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Electronic Components ObsolescenceCondra, L.W. / Anissipour, A.A. / Mayfield, D.D. / Pecht, M.G. et al. | 1997
- 372
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Papers Submitted for Publication| 1997
- 374
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Call for Papers -- 48th Electronic Components and Technology Conference| 1997
- 375
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Call for Papers -- 14th IEEE Semiconductor Thermal Measurement and Management Symposium| 1997
- 376
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IEEE 1997 International Conference on Innovative Systems in Silicon| 1997