Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films (Unknown)
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- New search for: Zhao, X.
- New search for: Saka, M.
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In:
Journal of electronic packaging
;
132
, 2
; 21003-21004
;
2010
-
ISSN:
- Article (Journal) / Print
-
Title:Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
-
Contributors:
-
Published in:Journal of electronic packaging ; 132, 2 ; 21003-21004
-
Publisher:
- New search for: ASME
-
Place of publication:New York, NY
-
Publication date:2010
-
ISSN:
-
ZDBID:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:Unknown
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
- New search for: 770/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 132, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 21001
-
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and CorrelationWalsh, Patrick A. et al. | 2010
- 21002
-
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data CenterSamadiani, Emad et al. | 2010
- 21003
-
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al FilmsZhao, X. et al. | 2010
- 21004
-
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package AssemblyLiu, Xi et al. | 2010
- 21005
-
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe ArraysHarris, D. K. et al. | 2010
- 21006
-
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection SystemYang, Jin et al. | 2010
- 21007
-
Singularities at Solder Joint Interfaces and Their Effects on Fracture ModelsBhate, D. et al. | 2010
- 21008
-
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-ArchitectureKarajgikar, Saket et al. | 2010
- 21009
-
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD AnalysisSchmidt, Roger et al. | 2010
- 24501
-
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric CoolersPhan, Huy N. et al. | 2010