Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture (English)
- New search for: Chang, Jing-Yao
- New search for: Chang, Jing-Yao
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- New search for: Chang, Tao-Chih
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In:
Journal of electronic packaging
;
137
, 3
;
2015
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ISSN:
- Article (Journal) / Print
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Title:Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
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Contributors:
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Published in:Journal of electronic packaging ; 137, 3
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Publisher:
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Place of publication:New York, NY
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Publication date:2015
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 33.38 / 53.54 / 53.50 / 53.09
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Source:
Table of contents – Volume 137, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film InterconnectionsTamakawa, Kinji et al. | 2015
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Multiscale Transient Thermal Analysis of MicroelectronicsKumar, Satish et al. | 2015
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Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot SpotsAbdoli, Abas et al. | 2015
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Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural ElectronicsRoberson, David A et al. | 2015
- 031005
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Individual Phase Mechanical Properties at Different Temperatures of Sn-Ag-Cu Lead-Free Solders Incorporating Special Pileup Effects Using NanoidentationSadiq, Muhammad / Lecomte, Jean-Sebastien / Cherkaoui, Mohammed et al. | 2015
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Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical CharacteristicsOkereke, R. I et al. | 2015
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Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking ArchitectureChang, Jing-Yao et al. | 2015
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Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field EnvironmentHathaway, A. A et al. | 2015
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Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer SubstrateKhan, Wasif T et al. | 2015
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Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric ModulesPhelan, Patrick E et al. | 2015
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Simulation of Secondary Contact to Generate Very High AccelerationsGilman, Kevin et al. | 2015
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Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale ModelLu, H.-L et al. | 2015
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Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric VehiclesYu, Wenhua et al. | 2015
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Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface MaterialsWong, Ching-Ping et al. | 2015
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Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal MeasurementsMaddox, John F et al. | 2015
- 031016
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Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump MetallizationXi, Jia / Zhai, Xinduo / Wang, Jun / Yang, Donglun / Ru, Mao / Xiao, Fei / Zhang, Li / Lai, Chi Ming et al. | 2015
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Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using NanoindentationLecomte, Jean-Sebastien et al. | 2015
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Reviewer Acknowledgment for the Journal of Electronic Packaging| 2015