0.4 mm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding (Unknown)
- New search for: Shui, Xiaoping
- New search for: Shui, Xiaoping
- New search for: Chung, D.D.L.
In:
Journal of electronic packaging
;
119
, 4
; 236-237
;
1997
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ISSN:
- Article (Journal) / Print
-
Title:0.4 mm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
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Contributors:Shui, Xiaoping ( author ) / Chung, D.D.L.
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Published in:Journal of electronic packaging ; 119, 4 ; 236-237
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Publisher:
- New search for: ASME
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Place of publication:New York, NY
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Publication date:1997
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:Unknown
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
- New search for: 770/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 119, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 218
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Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder JointsHeinrich, S.M. et al. | 1997
- 228
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Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging TechniqueAkay, H.U. et al. | 1997
- 236
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0.4 m Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference ShieldingShui, X. / Chung, D. D. L. et al. | 1997
- 236
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0.4 mm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference ShieldingShui, Xiaoping et al. | 1997
- 238
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Change of Address Form| 1997
- 239
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Transient Response of Microchannel Heat Sinks in a Silicon WaferRujano, J.R. et al. | 1997
- 247
-
Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation OperationHan, S. et al. | 1997
- 255
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Z-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite FilmLi, L. et al. | 1997
- 260
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The Impact of Interfacial Adhesion on PTH and Via Stress StateSubbarayan, G. et al. | 1997
- 267
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Call for Papers: Symposium on Structural Analysis in Microelectronics and Photonics; 1998 ASME Winter Annual Meeting| 1997
- 268
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Prediction of Solder Geometry for an Axisymmetric Through-Hole JointElkouh, A.F. et al. | 1997
- 275
-
Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated HeatersYu, D. et al. | 1997
- 281
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Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal LoadingTierney, J.W. et al. | 1997
- 288
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Development of a Two Matrix Model for Thermal Analysis of a Multichip ModuleButterbaugh, M.A. et al. | 1997
- 294
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Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I -- Unified Constitutive Model and CalibrationDesai, C.S. et al. | 1997
- 301
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Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II -- Unified Constitutive Models, Validation, and DesignDesai, C.S. et al. | 1997
- 310
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1997 Author Index: Volume 119| 1997
- 311
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First Announcement and Call for Papers: ISEPT'98; The Third International Symposium on Electronic Packaging Technology (Beijing, China)| 1997
- 316
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Information for Authors| 1997