Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach (Unknown)
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In:
Journal of electronic packaging
;
136
, 2
; 21002-21002
;
2014
-
ISSN:
- Article (Journal) / Print
-
Title:Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach
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Contributors:
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Published in:Journal of electronic packaging ; 136, 2 ; 21002-21002
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Publisher:
- New search for: ASME
-
Place of publication:New York, NY
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Publication date:2014
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ISSN:
-
ZDBID:
-
Type of media:Article (Journal)
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Type of material:Print
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Language:Unknown
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
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Keywords:
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Classification:
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Source:
Table of contents – Volume 136, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 20301
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Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS| 2014
- 21001
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Thermal Performance of a Water-Cooled Microchannel Heat Sink With Grooves and ObstaclesXie, Yonghui et al. | 2014
- 21002
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Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design ApproachLi, Yubai et al. | 2014
- 21003
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Thermal Management of Time-Varying High Heat Flux Electronic DevicesDavid, T. et al. | 2014
- 21004
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Development of a Mini Heat Sink Model With Homogeneous Heat Transfer CapabilityZhou, J. F. et al. | 2014
- 21005
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An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/ProtrusionsZhang, Di et al. | 2014
- 21006
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Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip StacksMadhour, Yassir et al. | 2014
- 21007
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Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated CircuitsLorenzini-Gutierrez, Daniel et al. | 2014
- 21008
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Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power DistributionJie Liu, Jun et al. | 2014
- 24001
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Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated CircuitsKandlikar, Satish G. et al. | 2014
- 24002
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Advances in the Fabrication Processes and Applications of Wafer Level PackagingLiu, Peisheng et al. | 2014
- 24501
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Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat SinkSundén, Bengt et al. | 2014