Design and Implementation of Baluns at 60 GHz on LTCC (English)
- New search for: Rentsch, S.
- New search for: Rentsch, S.
- New search for: Müller, J.
In:
Journal of microelectronics and electronic packaging
;
4
, 4
; 181-185
;
2007
-
ISSN:
- Article (Journal) / Print
-
Title:Design and Implementation of Baluns at 60 GHz on LTCC
-
Contributors:Rentsch, S. ( author ) / Müller, J.
-
Published in:Journal of microelectronics and electronic packaging ; 4, 4 ; 181-185
-
Publisher:
- New search for: IMAPS
-
Place of publication:Washington, DC
-
Publication date:2007
-
ISSN:
-
ZDBID:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
- New search for: 53.52 / 53.52 / 52.00
- Further information on Basic classification
-
Classification:
-
Source:
Table of contents – Volume 4, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 130
-
Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS-Hershel at Liquid Helium TemperatureMerken, P. et al. | 2007
- 136
-
Development and Manufacture of a Linear 16-Pixel FIR Array-The PACS ModuleRichter, H. et al. | 2007
- 145
-
Testing of the Mars Exploration Rovers to Survive the Extreme Thermal EnvironmentsMan, K. et al. | 2007
- 155
-
Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120^oC)Ramesham, R. et al. | 2007
- 155
-
Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120(degree)C)Ramesham, R. et al. | 2007
- 167
-
Invited Papers (CICMT 2007) - LTCC-based Fluidic Components for Chemical ApplicationsThelemann, T. et al. | 2007
- 167
-
LTCC-based Fluidic Components for Chemical ApplicationsThelemann, T. / Fischer, M. / Gross, A. / Muller, J. et al. | 2007
- 173
-
Kinetic Modeling of LTCC Shrinkage: Effect of Alumina ContentEberstein, M. et al. | 2007
- 181
-
Design and Implementation of Baluns at 60 GHz on LTCCRentsch, S. et al. | 2007
- 186
-
Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint ReliabilityChena, C.I. et al. | 2007
-
Special Section on Packaging for Extreme Cold Environments - EditorialRamesham, Rajeshuni et al. | 2007