Two-Phase Thermal Ground Planes: Technology Development and Parametric Results (English)
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In:
Journal of electronic packaging
;
137
, 1
; 10801
;
2015
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ISSN:
- Article (Journal) / Print
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Title:Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Contributors:
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Published in:Journal of electronic packaging ; 137, 1 ; 10801
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Publisher:
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Place of publication:New York, NY
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Publication date:2015
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Source:
Table of contents – Volume 137, Issue 1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 10801
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Two-Phase Thermal Ground Planes: Technology Development and Parametric ResultsBar-Cohen, Avram et al. | 2015
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Thermo-electric modeling of Nanotube-Based Environmental SensorsMartin, Michael J et al. | 2014
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Simplifying reliability testing of wire bonds using on-chip heater and pad resistance methodKim, S et al. | 2015
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Fast and accurate evaluation of cooling in data centersBhagwat, Harshad et al. | 2015
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Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat SinkAbdelkareem, Mohamed Lotfy Elsayed et al. | 2014
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On-chip power generation using ultrathin thermoelectric generatorsSullivan, Owen et al. | 2015
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Optimization of thermoelectric coolers for hotspot cooling in three-dimensional stacked chipsRedmond, Matthew et al. | 2015
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Experimental characterization of various cold aisle containment configurations for data centersSundaralingam, Vikneshan et al. | 2015
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Compact model-based microfluidic controller for energy efficient thermal management using single tier and three-dimensional stacked pin-fin enhanced microgapHan, Xuefei et al. | 2015
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Comparison of Electronic Component Durability under Uniaxial and Multiaxial Random VibrationsErnst, Matthew et al. | 2014
- 11010
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Stress–Strain Behavior of SAC305 at High Strain RatesLall, Pradeep et al. | 2015
- 11011
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Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data CenterArghode, Vaibhav K et al. | 2015
- 11012
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Modeling and Experimental Study of a Wire Clamp for Wire BondingWang, Fuliang et al. | 2015
- 14501
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Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental InvestigationLadani, Leila et al. | 2014
- 14502
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A new analytical method for calculating maximum junction temperature of packaged devices incorporating the temperature distribution at the base of the substrateLing, J.H.L et al. | 2015