Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring (English)
- New search for: Beaudry, C.L.
- New search for: Beaudry, C.L.
- New search for: Dukovic, J.O.
In:
The Electrochemical Society interface
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13
, 4
; 40-45
;
2004
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ISSN:
- Article (Journal) / Print
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Title:Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip Wiring
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Contributors:Beaudry, C.L. ( author ) / Dukovic, J.O.
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Published in:The Electrochemical Society interface ; 13, 4 ; 40-45
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Publisher:
- New search for: Soc.
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Place of publication:Pennington, NJ
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Publication date:2004
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 35.14
- Further information on Basic classification
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Keywords:
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Classification:
BKL: 35.14 Elektrochemie -
Source:
Table of contents – Volume 13, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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From the Editor| 2004
- 6
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Letters to the Editor| 2004
- 7
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From the President| 2004
- 8
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Hawaii Meeting Highlights| 2004
- 10
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Candidates for Society Office| 2004
- 12
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Society News| 2004
- 16
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People News| 2004
- 23
-
The Chalkboard| 2004
- 26
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Tech Highlights| 2004
- 27
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Our Featured Division: Electrodeposition| 2004
- 28
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Electrodeposition of Nanostructured Films Using Seff-Organizing TemplatesBartlett, P.N. et al. | 2004
- 28
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Electrodeposition of Nanostructured Films Using Self-Organizing TemplatesBartlett, P. N. et al. | 2004
- 34
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Chiral ElectrodepositionSwitzer, J.A. et al. | 2004
- 40
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Faraday in the Fab: A Look at Copper Plating Equipment for On-Chip WiringBeaudry, C.L. et al. | 2004
- 46
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Superfilling and the Curvature Enhanced Accelerator Coverage MechanismMoffat, T.P. et al. | 2004
- 56
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New Members| 2004
- 59
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Section News| 2004
- 61
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Awards| 2004
- 63
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Student News| 2004
- 65
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Summer Fellowship Reports| 2004
- 76
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Los Angeles, CA Call for Papers| 2004